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公开(公告)号:US20190190608A1
公开(公告)日:2019-06-20
申请号:US16226040
申请日:2018-12-19
申请人: Finisar Corporation
发明人: Nicolae CHITICA , Jürgen HAUENSCHILD , Theron JONES , David NIDELIUS , Lennart LUNDQVIST , Elisabeth KÄLLÉN , Odd STEIJER , Marek CHACINSKI , Åsa JOHANSSON , Andrei KAIKKONEN
CPC分类号: H04B10/40 , G02B6/4273 , H01S5/02248 , H01S5/02296 , H01S5/02438 , H01S5/02446 , H01S5/02469 , H01S5/0261 , H01S5/0262 , H01S5/06226 , H01S5/06817 , H01S5/423 , H04B10/503
摘要: An integrated optical transceiver, comprising a laser component, comprising an array of VCSEL diodes formed on a laser diode substrate; a laser driving component, comprising laser diode driving circuitry formed on a laser driving circuitry substrate; a photodiode component, comprising an array of photodiodes formed on a photodiode substrate; and a photodiode driving component, comprising photodiode driving circuitry formed on a photodiode driving circuitry substrate; a first heat sink comprising a connected piece of material to transport excess heat away from the integrated optical transceiver and connected to both the laser and photodiode driving components; and an electrically insulating material separating the photodiode substrate from the first heat sink and being air or dielectric material with a relative dielectric constant ε
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公开(公告)号:US20190140335A1
公开(公告)日:2019-05-09
申请号:US16085533
申请日:2017-03-15
申请人: FINISAR CORPORATION
发明人: Andrei KAIKKONEN , Robert Monroe SMITH , Lennart Per Olof LUNDQVIST , Lars-Goete SVENSON , Marek Grzegorz CHACINSKI
摘要: A carrier layout comprising a substrate comprising a ground plane layer and a coplanar waveguide interconnect disposed onto the substrate. The coplanar waveguide interconnect comprises a pair of coplanar conductors and a central conductor disposed between the pair of coplanar conductors. The coplanar conductors of the pair are electrically connected to each other by at least one conducting island that is isolated from the ground plane layer. The present invention also provides an interconnect structure for coupling an electronic unit to an optical device disposed on a substrate having a ground plane layer, the interconnect structure comprising a pair of coplanar conductors and a central conductor disposed between the pair of coplanar conductors. The conductors of the pair are electrically connected by at least one conducting island that is isolated from the ground plane layer.
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