摘要:
This disclosure provides a method for adjusting system timing in a reconfigurable memory system. In a Dynamic Point-to-Point (“DPP”) system, for example, manufacturer-supplied system timing parameters such as access latency and maximum clock speed typically reflect a worst-case configuration scenario. By in-situ detecting actual configuration (e.g., whether expansion boards have been inserted), and correspondingly configuring the system to operate in a mode geared to the specific configuration, worst-case or near worst-case scenarios may be ruled out and system timing parameters may be redefined for faster-than-conventionally-rated performance; this is especially the case in a DPP system where signal pathways typically become more direct as additional modules are added. Contrary to convention wisdom therefore, which might dictate that component expansion should slow down timing, clock speed can actually be increased in such a system, if supported by the configuration, for better performance.
摘要:
This disclosure provides a method for adjusting system timing in a reconfigurable memory system. In a Dynamic Point-to-Point (“DPP”) system, for example, manufacturer-supplied system timing parameters such as access latency and maximum clock speed typically reflect a worst-case configuration scenario. By in-situ detecting actual configuration (e.g., whether expansion boards have been inserted), and correspondingly configuring the system to operate in a mode geared to the specific configuration, worst-case or near worst-case scenarios may be ruled out and system timing parameters may be redefined for faster-than-conventionally-rated performance; this is especially the case in a DPP system where signal pathways typically become more direct as additional modules are added. Contrary to convention wisdom therefore, which might dictate that component expansion should slow down timing, clock speed can actually be increased in such a system, if supported by the configuration, for better performance.
摘要:
A memory module includes a substrate having signal lines thereon that form a control path and a plurality of data paths. A plurality of memory devices are mounted on the substrate. Each memory device is coupled to the control path and to a distinct data path. The memory module includes control circuitry to enable each memory device to process a distinct respective memory access command in a succession of memory access commands and to output data on the distinct data path in response to the processed memory access command.
摘要:
Multiple timing reference signals (e.g., clock signals) each cycling at the same frequency are distributed in a fly-by topology to a plurality of memory devices in various embodiments are presented. These multiple clock signals each have a different phase relationship to each other (e.g., quadrature). A first circuit receives a first of these clocks as a first timing reference signal. A second circuit receives a second of these clocks as a second timing reference signal. A plurality of receiver circuits receive signals synchronously with respect to the first timing reference signal and the second timing reference signal, such that a first signal value is resolved using the first timing reference signal and a second signal value is resolved using the second timing reference signal.
摘要:
Multiple timing reference signals (e.g., clock signals) each cycling at the same frequency are distributed in a fly-by topology to a plurality of memory devices in various embodiments are presented. These multiple clock signals each have a different phase relationship to each other (e.g., quadrature). A first circuit receives a first of these clocks as a first timing reference signal. A second circuit receives a second of these clocks as a second timing reference signal. A plurality of receiver circuits receive signals synchronously with respect to the first timing reference signal and the second timing reference signal, such that a first signal value is resolved using the first timing reference signal and a second signal value is resolved using the second timing reference signal.
摘要:
An integrated circuit input/output interface with empirically determined delay matching is disclosed. In one embodiment, the integrated circuit input/output interface uses empirical information of signal traces coupled to the integrated circuit to adjust a transmit/receive clock of each pin of the interface so as to compensate for delay mismatches caused by differences in signal trace lengths. In one embodiment, values representative of the empirical information are stored for use by the integrated circuit to generate trace-specific signals so as to compensate for delay differences that are at least partially caused by unmatched signal trace lengths. The empirical information, in one embodiment, includes signal flight time of each signal trace, which can be pre-measured or pre-calculated from known signal trace lengths. The empirical information, in another embodiment, includes trace-specific phase offset values calculated from pre-calculated or pre-measured signal flight times or signal trace lengths.
摘要:
An integrated circuit input/output interface with empirically determined delay matching is disclosed. In one embodiment, the integrated circuit input/output interface uses empirical information of the signal traces to adjust the transmit/receive clock of each pin of the interface so as to compensate for delay mismatches caused by differences in signal trace lengths. The empirical information, in one embodiment, includes signal flight time of each signal trace, which can be pre-measured or pre-calculated from known signal trace lengths. The empirical information, in another embodiment, includes trace-specific phase offset values calculated from pre-calculated or pre-measured signal flight times or signal trace lengths. In yet another embodiment, a transmitting device generates a set of serially delayed write clocks, which are used to control symbol transmission over signal traces so as to reduce simultaneous switching output noise and ground bound in the transmitting device.
摘要:
An integrated circuit input/output interface with empirically determined delay matching is disclosed. In one embodiment, the integrated circuit input/output interface uses empirical information of signal traces coupled to the integrated circuit to adjust a transmit/receive clock of each pin of the interface so as to compensate for delay mismatches caused by differences in signal trace lengths. In one embodiment, values representative of the empirical information are stored for use by the integrated circuit to generate trace-specific signals so as to compensate for delay differences that are at least partially caused by unmatched signal trace lengths. The empirical information, in one embodiment, includes signal flight time of each signal trace, which can be pre-measured or pre-calculated from known signal trace lengths. The empirical information, in another embodiment, includes trace-specific phase offset values calculated from pre-calculated or pre-measured signal flight times or signal trace lengths.
摘要:
A memory system includes a memory controller coupled to multiple memory devices. Each memory device includes an oscillator that generates an internal reference signal that oscillates at a frequency that is a function of physical device structures within the memory device. The frequencies of the internal reference signals are thus device specific. Each memory device develops a shared reference signal from its internal reference signal and communicates the shared reference signal to the common memory controller. The memory controller uses the shared reference signals to recover device-specific frequency information from each memory device, and then communicates with each memory device at a frequency compatible with the corresponding internal reference signal.
摘要:
A memory system includes a memory controller coupled to multiple memory devices. Each memory device includes an oscillator that generates an internal reference signal that oscillates at a frequency that is a function of physical device structures within the memory device. The frequencies of the internal reference signals are thus device specific. Each memory device develops a shared reference signal from its internal reference signal and communicates the shared reference signal to the common memory controller. The memory controller uses the shared reference signals to recover device-specific frequency information from each memory device, and then communicates with each memory device at a frequency compatible with the corresponding internal reference signal.