MEMS device with integrated optical element
    3.
    发明申请
    MEMS device with integrated optical element 有权
    具有集成光学元件的MEMS器件

    公开(公告)号:US20070285761A1

    公开(公告)日:2007-12-13

    申请号:US11656681

    申请日:2007-01-23

    IPC分类号: G02B26/00

    CPC分类号: G02B26/001

    摘要: MEMS devices are fabricated by a method that involves forming an optical element (e.g., etalon) over a substrate and then forming a light modulating element (e.g., interferometric modulator) over the optical element. In an embodiment, a support structure for the light modulating element is aligned with the underlying optical element to thereby alter the appearance of the support structure to a viewer. Such an optical element is separated from the support structure by one or more buffer layers.

    摘要翻译: 通过包括在衬底上形成光学元件(例如标准具)然后在光学元件上形成光调制元件(例如干涉式调制器)的方法制造MEMS器件。 在一个实施例中,用于光调制元件的支撑结构与下面的光学元件对准,从而将支撑结构的外观改变为观看者。 这样的光学元件通过一个或多个缓冲层与支撑结构分离。

    MEMS device with integrated optical element
    6.
    发明授权
    MEMS device with integrated optical element 有权
    具有集成光学元件的MEMS器件

    公开(公告)号:US07652814B2

    公开(公告)日:2010-01-26

    申请号:US11656681

    申请日:2007-01-23

    IPC分类号: G02B26/00

    CPC分类号: G02B26/001

    摘要: MEMS devices are fabricated by a method that involves forming an optical element (e.g., etalon) over a substrate and then forming a light modulating element (e.g., interferometric modulator) over the optical element. In an embodiment, a support structure for the light modulating element is aligned with the underlying optical element to thereby alter the appearance of the support structure to a viewer. Such an optical element is separated from the support structure by one or more buffer layers.

    摘要翻译: 通过包括在衬底上形成光学元件(例如标准具)然后在光学元件上形成光调制元件(例如干涉式调制器)的方法制造MEMS器件。 在一个实施例中,用于光调制元件的支撑结构与下面的光学元件对准,从而将支撑结构的外观改变为观看者。 这样的光学元件通过一个或多个缓冲层与支撑结构分离。

    Methods for etching layers within a MEMS device to achieve a tapered edge
    7.
    发明授权
    Methods for etching layers within a MEMS device to achieve a tapered edge 失效
    用于蚀刻MEMS器件内的层以实现锥形边缘的方法

    公开(公告)号:US07660058B2

    公开(公告)日:2010-02-09

    申请号:US11506770

    申请日:2006-08-18

    IPC分类号: H01L21/302 B44C1/22

    摘要: Certain MEMS devices include layers patterned to have tapered edges. One method for forming layers having tapered edges includes the use of an etch leading layer. Another method for forming layers having tapered edges includes the deposition of a layer in which the upper portion is etchable at a faster rate than the lower portion. Another method for forming layers having tapered edges includes the use of multiple iterative etches. Another method for forming layers having tapered edges includes the use of a liftoff mask layer having an aperture including a negative angle, such that a layer can be deposited over the liftoff mask layer and the mask layer removed, leaving a structure having tapered edges.

    摘要翻译: 某些MEMS器件包括被图案化以具有渐缩边缘的层。 用于形成具有渐缩边缘的层的一种方法包括使用蚀刻引导层。 用于形成具有锥形边缘的层的另一种方法包括沉积一层,其中上部可以比下部更快的速度进行刻蚀。 用于形成具有渐缩边缘的层的另一种方法包括使用多个迭代蚀刻。 用于形成具有锥形边缘的层的另一种方法包括使用具有包括负角度的孔的剥离掩模层,使得可以在剥离掩模层上沉积一层,并且去除掩模层,留下具有渐缩边缘的结构。

    Methods for etching layers within a MEMS device to achieve a tapered edge
    8.
    发明申请
    Methods for etching layers within a MEMS device to achieve a tapered edge 失效
    用于蚀刻MEMS器件内的层以实现锥形边缘的方法

    公开(公告)号:US20080218840A1

    公开(公告)日:2008-09-11

    申请号:US11506770

    申请日:2006-08-18

    IPC分类号: G02F1/01 B29D11/00

    摘要: Certain MEMS devices include layers patterned to have tapered edges. One method for forming layers having tapered edges includes the use of an etch leading layer. Another method for forming layers having tapered edges includes the deposition of a layer in which the upper portion is etchable at a faster rate than the lower portion. Another method for forming layers having tapered edges includes the use of multiple iterative etches. Another method for forming layers having tapered edges includes the use of a liftoff mask layer having an aperture including a negative angle, such that a layer can be deposited over the liftoff mask layer and the mask layer removed, leaving a structure having tapered edges.

    摘要翻译: 某些MEMS器件包括被图案化以具有渐缩边缘的层。 用于形成具有渐缩边缘的层的一种方法包括使用蚀刻引导层。 用于形成具有锥形边缘的层的另一种方法包括沉积一层,其中上部可以比下部更快的速度进行刻蚀。 用于形成具有渐缩边缘的层的另一种方法包括使用多个迭代蚀刻。 用于形成具有锥形边缘的层的另一种方法包括使用具有包括负角度的孔的剥离掩模层,使得可以在剥离掩模层上沉积一层,并且去除掩模层,留下具有渐缩边缘的结构。

    MEMS DEVICE AND INTERCONNECTS FOR SAME
    9.
    发明申请
    MEMS DEVICE AND INTERCONNECTS FOR SAME 失效
    MEMS器件及其相互连接

    公开(公告)号:US20100202038A1

    公开(公告)日:2010-08-12

    申请号:US12764454

    申请日:2010-04-21

    IPC分类号: G02B26/00 B05D5/12 C23F1/02

    CPC分类号: G02B26/001

    摘要: A microelectromechanical systems device having an electrical interconnect connected to at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a movable layer of the device. A thin film, particularly formed of molybdenum, is provided underneath the electrical interconnect. The movable layer preferably comprises aluminum.

    摘要翻译: 一种微机电系统装置,其具有连接到所述装置内的电极和可移动​​层中的至少一个的电互连。 电互连的至少一部分由与器件的可移动层相同的材料形成。 特别是由钼形成的薄膜被提供在电互连下面。 可移动层优选包括铝。

    Interferometric modulators with thin film transistors
    10.
    发明授权
    Interferometric modulators with thin film transistors 有权
    具有薄膜晶体管的干涉式调制器

    公开(公告)号:US07256922B2

    公开(公告)日:2007-08-14

    申请号:US10883902

    申请日:2004-07-02

    IPC分类号: G02F1/03

    CPC分类号: G02B26/001 G02B26/0841

    摘要: A modulator has a transparent substrate with a first surface. At least one interferometric modulator element resides on the first surface. At least one thin film circuit component electrically connected to the element resides on the surface. When more than one interferometric element resides on the first surface, there is at least one thin film circuit component corresponding to each element residing on the first surface.

    摘要翻译: 调制器具有带有第一表面的透明衬底。 至少一个干涉式调制器元件驻留在第一表面上。 电连接到元件的至少一个薄膜电路部件驻留在表面上。 当多于一个干涉测量元件位于第一表面上时,存在至少一个对应于驻留在第一表面上的每个元件的薄膜电路部件。