摘要:
An x-ray CT system acquires a series of views during a scan and reconstructs a slice image by backprojecting the filtered projection data from each acquired view. Backprojection is facilitated by employing a Cordic processor that produces the angle (.gamma.) and distance (L) of each pixel location from the x-ray source. The angle (.gamma.) selects the proper value from the filtered projection data, and this value is divided by the square of the distance (L) to arrive at a value used to update the slice image pixel value.
摘要:
An analog floating-gate electrode in an integrated circuit, and method of fabricating the same, in which trapped charge can be stored for long durations. The analog floating-gate electrode is formed in a polycrystalline silicon gate level, and includes n-type and p-type doped portions serving as gate electrodes of n-channel and p-channel MOS transistors, respectively; a plate of a metal-to-poly storage capacitor; and a plate of poly-to-active tunneling capacitors. Silicide-block silicon dioxide blocks the formation of silicide cladding on the electrode, while other polysilicon structures in the integrated circuit are silicide-clad. An opening at the surface of the analog floating-gate electrode, at the location at which n-type and p-type doped portions of the floating gate electrode abut, allow formation of silicide at that location, shorting the p-n junction.
摘要:
An analog floating-gate electrode in an integrated circuit, and method of fabricating the same, in which trapped charge can be stored for long durations. The analog floating-gate electrode is formed in a polycrystalline silicon gate level, doped n-type throughout its length, and includes portions serving as gate electrodes of n-channel and p-channel MOS transistors; a plate of a metal-to-poly storage capacitor; and a plate of poly-to-active tunneling capacitors. The p-channel MOS transistor includes a buried channel region, formed by way of ion implantation, disposed between its source and drain regions. Silicide-block silicon dioxide blocks the formation of silicide cladding on the electrode, while other polysilicon structures in the integrated circuit are silicide-clad.
摘要:
A supply for a high bias voltage in an X-ray imaging system has an inverter and a voltage multiplier that produce an alternating output voltage in response to control signals. A voltage sensor produces a signal indicating a magnitude of the output voltage. A circuit determines a difference between the sensor signal and a reference signal that specifies a desired magnitude for the output voltage and that difference is integrated to produce an error signal. The error signal preferably is summed with a precondition signal that is an approximation of a nominal value for the signal sum and the summation producing a resultant signal. Another summation device arithmetically combines the resultant signal and the sensor signal with a signal corresponding to a one-hundred percent duty cycle of the inverter operation in order to produce a duty cycle command. An inverter driver generates the inverter control signals that have frequencies defined by the resultant signal and have duty cycles defined by the duty cycle command. A unique state machine is described which generates those control signals.
摘要:
A switched-capacitor circuit (10, 32 or 32A) samples a first signal (VIN+) onto a first capacitor (C1 or CIN1) by switching a top plate thereof via a summing conductor (13) to a first reference voltage (VSS) and switching a bottom plate thereof to the first signal. A second signal (VIN−) is sampled onto a second capacitor (C3 or CIN3) by switching a top plate thereof to the second signal and switching a bottom plate thereof to the first reference voltage. After the sampling, the top plate of the second capacitor is coupled to the top plate of the first capacitor. The bottom plate of the second capacitor is coupled to the first reference voltage. The bottom plate of the first capacitor is coupled to a second reference voltage (VDD or VREF), to thereby cancel at least a portion of a common mode input voltage component from the first conductor (13), hold the sampled differential charge on the summing conductor and establish a predetermined common mode voltage thereon, and prevent the summing conductor from having a voltage which allows the leakage of charge therefrom. The switched-capacitor circuit may be a SAR, an integrator, or an amplifier.
摘要:
A switched-capacitor circuit (10, 32 or 32A) samples a first signal (VIN+) onto a first capacitor (C1 or CIN1) by switching a top plate thereof via a summing conductor (13) to a first reference voltage (VSS) and switching a bottom plate thereof to the first signal. A second signal (VIN−) is sampled onto a second capacitor (C3 or CIN3) by switching a top plate thereof to the second signal and switching a bottom plate thereof to the first reference voltage. After the sampling, the top plate of the second capacitor is coupled to the top plate of the first capacitor. The bottom plate of the second capacitor is coupled to the first reference voltage. The bottom plate of the first capacitor is coupled to a second reference voltage (VDD or VREF), to thereby cancel at least a portion of a common mode input voltage component from the first conductor (13), hold the sampled differential charge on the summing conductor and establish a predetermined common mode voltage thereon, and prevent the summing conductor from having a voltage which allows the leakage of charge therefrom. The switched-capacitor circuit may be a SAR, an integrator, or an amplifier.
摘要:
Precise alignment of the focal spot position on an x-ray CT system is achieved using a deflection coil that produces a magnetic field which acts on the electron beam path in the x-ray tube. A variable current power supply drives the deflection coil and is controlled by input signals to align the focal spot at a static reference position, to correct for focal spot drift between scans, and to wobble the focal spot position during a scan or between scans.
摘要:
A computerized tomography system includes a detector array made up of a set of detector subelements aligned along a slice thickness direction. A controllable switching matrix selectively interconnects a predetermined number of successive detector subelements to a respective summing amplifier to produce slice-constituent signals which measure a respective slice positioned to pass through a body. Each respective slice having a selectable thickness in a region of interest to be imaged.
摘要:
An analog floating-gate electrode in an integrated circuit, and method of fabricating the same, in which trapped charge can be stored for long durations. The analog floating-gate electrode is formed in a polycrystalline silicon gate level, and includes n-type and p-type doped portions serving as gate electrodes of n-channel and p-channel MOS transistors, respectively; a plate of a metal-to-poly storage capacitor; and a plate of poly-to-active tunneling capacitors. Silicide-block silicon dioxide blocks the formation of silicide cladding on the electrode, while other polysilicon structures in the integrated circuit are silicide-clad. An opening at the surface of the analog floating-gate electrode, at the location at which n-type and p-type doped portions of the floating gate electrode abut, allow formation of silicide at that location, shorting the p-n junction.
摘要:
An analog floating-gate electrode in an integrated circuit, and method of fabricating the same, in which trapped charge can be stored for long durations. The analog floating-gate electrode is formed in a polycrystalline silicon gate level, doped n-type throughout its length, and includes portions serving as gate electrodes of n-channel and p-channel MOS transistors; a plate of a metal-to-poly storage capacitor; and a plate of poly-to-active tunneling capacitors. The p-channel MOS transistor includes a buried channel region, formed by way of ion implantation, disposed between its source and drain regions. Silicide-block silicon dioxide blocks the formation of silicide cladding on the electrode, while other polysilicon structures in the integrated circuit are silicide-clad.