Integrated circuit device with a semiconductor body and method for the production of an integrated circuit device
    2.
    发明授权
    Integrated circuit device with a semiconductor body and method for the production of an integrated circuit device 有权
    具有半导体主体的集成电路装置和用于生产集成电路装置的方法

    公开(公告)号:US08114743B2

    公开(公告)日:2012-02-14

    申请号:US12961996

    申请日:2010-12-07

    IPC分类号: H01L29/72

    摘要: An integrated circuit device with a semiconductor body and a method for the production of a semiconductor device a provided. The semiconductor body comprises a cell field with a drift zone of a first conduction type. In addition, the semiconductor device comprises an edge region surrounding the cell field. Field plates with a trench gate structure are arranged in the cell field, and an edge trench surrounding the cell field is provided in the edge region. The front side of the semiconductor body is in the edge region provided with an edge zone of a conduction type complementing the first conduction type with doping materials of body zones of the cell field. The edge zone of the complementary conduction type extends both within and outside the edge trench.

    摘要翻译: 提供了具有半导体本体的集成电路器件和用于制造半导体器件的方法。 半导体体包括具有第一导电类型的漂移区的电池区。 此外,半导体器件包括围绕电池区的边缘区域。 具有沟槽栅极结构的场板被布置在电池区中,并且在边缘区域中设置围绕电池区的边缘沟槽。 半导体本体的前侧处于边缘区域,该边缘区域具有与单元区域的体区的掺杂材料互补的第一导电类型的导电类型的边缘区域。 互补导电类型的边缘区域在边缘沟槽内部和外部均延伸。

    INTEGRATED CIRCUIT DEVICE WITH A SEMICONDUCTOR BODY AND METHOD FOR THE PRODUCTION OF AN INTEGRATED CIRCUIT DEVICE
    7.
    发明申请
    INTEGRATED CIRCUIT DEVICE WITH A SEMICONDUCTOR BODY AND METHOD FOR THE PRODUCTION OF AN INTEGRATED CIRCUIT DEVICE 有权
    具有半导体体的集成电路装置及其集成电路装置的制造方法

    公开(公告)号:US20110076817A1

    公开(公告)日:2011-03-31

    申请号:US12961996

    申请日:2010-12-07

    IPC分类号: H01L21/336

    摘要: An integrated circuit device with a semiconductor body and a method for the production of a semiconductor device a provided. The semiconductor body comprises a cell field with a drift zone of a first conduction type. In addition, the semiconductor device comprises an edge region surrounding the cell field. Field plates with a trench gate structure are arranged in the cell field, and an edge trench surrounding the cell field is provided in the edge region. The front side of the semiconductor body is in the edge region provided with an edge zone of a conduction type complementing the first conduction type with doping materials of body zones of the cell field. The edge zone of the complementary conduction type extends both within and outside the edge trench.

    摘要翻译: 提供了具有半导体本体的集成电路器件和用于制造半导体器件的方法。 半导体体包括具有第一导电类型的漂移区的电池区。 此外,半导体器件包括围绕电池区的边缘区域。 具有沟槽栅极结构的场板被布置在电池区中,并且在边缘区域中设置围绕电池区的边缘沟槽。 半导体本体的前侧处于边缘区域,该边缘区域具有与单元区域的体区的掺杂材料互补的第一导电类型的导电类型的边缘区域。 互补导电类型的边缘区域在边缘沟槽内部和外部均延伸。

    Integrated circuit device with a semiconductor body and method for the production of an integrated circuit device
    8.
    发明授权
    Integrated circuit device with a semiconductor body and method for the production of an integrated circuit device 有权
    具有半导体主体的集成电路装置和用于生产集成电路装置的方法

    公开(公告)号:US07880226B2

    公开(公告)日:2011-02-01

    申请号:US12020077

    申请日:2008-01-25

    IPC分类号: H01L29/72

    摘要: An integrated circuit device with a semiconductor body and a method for the production of a semiconductor device a provided. The semiconductor body comprises a cell field with a drift zone of a first conduction type. In addition, the semiconductor device comprises an edge region surrounding the cell field. Field plates with a trench gate structure are arranged in the cell field, and an edge trench surrounding the cell field is provided in the edge region. The front side of the semiconductor body is in the edge region provided with an edge zone of a conduction type complementing the first conduction type with doping materials of body zones of the cell field. The edge zone of the complementary conduction type extends both within and outside the edge trench.

    摘要翻译: 提供了具有半导体本体的集成电路器件和用于制造半导体器件的方法。 半导体体包括具有第一导电类型的漂移区的电池区。 此外,半导体器件包括围绕电池区的边缘区域。 具有沟槽栅极结构的场板被布置在电池区中,并且在边缘区域中设置围绕电池区的边缘沟槽。 半导体本体的前侧处于边缘区域,该边缘区域具有与单元区域的体区的掺杂材料互补的第一导电类型的导电类型的边缘区域。 互补导电类型的边缘区域在边缘沟槽内部和外部均延伸。