SYSTEM FOR THERMAL CYCLING OF MICROFLUIDIC SAMPLES
    1.
    发明申请
    SYSTEM FOR THERMAL CYCLING OF MICROFLUIDIC SAMPLES 审中-公开
    微流体样品热循环系统

    公开(公告)号:US20160114327A1

    公开(公告)日:2016-04-28

    申请号:US14864491

    申请日:2015-09-24

    IPC分类号: B01L7/00

    摘要: A thermal cycler for a microfluidic device includes a controller operable to provide a series of electrical signals, a heat sink, and a heating element in thermal communication with the heat sink and operable to receive the series of electrical signals from the controller. The thermal cycler also includes a thermal chuck in thermal communication with the heating element. The thermal chuck comprises a heating surface operable to make thermal contact with the microfluidic device. The heating surface is characterized by a temperature ramp rate between 2.5 degrees Celsius per second and 5.5 degrees Celsius per second and a temperature difference between a first portion of the heating surface supporting a first portion of the microfluidic device and a second portion of the heating surface supporting a second portion of the microfluidic device is less than 0.25° C.

    摘要翻译: 用于微流体装置的热循环仪包括控制器,其可操作以提供与散热器热连通的一系列电信号,散热器和加热元件,并可操作以从控制器接收一系列电信号。 热循环仪还包括与加热元件热连通的热卡盘。 热卡盘包括可操作以与微流体装置进行热接触的加热表面。 加热表面的特征在于每秒2.5摄氏度和5.5摄氏度/秒之间的温度升高速率,并且支撑微流体装置的第一部分的加热表面的第一部分与加热表面的第二部分之间的温度差 支撑微流体装置的第二部分小于0.25℃

    System for thermal cycling of microfluidic samples

    公开(公告)号:US10226770B2

    公开(公告)日:2019-03-12

    申请号:US14864491

    申请日:2015-09-24

    摘要: A thermal cycler for a microfluidic device includes a controller operable to provide a series of electrical signals, a heat sink, and a heating element in thermal communication with the heat sink and operable to receive the series of electrical signals from the controller. The thermal cycler also includes a thermal chuck in thermal communication with the heating element. The thermal chuck comprises a heating surface operable to make thermal contact with the microfluidic device. The heating surface is characterized by a temperature ramp rate between 2.5 degrees Celsius per second and 5.5 degrees Celsius per second and a temperature difference between a first portion of the heating surface supporting a first portion of the microfluidic device and a second portion of the heating surface supporting a second portion of the microfluidic device is less than 0.25° C.