Integrated circuit device with a semiconductor body and method for the production of an integrated circuit device
    6.
    发明授权
    Integrated circuit device with a semiconductor body and method for the production of an integrated circuit device 有权
    具有半导体主体的集成电路装置和用于生产集成电路装置的方法

    公开(公告)号:US08114743B2

    公开(公告)日:2012-02-14

    申请号:US12961996

    申请日:2010-12-07

    IPC分类号: H01L29/72

    摘要: An integrated circuit device with a semiconductor body and a method for the production of a semiconductor device a provided. The semiconductor body comprises a cell field with a drift zone of a first conduction type. In addition, the semiconductor device comprises an edge region surrounding the cell field. Field plates with a trench gate structure are arranged in the cell field, and an edge trench surrounding the cell field is provided in the edge region. The front side of the semiconductor body is in the edge region provided with an edge zone of a conduction type complementing the first conduction type with doping materials of body zones of the cell field. The edge zone of the complementary conduction type extends both within and outside the edge trench.

    摘要翻译: 提供了具有半导体本体的集成电路器件和用于制造半导体器件的方法。 半导体体包括具有第一导电类型的漂移区的电池区。 此外,半导体器件包括围绕电池区的边缘区域。 具有沟槽栅极结构的场板被布置在电池区中,并且在边缘区域中设置围绕电池区的边缘沟槽。 半导体本体的前侧处于边缘区域,该边缘区域具有与单元区域的体区的掺杂材料互补的第一导电类型的导电类型的边缘区域。 互补导电类型的边缘区域在边缘沟槽内部和外部均延伸。

    INTEGRATED CIRCUIT DEVICE WITH A SEMICONDUCTOR BODY AND METHOD FOR THE PRODUCTION OF AN INTEGRATED CIRCUIT DEVICE
    7.
    发明申请
    INTEGRATED CIRCUIT DEVICE WITH A SEMICONDUCTOR BODY AND METHOD FOR THE PRODUCTION OF AN INTEGRATED CIRCUIT DEVICE 有权
    具有半导体体的集成电路装置及其集成电路装置的制造方法

    公开(公告)号:US20110076817A1

    公开(公告)日:2011-03-31

    申请号:US12961996

    申请日:2010-12-07

    IPC分类号: H01L21/336

    摘要: An integrated circuit device with a semiconductor body and a method for the production of a semiconductor device a provided. The semiconductor body comprises a cell field with a drift zone of a first conduction type. In addition, the semiconductor device comprises an edge region surrounding the cell field. Field plates with a trench gate structure are arranged in the cell field, and an edge trench surrounding the cell field is provided in the edge region. The front side of the semiconductor body is in the edge region provided with an edge zone of a conduction type complementing the first conduction type with doping materials of body zones of the cell field. The edge zone of the complementary conduction type extends both within and outside the edge trench.

    摘要翻译: 提供了具有半导体本体的集成电路器件和用于制造半导体器件的方法。 半导体体包括具有第一导电类型的漂移区的电池区。 此外,半导体器件包括围绕电池区的边缘区域。 具有沟槽栅极结构的场板被布置在电池区中,并且在边缘区域中设置围绕电池区的边缘沟槽。 半导体本体的前侧处于边缘区域,该边缘区域具有与单元区域的体区的掺杂材料互补的第一导电类型的导电类型的边缘区域。 互补导电类型的边缘区域在边缘沟槽内部和外部均延伸。

    Integrated circuit device with a semiconductor body and method for the production of an integrated circuit device
    8.
    发明授权
    Integrated circuit device with a semiconductor body and method for the production of an integrated circuit device 有权
    具有半导体主体的集成电路装置和用于生产集成电路装置的方法

    公开(公告)号:US07880226B2

    公开(公告)日:2011-02-01

    申请号:US12020077

    申请日:2008-01-25

    IPC分类号: H01L29/72

    摘要: An integrated circuit device with a semiconductor body and a method for the production of a semiconductor device a provided. The semiconductor body comprises a cell field with a drift zone of a first conduction type. In addition, the semiconductor device comprises an edge region surrounding the cell field. Field plates with a trench gate structure are arranged in the cell field, and an edge trench surrounding the cell field is provided in the edge region. The front side of the semiconductor body is in the edge region provided with an edge zone of a conduction type complementing the first conduction type with doping materials of body zones of the cell field. The edge zone of the complementary conduction type extends both within and outside the edge trench.

    摘要翻译: 提供了具有半导体本体的集成电路器件和用于制造半导体器件的方法。 半导体体包括具有第一导电类型的漂移区的电池区。 此外,半导体器件包括围绕电池区的边缘区域。 具有沟槽栅极结构的场板被布置在电池区中,并且在边缘区域中设置围绕电池区的边缘沟槽。 半导体本体的前侧处于边缘区域,该边缘区域具有与单元区域的体区的掺杂材料互补的第一导电类型的导电类型的边缘区域。 互补导电类型的边缘区域在边缘沟槽内部和外部均延伸。

    Trench Semiconductor Device and Method of Manufacturing
    10.
    发明申请
    Trench Semiconductor Device and Method of Manufacturing 有权
    沟槽半导体器件及其制造方法

    公开(公告)号:US20120025304A1

    公开(公告)日:2012-02-02

    申请号:US12847537

    申请日:2010-07-30

    IPC分类号: H01L29/78 H01L21/336

    摘要: A semiconductor device includes a semiconductor body including a trench with first and second opposing sidewalls. A first electrode is arranged in a lower portion of the trench and a second electrode in an upper portion of the trench. A dielectric structure is arranged in the trench, including a first portion between the electrodes. The first portion includes, in sequence along a lateral direction from the first sidewall to the second sidewall, a first part including a first dielectric material, a second part including a second dielectric material selectively etchable to the first dielectric material, a third part including the first dielectric material, the first dielectric material of the third part being continuously arranged along a vertical direction from a top side of the first electrode to a bottom side of the second electrode, a fourth part including the second dielectric material and a fifth part including the first dielectric material.

    摘要翻译: 半导体器件包括半导体本体,其包括具有第一和第二相对侧壁的沟槽。 第一电极布置在沟槽的下部,沟槽的上部设有第二电极。 电介质结构布置在沟槽中,包括电极之间的第一部分。 第一部分沿着从第一侧壁到第二侧壁的横向方向依次包括包括第一电介质材料的第一部分,包括可选择性地蚀刻到第一电介质材料的第二电介质材料的第二部分,第三部分包括 第一电介质材料,第三部分的第一介电材料沿着垂直方向从第一电极的顶侧到第二电极的底侧连续地布置,第四部分包括第二电介质材料,第五部分包括第 第一介电材料。