Bipolar transistor having a self emitter contact aligned
    2.
    发明授权
    Bipolar transistor having a self emitter contact aligned 失效
    具有自发射体触点对准的双极晶体管

    公开(公告)号:US5548141A

    公开(公告)日:1996-08-20

    申请号:US441847

    申请日:1995-05-16

    摘要: A method of self aligning an emitter contact includes forming a base layer (18) on a portion of a collector layer (16). An interface layer (22) is formed on the base layer (18) such that a portion of the base layer (18) remains exposed. An emitter layer (24) is formed on the collector layer (16), the interface layer (22), and the exposed portion of the base layer (18). An emitter cap layer (26) is formed on the emitter layer (24) over the previously exposed area of the base layer (18). An insulating layer (28) is formed on the interface layer (22). An emitter contact (36) is formed on the emitter cap layer (26) at the previously exposed area of the base layer (18). The insulating layer (28) isolates the emitter contact (36) from the base layer (18) and a subsequently formed base contact (38). The insulating layer (28) ensures isolation between the emitter contact (36) and the base contact (38) despite misalignment of the emitter contact (36) during formation.

    摘要翻译: 自发对准发射极接触的方法包括在集电极层(16)的一部分上形成基极层(18)。 界面层(22)形成在基底层(18)上,使得基底层(18)的一部分保持暴露。 发射极层(24)形成在集电层(16),界面层(22)和基层(18)的露出部分上。 在基底层(18)的预先暴露的区域上的发射极层(24)上形成发射极覆盖层(26)。 绝缘层(28)形成在界面层(22)上。 在基底层(18)的预先暴露的区域处,在发射极盖层(26)上形成发射极触点(36)。 绝缘层(28)将发射极触点(36)与基底层(18)和随后形成的基部触点(38)隔离开来。 绝缘层(28)确保发射极触点(36)和基极触点(38)之间的隔离,尽管发射极触点(36)在形成期间未对准。

    Method of fabricating a semiplanar heterojunction bipolar transistor
    3.
    发明授权
    Method of fabricating a semiplanar heterojunction bipolar transistor 失效
    制造半平面异质结双极晶体管的方法

    公开(公告)号:US5420052A

    公开(公告)日:1995-05-30

    申请号:US230357

    申请日:1994-04-19

    摘要: A method of fabricating a semiplanar heterojunction bipolar transistor (10) includes forming a subcollector layer (12) and a collector layer (16) onto a substrate layer (14). A collector implant plug (18) is selectively implanted to connect the subcollector layer (12) to the surface of the heterojunction bipolar transistor (10). A second epitaxial growth process causes a base layer (22), an emitter layer (24), and an emitter cap layer (26) to form on the collector layer (16) and the collector implant plug (18). By this process, the base layer (22) is not exposed to subsequent harmful fabrication steps. A base plug region (28) is selectively implanted to connect the base layer (22) to the surface of the heterojunction bipolar transistor (10). A base contact (32) and an emitter contact (30) are selectively formed within the heterojunction region on the base plug region (28) and the emitter cap layer (26), respectively. Lateral parasitic diodes between the base contact (32) and the emitter contact (30) are etched away to isolate the base contact (32) from the emitter contact (30). The emitter cap layer (26), the emitter layer (24), and the base layer (22) are removed from the vicinity of the collector implant plug (18) to allow formation of the collector contact (34).

    摘要翻译: 制造半平面异质结双极晶体管(10)的方法包括在衬底层(14)上形成子集电极层(12)和集电极层(16)。 选择性地注入集电极注入插头(18)以将子集电极层(12)连接到异质结双极晶体管(10)的表面。 第二外延生长工艺使得在集电极层(16)和集电极植入插头(18)上形成基极层(22),发射极层(24)和发射极盖层(26)。 通过该过程,基层(22)不暴露于随后的有害制造步骤。 选择性地注入基座区域(28)以将基极层(22)连接到异质结双极晶体管(10)的表面。 基极触点(32)和发射极触点(30)分别选择性地形成在基插塞区域(28)和发射极盖层(26)上的异质结区域内。 基极触点(32)和发射极触点(30)之间的侧向寄生二极管被蚀刻掉以将基极触点(32)与发射极触点(30)隔离。 发射极帽层(26),发射极层(24)和基底层(22)从集电极植入插头(18)的附近被去除,以形成集电极触点(34)。

    Enhanced performance bipolar transistor process
    4.
    发明授权
    Enhanced performance bipolar transistor process 失效
    增强性能双极晶体管工艺

    公开(公告)号:US5407842A

    公开(公告)日:1995-04-18

    申请号:US255502

    申请日:1994-06-08

    摘要: This is a method of forming a bipolar transistor comprising: forming a subcollector layer, having a doping type and a doping level, on a substrate; forming a first layer, of the same doping type and a lower doping level than the subcollector layer, over the subcollector layer; increasing the doping level of first and second regions of the first layer; forming a second layer, of the same doping type and a lower doping level than the subcollector layer, over the first layer; increasing the doping level of a first region of the second layer which is over the first region of the first layer, whereby the subcollector layer, the first region of the first layer and the first region of the second layer are the collector of the transistor; forming a base layer over the second layer of an opposite doping type than the subcollector layer; and forming an emitter layer of the same doping type as the subcollector layer over the base layer. Other devices and methods are also disclosed.

    摘要翻译: 这是一种形成双极晶体管的方法,包括:在衬底上形成具有掺杂类型和掺杂水平的子集电极层; 在子集电极层上形成与子集电极层相同的掺杂类型和较低掺杂水平的第一层; 增加第一层的第一和第二区域的掺杂水平; 在第一层上形成与子集电极层相同的掺杂类型和较低掺杂水平的第二层; 增加在第一层的第一区域之上的第二层的第一区域的掺杂水平,由此子集电极层,第一层的第一区域和第二层的第一区域是晶体管的集电极; 在与所述子集电极层相反的掺杂类型的第二层上形成基底层; 并且在基底层上形成与子集电极层相同的掺杂类型的发射极层。 还公开了其它装置和方法。

    Enhanced performance bipolar transistor process
    5.
    发明授权
    Enhanced performance bipolar transistor process 失效
    增强性能双极晶体管工艺

    公开(公告)号:US5369042A

    公开(公告)日:1994-11-29

    申请号:US26886

    申请日:1993-03-05

    摘要: This is a method of forming a bipolar transistor comprising: forming a subcollector layer, having a doping type and a doping level, on a substrate; forming a first layer, of the same doping type and a lower doping level than the subcollector layer, over the subcollector layer; increasing the doping level of first and second regions of the first layer; forming a second layer, of the same doping type and a lower doping level than the subcollector layer, over the first layer; increasing the doping level of a first region of the second layer which is over the first region of the first layer, whereby the subcollector layer, the first region of the first layer and the first region of the second layer are the collector of the transistor; forming a base layer over the second layer of an opposite doping type than the subcollector layer; and forming an emitter layer of the same doping type as the subcollector layer over the base layer. Other devices and methods are also disclosed.

    摘要翻译: 这是一种形成双极晶体管的方法,包括:在衬底上形成具有掺杂类型和掺杂水平的子集电极层; 在子集电极层上形成与子集电极层相同的掺杂类型和较低掺杂水平的第一层; 增加第一层的第一和第二区域的掺杂水平; 在第一层上形成与子集电极层相同的掺杂类型和较低掺杂水平的第二层; 增加在第一层的第一区域之上的第二层的第一区域的掺杂水平,由此子集电极层,第一层的第一区域和第二层的第一区域是晶体管的集电极; 在与所述子集电极层相反的掺杂类型的第二层上形成基底层; 并且在基底层上形成与子集电极层相同的掺杂类型的发射极层。 还公开了其它装置和方法。

    Method of self aligning an emitter contact in a heterojunction bipolar
transistor
    6.
    发明授权
    Method of self aligning an emitter contact in a heterojunction bipolar transistor 失效
    在异质结双极晶体管中自发对准发射极接触的方法

    公开(公告)号:US5436181A

    公开(公告)日:1995-07-25

    申请号:US229044

    申请日:1994-04-18

    摘要: A method of self aligning an emitter contact includes forming a base layer (18) on a portion of a collector layer (16). An interface layer (22) is formed on the base layer (18) such that a portion of the base layer (18) remains exposed. An emitter layer (24) is formed on the collector layer (16), the interface layer (22), and the exposed portion of the base layer (18). An emitter cap layer (26) is formed on the emitter layer (24) over the previously exposed area of the base layer (18). An insulating layer (28) is formed on the interface layer (22). An emitter contact (36) is formed on the emitter cap layer (26) at the previously exposed area of the base layer (18). The insulating layer (28) isolates the emitter contact (36) from the base layer (18) and a subsequently formed base contact (38). The insulating layer (28) ensures isolation between the emitter contact ( 36) and the base contact (38) despite misalignment of the emitter contact (36) during formation.

    摘要翻译: 自发对准发射极接触的方法包括在集电极层(16)的一部分上形成基极层(18)。 界面层(22)形成在基底层(18)上,使得基底层(18)的一部分保持暴露。 发射极层(24)形成在集电层(16),界面层(22)和基层(18)的露出部分上。 在基底层(18)的预先暴露的区域上的发射极层(24)上形成发射极覆盖层(26)。 绝缘层(28)形成在界面层(22)上。 在基底层(18)的预先暴露的区域处,在发射极盖层(26)上形成发射极触点(36)。 绝缘层(28)将发射极触点(36)与基底层(18)和随后形成的基部触点(38)隔离开来。 绝缘层(28)确保发射极触点(36)和基极触点(38)之间的隔离,尽管发射极触点(36)在形成期间未对准。

    Method of fabricating power VFET gate-refill
    8.
    发明授权
    Method of fabricating power VFET gate-refill 失效
    制造功率VFET栅极补充的方法

    公开(公告)号:US5342795A

    公开(公告)日:1994-08-30

    申请号:US153121

    申请日:1993-11-15

    摘要: This is a method of forming a vertical transistor device comprising: forming an n-type first drain/source layer 42; patterning a portion of the first drain/source layer 42 to form a channel 44 and a trench; forming a p-type gate structure 46 in the trench; and forming a n-type second drain/source layer 48 over the gate structure 46 and the channel 44; contacting the gate structure 54; forming p-ohmic contact to the gate structure 56; forming n-ohmic source contact 54; and forming n-ohmic drain contact 58. Other devices and methods are also disclosed.

    摘要翻译: 这是形成垂直晶体管器件的方法,包括:形成n型第一漏极/源极层42; 图案化第一漏极/源极层42的一部分以形成沟道44和沟槽; 在沟槽中形成p型栅极结构46; 以及在栅极结构46和沟道44上形成n型第二漏极/源极层48; 接触门结构54; 与门结构56形成p欧姆接触; 形成n-欧姆源触点54; 并形成n欧姆漏极触点58.还公开了其它装置和方法。