公开(公告)号：US20130344714A1

公开(公告)日：2013-12-26

申请号：US13921402

申请日：2013-06-19

Applicant: FUJITSU LIMITED ,  FUJITSU COMPONENT LIMITED

Inventor： Takahiro KONDO ,  Manabu SHIMIZU ,  Yasushi MASUDA ,  Satoshi OHSAWA ,  Yoshihiro MORITA ,  Akira TAMURA

IPC: H05K7/20

CPC classification number: H05K7/20418 ,  H05K7/1069 ,  H05K7/2039

Abstract: A contact device that electrically connects a first substrate and a second substrate. The contact device includes: a contact that has electrical conductivity and elasticity, the contact including a first terminal that is contactable with a first pad provided on the first substrate and a second terminal that is contactable with a second pad provided on the second substrate, the first terminal and the second terminal being biased in a direction spreading a distance therebetween; and a sheet that has flexibility and heat dissipation, and holds the contact so that the first terminal is arranged opposite to one surface of the sheet and the second terminal is arranged opposite to another surface of the sheet.

Abstract translation: 一种电连接第一基板和第二基板的接触装置。 接触装置包括：具有导电性和弹性的触点，该触点包括可与设置在第一基板上的第一焊盘接触的第一端子和可与设置在第二基板上的第二焊盘接触的第二端子， 第一端子和第二端子沿着它们之间延伸的方向偏置; 以及具有柔性和散热的片材，并且保持接触，使得第一端子布置成与片材的一个表面相对，并且第二端子布置成与片材的另一表面相对。

公开(公告)号：US20150264810A1

公开(公告)日：2015-09-17

申请号：US14636356

申请日：2015-03-03

Applicant: FUJITSU LIMITED

Inventor： Shunji BABA ,  Manabu WATANABE ,  Kenji FUKUZONO ,  Satoshi OHSAWA ,  Tetsuro YAMADA ,  Akihiro WAKABAYASHI ,  Yasushi MASUDA ,  Yohei MIURA

IPC: H05K1/11 ,  H05K3/30 ,  H05K3/10 ,  H05K1/18

CPC classification number: H05K1/115 ,  H01L23/3675 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/167 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0263 ,  H05K1/11 ,  H05K1/144 ,  H05K1/184 ,  H05K1/185 ,  H05K3/22 ,  H05K3/325 ,  H05K3/40 ,  H05K3/4046 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/045 ,  H05K2201/10 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10659 ,  H05K2201/10666 ,  H05K2201/10878 ,  H05K2201/10901 ,  H05K2203/176 ,  Y10T29/4913 ,  Y10T29/49147

Abstract: A circuit board includes: a substrate; a through hole formed in the substrate; and a connection terminal provided in the through hole; wherein the connection terminal includes a pedestal portion provided within the through hole and a pin which is provided at a center of the pedestal portion and extends from the pedestal portion toward a first surface of the substrate, so that a first end portion protrudes from the first surface.

Abstract translation: 电路板包括：基板; 形成在基板中的通孔; 以及设置在通孔中的连接端子; 其中，所述连接端子包括设置在所述通孔内的基座部分和设置在所述基座部分的中心并且从所述基座部朝向所述基板的第一表面延伸的销，使得所述第一端部从所述第一端部突出， 表面。

公开(公告)号：US20130090021A1

公开(公告)日：2013-04-11

申请号：US13644165

申请日：2012-10-03

Applicant: FUJITSU COMPONENT LIMITED ,  FUJITSU LIMITED

Inventor： Junichi AKAMA ,  Toshihiro KUSAGAYA ,  Manabu SHIMIZU ,  Akira TAMURA ,  Yoshihiro MORITA ,  Yasushi MASUDA

IPC: H01R24/28 ,  H01R43/16 ,  H01R13/02

CPC classification number: H01R12/7082 ,  H01R12/73 ,  H01R13/2428 ,  Y10T29/49204

Abstract: A connection member to be inserted into a through-hole of a socket module that is electrically connected between an electronic component and a substrate, the connection member includes: a first end portion that is connected to the electronic component; a second end portion that is connected to the substrate; a plurality of upper flexure portions that correspond to projections of a waveform arranged near the electronic component; and a plurality of lower flexure portions that correspond to projections of the waveform arranged near the substrate; wherein the connection member is a single conductor member with elasticity and is formed in the shape of the waveform.

Abstract translation: 一种连接构件，其被插入电连接在电子部件和基板之间的插座模块的通孔中，所述连接构件包括：连接到所述电子部件的第一端部; 连接到所述基板的第二端部; 对应于布置在电子部件附近的波形的投影的多个上挠曲部; 以及对应于布置在基板附近的波形的投影的多个下弯曲部分; 其中所述连接构件是具有弹性的单个导体构件，并且形成为波形。