公开(公告)号：US20220325140A1

公开(公告)日：2022-10-13

申请号：US17707003

申请日：2022-03-29

Applicant: Fujimi Incorporated

Inventor： Tsutomu YOSHINO ,  Yoshihiro IZAWA ,  Yasuto ISHIDA

IPC: C09G1/16 ,  H01L21/306

Abstract: Provided is a means capable of sufficiently removing residues remaining on a surface of a polished object. Provided is a composition for surface treatment for use in reducing a residue on a surface of a polished object, containing a solvent and a water-soluble polymer, wherein an adsorption amount of the water-soluble polymer adsorbed to a quartz crystal microbalance electrode is 100 ng/cm2 or more and 600 ng/cm2 or less per unit area of the quartz crystal microbalance electrode.

公开(公告)号：US20160288289A1

公开(公告)日：2016-10-06

申请号：US15022376

申请日：2014-08-11

Applicant: FUJIMI INCORPORATED

Inventor： Shota SUZUKI ,  Yoshihiro IZAWA

IPC: B24B37/04 ,  C09K3/14 ,  C09G1/02

CPC classification number: B24B37/044 ,  B24B37/00 ,  C09G1/02 ,  C09K3/1436 ,  C09K3/1463 ,  H01L21/31053 ,  H01L21/3212

Abstract: The present invention is the invention of a polishing composition comprising a silica in which a functional group satisfying at least one of condition (1) and condition (2) described below is fixed on the surface, and a pH-adjusting agent; condition (1): the functional group has an amino group; and condition (2): the functional group has a halogeno group, and the polishing composition of the invention can sufficiently control a polishing rate of a Si-containing material.

Abstract translation: 本发明是一种包含二氧化硅的抛光组合物的发明，其中满足下述条件（1）和条件（2）中的至少一个的官能团固定在表面上，以及pH调节剂; 条件（1）：官能团具有氨基; 和条件（2）：官能团具有卤代基，本发明的研磨用组合物能够充分地控制含Si材料的研磨速度。

公开(公告)号：US20190300751A1

公开(公告)日：2019-10-03

申请号：US16317448

申请日：2017-06-12

Applicant: FUJIMI INCORPORATED

Inventor： Yoshihiro IZAWA ,  Shota SUZUKI

IPC: C09G1/02

Abstract: The present invention provides a method for producing a polishing composition which can polish an object to be polished at a high polishing speed and with fewer scratches (defects).The present invention is a method for producing a polishing composition, the method including: preparing silica in which an intensity of a peak of a silica four-membered ring structure and an intensity of a peak derived from a silica random network structure when analyzed by Raman spectroscopy satisfy a predetermined requirement; and mixing the silica with a dispersing medium.

公开(公告)号：US20190085210A1

公开(公告)日：2019-03-21

申请号：US16133186

申请日：2018-09-17

Applicant: FUJIMI INCORPORATED

Inventor： Yoshihiro IZAWA

IPC: C09G1/02 ,  C09K3/14

Abstract: A method for producing a polishing composition including: preparing a first dispersion liquid by mixing a dispersing element containing abrasive grains and a dispersing medium with a pH adjusting agent, and changing the pH of the dispersing element so as to pass an isoelectric point of the abrasive grains; and preparing a second dispersion liquid by mixing the first dispersion liquid with an electrical conductivity adjusting agent.

公开(公告)号：US20220415669A1

公开(公告)日：2022-12-29

申请号：US17902507

申请日：2022-09-02

Applicant: FUJIMI INCORPORATED

Inventor： Yoshihiro IZAWA ,  Kenta IDE

IPC: H01L21/321 ,  C09G1/02 ,  C09G1/16 ,  H01L21/3105 ,  C09K3/14

Abstract: A polishing method according to the present invention, includes polishing a polishing object containing a silicon material by using a polishing composition containing abrasive grains, a tri- or more polyvalent hydroxy compound and a dispersing medium and having pH of less than 6.0.

公开(公告)号：US20220064486A1

公开(公告)日：2022-03-03

申请号：US17407435

申请日：2021-08-20

Applicant: FUJIMI INCORPORATED

Inventor： Yoshihiro IZAWA

IPC: C09G1/02 ,  H01L21/304

Abstract: An object of the present invention is to provide a means for reducing the surface roughness (Ra) and suppressing occurrence of scratches while maintaining a high polishing rate in polishing an object to be polished containing a resin. Provided is a polishing composition including particulate alumina and a dispersing medium, in which an α conversion rate of the particulate alumina is 50% or more, and a sphericity of the particulate alumina is 80% or more.

公开(公告)号：US20190292407A1

公开(公告)日：2019-09-26

申请号：US16317625

申请日：2017-06-12

Applicant: FUJIMI INCORPORATED

Inventor： Shota SUZUKI ,  Yoshihiro IZAWA

IPC: C09G1/02 ,  B24B37/04 ,  C09K3/14 ,  H01L21/3105 ,  H01L21/306 ,  H01L21/321

Abstract: The present invention provides a polishing composition which polishes an object to be polished at a high polishing speed and with less scratches (defects).The present invention is a polishing composition including silica having a maximum peak temperature of 30° C. or higher and 53° C. or lower in a weight change rate distribution curve obtained by thermogravimetric measurement in a range of 25° C. or higher and 250° C. or lower, and having a pH at 25° C. of less than 6.0.

公开(公告)号：US20190256742A1

公开(公告)日：2019-08-22

申请号：US16317383

申请日：2017-06-12

Applicant: FUJIMI INCORPORATED

Inventor： Shota SUZUKI ,  Yoshihiro IZAWA ,  Naoyuki ISHIHARA

IPC: C09G1/02 ,  B24B37/04 ,  C09K3/14

Abstract: The present invention provides a polishing composition that can polish an object to be polished at a high polishing speed with fewer scratches (defects). The present invention relates to a polishing composition including silica and a dispersing medium, the polishing composition having, when analyzed by pulse NMR spectroscopy, a specific relaxation rate (R2sp) of from 1.60 to 4.20 as determined by the following Formula (1): R2sp=(R(silica))/(R(medium))−1   Formula (1): wherein R(silica) represents the reciprocal of the relaxation time of silica (unit:/millisecond), and R(medium) represents the reciprocal of the relaxation time of the dispersing medium (unit:/millisecond).

公开(公告)号：US20190225836A1

公开(公告)日：2019-07-25

申请号：US16316970

申请日：2017-06-12

Applicant: FUJIMI INCORPORATED

Inventor： Shota SUZUKI ,  Yoshihiro IZAWA

IPC: C09G1/02 ,  C09K3/14 ,  H01L21/3105

Abstract: The present invention provides a polishing composition which can polish an object to be polished at a high polishing speed and with fewer scratches (defects). The present invention is a polishing composition containing silica of which a maximum peak height in a weight change rate distribution curve obtained by thermogravimetric measurement in a range of 25° C. or higher and 250° C. or lower is −0.011 or more and less than 0, a pH at 25° C. of the polishing composition being less than 6.0.

公开(公告)号：US20190080927A1

公开(公告)日：2019-03-14

申请号：US16123632

申请日：2018-09-06

Applicant: FUJIMI INCORPORATED

Inventor： Yoshihiro IZAWA ,  Kenta IDE

IPC: H01L21/321 ,  C09G1/16 ,  C09K3/14

Abstract: A polishing method according to the present invention, includes polishing a polishing object containing a silicon material by using a polishing composition containing abrasive grains, a tri- or more polyvalent hydroxy compound and a dispersing medium and having pH of less than 6.0.