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公开(公告)号：US20240124710A1
公开(公告)日：2024-04-18
申请号：US18264686
申请日：2021-11-19
发明人： Yuko KIMURA
CPC分类号： C08L83/08 , C08K3/22 , C08K2003/2227 , C08K2201/001
摘要： The present invention provides a thermally-conductive silicone composition including an organopolysiloxane as a base polymer and a thermally-conductive filler. The base polymer includes a fluorine-free organopolysiloxane and a fluorine-containing organopolysiloxane. The thermally-conductive silicone composition has been cured using an addition-curing catalyst. The ratio of the number of fluoro groups in constituent components of the base polymer to the total number of alkenyl groups bonded to silicon atoms in the constituent components of the base polymer is from 2.00 to 30.0.
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公开(公告)号：US20240006723A1
公开(公告)日：2024-01-04
申请号：US18252679
申请日：2021-10-20
发明人： Masakazu HATTORI , Yuko KIMURA
IPC分类号： H01M50/483 , H01M50/477
CPC分类号： H01M50/483 , H01M50/477
摘要： A silicone laminate 1 includes layers of a silicone rubber layer (A) 2 and a silicone layer (B) 3 with a lower hardness than the silicone rubber layer (A) 2. The silicone layer (B) 3 is at least one layer selected from the group consisting of a silicone sponge layer (B1) and a silicone gel layer (B2). Both the silicone rubber layer (A) 2 and the silicone layer (B) 3 are made of a material that is converted to ceramic and forms a sintered body when burned, so that the material retains its shape. The silicone laminate 1 is fire resistant. It is preferable that the silicone rubber layer (A) 2 and the silicone layer (B) 3 are alternately stacked, and that the number of layers is two or more for each of the layers (A) and (B), and four or more in total. Thus, the silicone laminate has high fire resistance and high compressive resistance as a cushioning material for batteries.
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公开(公告)号：US20220380653A1
公开(公告)日：2022-12-01
申请号：US17772073
申请日：2021-03-26
发明人： Takumi KATAISHI , Mai SUGIE , Yuko KIMURA
摘要： A thermally-conductive silicone gel composition of the present invention contains A to D components below. A: a linear organopolysiloxane having one vinyl group at each terminal end of a molecular chain and a kinematic viscosity of 1 to 600 mm2/s, B: a linear organopolysiloxane having three or more Si—H groups in one molecule and an Si—H group content of 0.05 to 6 mol/kg, in an amount such that a ratio of the number of Si—H groups in B component to the number of vinyl groups in A component is 0.2 to 0.5, C: a platinum catalyst in a catalytic amount, and D: a thermally-conductive filler in an amount of 300 to 1000 parts by mass when a total amount of A and B is taken as 100 parts by mass.
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公开(公告)号：US20220363834A1
公开(公告)日：2022-11-17
申请号：US17633753
申请日：2021-04-02
发明人： Makoto IWAI , Shingo KOBAYASHI , Yuko KIMURA
IPC分类号： C08G77/04 , C08K3/22 , C08K9/06 , C08K9/08 , H01L23/373
摘要： A thermally conductive silicone composition contains a silicone polymer and a thermally conductive inorganic filler. The thermally conductive inorganic filler is surface treated with a first surface treatment agent and further surface treated with a second surface treatment agent. The first surface treatment agent contains an organic silane compound represented by R11SiR12x(OR13)3-x (where R11 is, e.g., a monovalent aliphatic hydrocarbon group having 1 to 18 carbon atoms, a monovalent aromatic hydrocarbon group having 6 to 30 carbon atoms, or a hydrocarbon group having an alkoxysilyl group, R12 is, e.g., a methyl group, and R13 is, e.g., a hydrocarbon group having 1 to 4 carbon atoms). The second surface treatment agent contains a silicone polymer that has a kinematic viscosity of 10 to 1000 mm2/s and does not have a hydrolyzable group. Thus, the present invention provides a thermally conductive silicone composition that has a low slurry viscosity and achieves high extrudability and high moldability, and a method for producing the thermally conductive silicone composition.
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公开(公告)号：US20230227625A1
公开(公告)日：2023-07-20
申请号：US18002399
申请日：2021-04-05
发明人： Takumi KATAISHI , Yuko KIMURA
CPC分类号： C08K5/01 , C08K9/06 , C08J5/18 , C08K2201/001 , C08J2383/07
摘要： A silicone gel composition of the present invention contains the following components; A 100 parts by mass of an organopolysiloxane that is curable by an addition reaction; B. 0.01 to 10 parts by mass of an unsaturated hydrocarbon compound having one alkenyl group per molecule; and C. an addition reaction curing catalyst in a catalytic amount. The unsaturated hydrocarbon compound is at least one selected from the group consisting of an a-olefin that is liquid at room temperature (25° C.) and does not volatilize or decompose at 100° C. and α-methylstyrene. A silicone gel sheet of the present invention is obtained by molding the silicone gel composition into a sheet, and curing the sheet.
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公开(公告)号：US20230097362A1
公开(公告)日：2023-03-30
申请号：US17799526
申请日：2021-07-15
发明人： Shingo KOBAYASHI , Yuko KIMURA
摘要： A thermally conductive silicone heat dissipating material contains a silicone polymer, a thermally conductive inorganic filler, and a heat resistance improver. The thermally conductive inorganic filler has a BET specific surface area (ABET) of 0.3 m2/g or more and is surface treated with a surface treatment agent expressed by Si(OR′)4 or RxSi(OR′)4−x (where R represents a hydrocarbon group having 1 to 4 carbon atoms or an aromatic hydrocarbon group having 6 to 12 carbon atoms, R′ represents a hydrocarbon group having 1 to 4 carbon atoms, and x represents an integer of 1 to 2). The content of the thermally conductive inorganic filler is 100 to 10000 parts by mass with respect to 100 parts by mass of the silicone polymer. The thermally conductive inorganic filler having a large specific surface area and a small average particle size is surface treated with a silane coupling agent with a low molecular weight, so that the heat resistance of the thermally conductive silicone heat dissipating material is improved.
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公开(公告)号：US20220363835A1
公开(公告)日：2022-11-17
申请号：US17633780
申请日：2021-04-02
发明人： Makoto IWAI , Shingo KOBAYASHI , Yuko KIMURA
IPC分类号： C08G77/04 , C08K3/22 , C08K9/06 , C08K9/08 , H01L23/373
摘要： A thermally conductive silicone composition contains a silicone polymer and a thermally conductive inorganic filler. The ratio X of the BET specific surface area (m2/g) to the average particle size (μm) of the thermally conductive inorganic filler is 0.1 or more. The thermally conductive inorganic filler is surface treated with a first surface treatment agent and further surface treated with a second surface treatment agent. The first surface treatment agent contains an organic silane compound represented by R11SiR12x(OR13)3-x (where R11 is, e.g., a monovalent aliphatic hydrocarbon group having 1 to 4 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 30 carbon atoms, R12 is, e.g., a methyl group, and R13 is, e.g., a hydrocarbon group having 1 to 4 carbon atoms). The second surface treatment agent contains a silicone polymer that has a kinematic viscosity of 1000 mm2/s or less and does not have a hydrolyzable group. Thus, the present invention provides a thermally conductive silicone composition that has improved viscoelasticity and heat resistance, and a method for producing the thermally conductive silicone composition.
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公开(公告)号：US20220169857A1
公开(公告)日：2022-06-02
申请号：US17425888
申请日：2020-08-06
发明人： Takumi KATAISHI , Yuko KIMURA , Mai SUGIE , Makoto IWAI , Setsuo KIKUCHI
摘要： A thermally conductive silicone gel composition of the present invention includes the following A to F: (A) an organopolysiloxane having two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having two Si—H groups per molecule; (C) an organohydrogenpolysiloxane having three or more Si—H groups per molecule; (D) at least one compound selected from the group consisting of D1 and D2: (D1) an organopolysiloxane having one alkenyl group per molecule and (D2) an organohydrogenpolysiloxane having one Si—H group per molecule; (E) a platinum catalyst; and (F) a thermally conductive filler in an amount of 100 to 600 vol % with respect to 100 vol % of the total amount of the A to E. The components A to F are cured. With this configuration, the thermally conductive silicone gel composition can reduce oil bleeding, even though the composition is a gel cured product.
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