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1.发明授权Assembly of an integrated device enabling a facilitated fluidic connection to regions of the device 有权一种集成的装置，其能够实现与设备的区域的便利的流体连接公开(公告)号：US07421904B2
公开(公告)日：2008-09-09
申请号：US11768090
申请日：2007-06-25
IPC分类号： B01L3/00
CPC分类号： G01L19/0038
摘要： Described herein is an assembly of an integrated device and of a cap coupled to the integrated device; the integrated device is provided with at least a first and a second region to be fluidically accessed from outside, and the cap has an outer portion provided with at least a first and a second inlet port in fluid communication with the first and second regions. In particular, the first and second regions are arranged on a first outer face, or on respective adjacent outer faces, of the integrated device, and an interface structure is set between the integrated device and the outer portion of the cap, and is provided with a channel arrangement for routing the first and second regions towards the first and second inlets.
摘要翻译： 这里描述的是集成装置和联接到集成装置的盖的组件; 集成装置设置有至少第一和第二区域以从外部流体地访问，并且帽具有至少设置有与第一和第二区域流体连通的第一入口和第二入口的外部。 特别地，第一和第二区域布置在集成装置的第一外表面或相应的相邻外表面上，并且界面结构设置在集成装置和盖的外部之间，并且设置有 用于将第一和第二区域朝向第一和第二入口路由的通道布置。
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2.发明申请ASSEMBLY OF AN INTEGRATED DEVICE ENABLING A FACILITATED FLUIDIC CONNECTION TO REGIONS OF THE DEVICE 有权集成装置的装配使得装置的区域的流体流动连接公开(公告)号：US20080011090A1
公开(公告)日：2008-01-17
申请号：US11768090
申请日：2007-06-25
IPC分类号： G01L9/00
CPC分类号： G01L19/0038
摘要： Described herein is an assembly of an integrated device and of a cap coupled to the integrated device; the integrated device is provided with at least a first and a second region to be fluidically accessed from outside, and the cap has an outer portion provided with at least a first and a second inlet port in fluid communication with the first and second regions. In particular, the first and second regions are arranged on a first outer face, or on respective adjacent outer faces, of the integrated device, and an interface structure is set between the integrated device and the outer portion of the cap, and is provided with a channel arrangement for routing the first and second regions towards the first and second inlets.
摘要翻译： 这里描述的是集成装置和联接到集成装置的盖的组件; 集成装置设置有至少第一和第二区域以从外部流体地访问，并且帽具有至少设置有与第一和第二区域流体连通的第一入口和第二入口的外部。 特别地，第一和第二区域布置在集成装置的第一外表面或相应的相邻外表面上，并且界面结构设置在集成装置和盖的外部之间，并且设置有 用于将第一和第二区域朝向第一和第二入口路由的通道布置。
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3.发明授权Encapsulated photomultiplier device of semiconductor material, for use, for example, in machines for performing positron-emission tomography 有权半导体材料的封装光电倍增器装置，例如用于进行正电子发射断层摄影的机器中公开(公告)号：US09188683B2
公开(公告)日：2015-11-17
申请号：US13303731
申请日：2011-11-23
IPC分类号： G01T1/20 , H01L27/146
CPC分类号： G01T1/2018 , H01L27/14658 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： An embodiment of a photomultiplier device is formed by a base substrate of insulating organic material forming a plurality of conductive paths and carrying a plurality of chips of semiconductor material. Each chip integrates a plurality of photon detecting elements, such as Geiger-mode avalanche diodes, and is bonded on a first side of the base substrate. Couplings for photon-counting and image-reconstruction units are formed on a second side of the base substrate. The first side of the base substrate is covered with a transparent encapsulating layer of silicone resin, which, together with the base substrate, bestows stiffness on the photomultiplier device, preventing warpage, and covers and protects the chips.
摘要翻译： 光电倍增器装置的一个实施例由形成多个导电路径并承载多个半导体材料芯片的绝缘有机材料的基底形成。 每个芯片集成了多个光子检测元件，例如盖革模式雪崩二极管，并且被结合在基底基板的第一侧上。 用于光子计数和图像重建单元的耦合器形成在基底衬底的第二侧上。 基底基板的第一面覆盖有硅树脂的透明封装层，其与基底基板一起在光电倍增器装置上赋予刚度，防止翘曲，并且覆盖和保护芯片。
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4.发明申请MANUFACTURING METHOD OF AN ELECTRONIC DEVICE INCLUDING OVERMOLDED MEMS DEVICES 有权包括过度MEMS器件的电子器件的制造方法公开(公告)号：US20100297797A1
公开(公告)日：2010-11-25
申请号：US12848730
申请日：2010-08-02
IPC分类号： H01L21/56
CPC分类号： B81C1/00309 , B81B2201/0264 , B81B2201/058 , B81C2203/0154 , H01L2224/48091 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A method manufactures an electronic device comprising a MEMS device overmolded in a protective casing. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated, and is sensitive, through a membrane, to chemical/physical variations of a fluid. Prior to the molding step, at least one resin layer is formed on at least one region overlying the active surface in correspondence with the membrane. After, at least one portion of at least one resin layer is removed from at least one region, so that in the region an opening is formed, through which the MEMS device is activated from the outside of the protective casing.
摘要翻译： 一种方法制造包括在保护壳体中包覆成型的MEMS器件的电子器件。 MEMS器件包括活性表面，其中MEMS器件的一部分通过膜整合并且对于液体的化学/物理变化是敏感的。 在模塑步骤之前，在与膜相对应的至少一个覆盖有源表面的区域上形成至少一个树脂层。 之后，从至少一个区域去除至少一个树脂层的至少一部分，使得在该区域中形成开口，通过该开口，MEMS器件从保护壳体的外部被激活。
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5.发明申请Semiconductor package substrate and methods for forming same, In particular for mems devices 有权半导体封装基板及其形成方法，特别适用于mems器件公开(公告)号：US20080128891A1
公开(公告)日：2008-06-05
申请号：US11879239
申请日：2007-07-16
申请人： Federico Giovanni Ziglioli , Giovanni Graziosi , Mark Andrew Shaw , Mario Francesco Cortese , Conrad Max Cachia
发明人： Federico Giovanni Ziglioli , Giovanni Graziosi , Mark Andrew Shaw , Mario Francesco Cortese , Conrad Max Cachia
IPC分类号： H01L23/055 , H01L21/58
CPC分类号： B81B7/007 , B81B7/0048 , B81B2207/096 , B81C2203/0154 , H01L23/49827 , H01L23/49838 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor package substrate suitable for supporting a damage-sensitive device and a package substrate core having an upper and a lower surface. At least one pair of metal layers coats the upper and lower surfaces of the package substrate core. One pair of solder mask layers coats the outer metal layers of the at least one pair of metal layers. A plurality of vias is formed across the package substrate core and the at least one pair of metal layers. Advantageously, the plurality of vias is substantially distributed according to a homogeneous pattern in an area that is to be covered by the damage-sensitive device. A method for the production of such semiconductor package substrate is also described.
摘要翻译： 一种适于支撑损伤敏感器件的半导体封装衬底和具有上表面和下表面的封装衬底芯。 至少一对金属层涂覆封装衬底芯的上表面和下表面。 一对焊接掩模层涂覆至少一对金属层的外金属层。 跨越封装衬底芯和至少一对金属层形成多个通孔。 有利地，多个通孔根据待被损伤敏感装置覆盖的区域中的均匀图案基本上分布。 还描述了制造这种半导体封装基板的方法。
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6.发明授权Semiconductor package substrate and methods for forming same, in particular for MEMS devices 有权半导体封装基板及其形成方法，特别是用于MEMS器件公开(公告)号：US08633583B2
公开(公告)日：2014-01-21
申请号：US11879239
申请日：2007-07-16
申请人： Federico Giovanni Ziglioli , Giovanni Graziosi , Mark Andrew Shaw , Mario Francesco Cortese , Conrad Max Cachia
发明人： Federico Giovanni Ziglioli , Giovanni Graziosi , Mark Andrew Shaw , Mario Francesco Cortese , Conrad Max Cachia
IPC分类号： H01L23/04
CPC分类号： B81B7/007 , B81B7/0048 , B81B2207/096 , B81C2203/0154 , H01L23/49827 , H01L23/49838 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor package substrate suitable for supporting a damage-sensitive device and a package substrate core having an upper and a lower surface. At least one pair of metal layers coats the upper and lower surfaces of the package substrate core. One pair of solder mask layers coats the outer metal layers of the at least one pair of metal layers. A plurality of vias is formed across the package substrate core and the at least one pair of metal layers. Advantageously, the plurality of vias is substantially distributed according to a homogeneous pattern in an area that is to be covered by the damage-sensitive device. A method for the production of such semiconductor package substrate is also described.
摘要翻译： 一种适于支撑损伤敏感器件的半导体封装衬底和具有上表面和下表面的封装衬底芯。 至少一对金属层涂覆封装衬底芯的上表面和下表面。 一对焊接掩模层涂覆至少一对金属层的外金属层。 跨越封装衬底芯和至少一对金属层形成多个通孔。 有利地，多个通孔根据待被损伤敏感装置覆盖的区域中的均匀图案基本上分布。 还描述了制造这种半导体封装基板的方法。
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7.发明申请MANUFACTURING METHOD OF AN ELECTRONIC DEVICE INCLUDING OVERMOLDED MEMS DEVICES 审中-公开包括过度MEMS器件的电子器件的制造方法公开(公告)号：US20090115008A1
公开(公告)日：2009-05-07
申请号：US12260910
申请日：2008-10-29
CPC分类号： B81C1/00309 , B81B2201/0264 , B81B2201/058 , B81C2203/0154 , H01L2224/48091 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A method manufactures an electronic device comprising a MEMS device overmolded in a protective casing. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated, and is sensitive, through a membrane, to chemical/physical variations of a fluid. Prior to the molding step, at least one resin layer is formed on at least one region overlying the active surface in correspondence with the membrane. After, at least one portion of at least one resin layer is removed from at least one region, so that in the region an opening is formed, through which the MEMS device is activated from the outside of the protective casing.
摘要翻译： 一种方法制造包括在保护壳体中包覆成型的MEMS器件的电子器件。 MEMS器件包括活性表面，其中MEMS器件的一部分通过膜整合并且对于液体的化学/物理变化是敏感的。 在模塑步骤之前，在与膜相对应的至少一个覆盖有源表面的区域上形成至少一个树脂层。 之后，从至少一个区域去除至少一个树脂层的至少一部分，使得在该区域中形成开口，通过该开口，MEMS器件从保护壳体的外部被激活。
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8.发明授权Manufacturing method of an electronic device including overmolded MEMS devices 有权包括模制的MEMS器件的电子器件的制造方法公开(公告)号：US08324007B2
公开(公告)日：2012-12-04
申请号：US12848730
申请日：2010-08-02
IPC分类号： H01L21/00
CPC分类号： B81C1/00309 , B81B2201/0264 , B81B2201/058 , B81C2203/0154 , H01L2224/48091 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A method manufactures an electronic device comprising a MEMS device overmolded in a protective casing. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated, and is sensitive, through a membrane, to chemical/physical variations of a fluid. Prior to the molding step, at least one resin layer is formed on at least one region overlying the active surface in correspondence with the membrane. After, at least one portion of at least one resin layer is removed from at least one region, so that in the region an opening is formed, through which the MEMS device is activated from the outside of the protective casing.
摘要翻译： 一种方法制造包括在保护壳体中包覆成型的MEMS器件的电子器件。 MEMS器件包括活性表面，其中MEMS器件的一部分通过膜整合并且对于液体的化学/物理变化是敏感的。 在模塑步骤之前，在与膜相对应的至少一个覆盖有源表面的区域上形成至少一个树脂层。 之后，从至少一个区域去除至少一个树脂层的至少一部分，使得在该区域中形成开口，通过该开口，MEMS器件从保护壳体的外部被激活。
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9.发明申请ENCAPSULATED MICRO-ELECTRO-MECHANICAL DEVICE, IN PARTICULAR A MEMS ACOUSTIC TRANSDUCER 有权封装的微电子机械装置，特别是MEMS声学传感器公开(公告)号：US20110274299A1
公开(公告)日：2011-11-10
申请号：US13102831
申请日：2011-05-06
CPC分类号： B81B7/0064 , B81B2201/0257 , B81C1/00333 , H01L2224/48091 , H01L2224/48137 , H01L2224/48464 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： An encapsulated micro-electro-mechanical device, wherein a MEMS chip is encapsulated by a package formed by a first, a second, and a third substrates that are bonded together. The first substrate has a main surface bearing the MEMS chip, the second substrate is bonded to the first substrate and defines a chamber surrounding the MEMS chip, and the third substrate is bonded to the second substrate and upwardly closes the chamber. A grid or mesh structure of electrically conductive material is formed in or on the third substrate and overlies the MEMS chip; the second substrate has a conductive connection structure coating the walls of the chamber, and the first substrate incorporates an electrically conductive region, which forms, together with the conductive layer and the grid or mesh structure, a Faraday cage.
摘要翻译： 一种封装的微机电装置，其中MEMS芯片由通过第一，第二和第三基板形成的封装封装，所述第一，第二和第三基板被结合在一起。 第一基板具有承载MEMS芯片的主表面，第二基板结合到第一基板并且限定围绕MEMS芯片的腔室，并且第三基板结合到第二基板并向上关闭腔室。 在第三衬底中或第三衬底上形成导电材料的栅格或网状结构，并覆盖在MEMS芯片上; 第二基板具有涂覆室的壁的导电连接结构，并且第一基板包括与导电层和网格或网状结构一起形成法拉第笼的导电区域。
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公开(公告)号：US06712528B2
公开(公告)日：2004-03-30
申请号：US10185839
申请日：2002-06-27
IPC分类号： G02B630
CPC分类号： G02B6/4237 , G02B6/424 , G02B6/4257 , G02B6/4265 , G02B6/4267 , G02B6/4271
摘要： The invention relates to an optical assembly for opto-electronic packages comprising an optical fibre secured on the underside of an elongated support member in optical alignment with an opto-electronic device, wherein said support member is affixed to an aligning member, which in turn is affixed, e.g., by laser welding, to a welding platform. In a preferred embodiment, the elongated support member is a planar parallelepiped. In a further preferred embodiment, the elongated support member is a parallelepiped with an axially extended slot, in which the optical fibre is secured with its longitudinal axis substantially parallel to the axially extended slot.
摘要翻译： 本发明涉及一种用于光电子封装的光学组件，其包括固定在细长支撑构件的下侧上的光纤，该光学组件与光电装置光学对准，其中所述支撑构件固定在对准构件上， 例如通过激光焊接固定在焊接平台上。 在优选实施例中，细长的支撑构件是平行平行六面体的平面。 在另一优选实施例中，细长支撑构件是平行六面体具有轴向延伸的槽，其中光纤被固定，其纵向轴线基本上平行于轴向延伸的槽。
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