公开(公告)号：US20070190318A1

公开(公告)日：2007-08-16

申请号：US11707117

申请日：2007-02-16

申请人： Fumiteru Asai ,  Toshio Shintani ,  Yuji Okawa ,  Tomokazu Takahashi

发明人： Fumiteru Asai ,  Toshio Shintani ,  Yuji Okawa ,  Tomokazu Takahashi

IPC分类号： B32B7/12 ,  B32B15/04 ,  C08F222/26 ,  D06M15/263

CPC分类号： H01L21/6836 ,  C08F220/36 ,  C08G18/6229 ,  C08G18/8116 ,  C08G2170/40 ,  C09J4/06 ,  C09J7/385 ,  C09J175/16 ,  C09J2203/326 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2924/3025 ,  Y10T428/28 ,  Y10T428/2809

摘要： The present invention relates to a pressure-sensitive adhesive tape or sheet for dicing which is to be applied to an active surface in the state of being not wholly covered with a native oxide film. The adhesive tape or sheet includes a substrate, and a radiation-curable pressure-sensitive adhesive layer disposed on at least one side of the substrate, in which the pressure-sensitive adhesive layer contains an acrylic polymer (A) having a weight-average molecular weight of 500,000 or higher and at least one radiation-polymerizable compound (B) selected from cyanurate compounds having one or more groups containing a carbon-carbon double bond and isocyanurate compounds having one or more groups containing a carbon-carbon double bond, and the ratio of the radiation-polymerizable compound (B) with respect to 100 parts by weight of the acrylic polymer (A) is 5 to 150 parts by weight.

摘要翻译： 本发明涉及在未被全部被天然氧化物膜覆盖的状态下施加到活性表面上的用于切割的压敏粘合带或片材。 粘合带或片包括基材和设置在基材的至少一侧的可辐射固化压敏粘合剂层，其中压敏粘合剂层含有具有重均分子量的丙烯酸类聚合物（A） 50重量％以上的至少一种放射线聚合性化合物（B）和选自具有一个或多个含有碳 - 碳双键的基团的氰脲酸酯化合物和具有一个或多个含有碳 - 碳双键的基团的异氰脲酸酯化合物，以及 可辐射聚合性化合物（B）相对于100重量份丙烯酸系聚合物（A）的比例为5〜150重量份。

公开(公告)号：US20060257651A1

公开(公告)日：2006-11-16

申请号：US11383371

申请日：2006-05-15

申请人： Toshio Shintani ,  Tomokazu Takahashi ,  Syouji Yamamoto ,  Kazuyuki Kiuchi ,  Fumiteru Asai ,  Kouji Akazawa

发明人： Toshio Shintani ,  Tomokazu Takahashi ,  Syouji Yamamoto ,  Kazuyuki Kiuchi ,  Fumiteru Asai ,  Kouji Akazawa

IPC分类号： B32B7/12

CPC分类号： H01L21/6836 ,  B32B7/12 ,  C09J7/385 ,  C09J2203/326 ,  H01L21/6835 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2891

摘要： According to the invention, a pressure-sensitive adhesive sheet for use in dicing of a workpiece is provided which comprises a base film and at least a pressure-sensitive adhesive layer provided on the base film, wherein the pressure-sensitive adhesive layer comprises an acrylic polymer that contains at least 5% by weight of a monomer unit having an alkoxyl group in its side chain. According to the structure, there are provided a pressure-sensitive adhesive sheet for dicing that can produce good pickup performance even after a long time and a method of picking up a product worked with the pressure-sensitive adhesive sheet.

摘要翻译： 根据本发明，提供了一种用于切割工件的压敏粘合片，其包括基膜和至少设置在基膜上的压敏粘合剂层，其中压敏粘合剂层包含丙烯酸 在侧链中含有至少5重量％的具有烷氧基的单体单元的聚合物。 根据该结构，提供了即使经过长时间也能够获得良好的拾取性能的切割用粘合片，以及拾取用压敏粘合片加工的产品的方法。

公开(公告)号：US08388786B2

公开(公告)日：2013-03-05

申请号：US12720704

申请日：2010-03-10

申请人： Takashi Habu ,  Fumiteru Asai ,  Tomokazu Takahashi ,  Akinori Nishio ,  Toshio Shintani

发明人： Takashi Habu ,  Fumiteru Asai ,  Tomokazu Takahashi ,  Akinori Nishio ,  Toshio Shintani

IPC分类号： B32B37/00

CPC分类号： H01L21/304 ,  C09J133/066 ,  C09J2201/606 ,  C09J2203/326 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/3025

摘要： The present invention provides a substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, which is to be stuck to a front surface of a semiconductor wafer in grinding a back surface of the semiconductor wafer, the pressure-sensitive adhesive sheet consisting of a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is formed of a UV-curable pressure-sensitive adhesive containing a polymer composed mainly of an acrylic monomer polymerizable compound, the pressure-sensitive adhesive force of a surface of the pressure-sensitive adhesive layer to be stuck to the front surface of the semiconductor wafer is larger than the pressure-sensitive adhesive force of the opposite surface thereof, and the pressure-sensitive adhesive layer has an initial elastic modulus of from 0.01 MPa to 500 MPa.

摘要翻译： 本发明提供一种用于保护半导体晶片的无基板用粘合片，其将在半导体晶片的背面磨削时粘贴到半导体晶片的前表面，该压敏粘合片由 压敏粘合剂层，其中压敏粘合剂层由含有主要由丙烯酸单体可聚合化合物组成的聚合物的UV可固化压敏粘合剂形成，压力表面的压敏粘合力 要粘附到半导体晶片的前表面的敏感粘合剂层大于其相对表面的压敏粘合力，并且压敏粘合剂层的初始弹性模量为0.01MPa至500MPa。

公开(公告)号：US20080057306A1

公开(公告)日：2008-03-06

申请号：US11892216

申请日：2007-08-21

申请人： Takatoshi Sasaki ,  Tomokazu Takahashi ,  Fumiteru Asai ,  Akiyoshi Yamamoto ,  Toshio Shintani

发明人： Takatoshi Sasaki ,  Tomokazu Takahashi ,  Fumiteru Asai ,  Akiyoshi Yamamoto ,  Toshio Shintani

IPC分类号： B32B7/12

CPC分类号： B23K26/18 ,  C09J7/29 ,  Y10T428/2848

摘要： An adhesive sheet for laser processing, comprises a base film and an adhesive layer laminated on the surface of the base film, wherein the base film has a melting protection layer on the back side thereof. According to the adhesive sheet for laser processing of the present invention, the melting of the base film caused by the local concentration of laser beam energy at the places irradiated with the laser beam can be effectively prevented. Accordingly, the back side of the base film can be prevented from locally adhering to the processing table in the dicing apparatus, and subsequent steps, namely, drawing the base film to separate the workpiece from the adhesive layer, and individually recovering these, can be carried out easily and efficiently.

摘要翻译： 一种用于激光加工的粘合片，包括基膜和层压在基膜表面上的粘合剂层，其中基膜在其背面具有熔融保护层。 根据本发明的激光加工用粘合片，能够有效地防止由激光束照射的部位的激光能量的局部浓度引起的基膜熔化。 因此，可以防止基膜的背面局部粘附在切割装置的处理台上，随后的步骤即拉出基膜以将粘合剂层分离出来，并单独地回收它们，可以是 轻松高效地进行。

公开(公告)号：US20080182095A1

公开(公告)日：2008-07-31

申请号：US11931168

申请日：2007-10-31

申请人： Fumiteru Asai ,  Takatoshi Sasaki ,  Tsubasa Miki ,  Tomokazu Takahashi ,  Toshio Shintani ,  Akiyoshi Yamamoto

发明人： Fumiteru Asai ,  Takatoshi Sasaki ,  Tsubasa Miki ,  Tomokazu Takahashi ,  Toshio Shintani ,  Akiyoshi Yamamoto

IPC分类号： B32B5/02 ,  B32B7/10 ,  B32B3/10

CPC分类号： H01L21/6836 ,  B23K26/146 ,  B23K26/40 ,  B23K2103/50 ,  C09J7/21 ,  C09J2203/326 ,  H01L21/78 ,  H01L2221/68327 ,  Y10T428/249962

摘要： The present invention provides an adhesive sheet for water jet laser dicing, comprising an adhesive layer laminated on a base film, wherein the base film is composed of mesh formed by a fiber. According to the adhesive sheet for water jet laser dicing in the present invention, a film composed of mesh is used as the base film to ensure that the perforation size and opening area are relatively larger than in nonwoven fabric and perforated sheets, thus making it possible to maintain stable permeability to liquids originating in the liquid stream during water jet laser dicing and to provide an adhesive sheet that allows extremely thin semiconductor wafers or materials to be processed while preventing die fly-off or defects such as cracking and chipping in IC components, chips, or the like.

摘要翻译： 本发明提供了一种水射流激光切割用粘合片，其特征在于，包括层叠在基膜上的粘合剂层，其中，所述基膜由纤维形成的网构成。 根据本发明的喷水激光切割用粘合片，使用由网状构成的膜作为基膜，以确保穿孔尺寸和开口面积比无纺布和穿孔片材相对大，从而使其成为可能 在喷水激光切割期间保持对源自液体流的液体的稳定的渗透性，并且提供允许极薄的半导体晶片或材料被加工同时防止芯片脱落或缺陷如IC部件中的破裂和碎裂的粘合片， 芯片等。

公开(公告)号：US20080138618A1

公开(公告)日：2008-06-12

申请号：US11951605

申请日：2007-12-06

申请人： Takatoshi Sasaki ,  Fumiteru Asai ,  Toshio Shintani ,  Tomokazu Takahashi

发明人： Takatoshi Sasaki ,  Fumiteru Asai ,  Toshio Shintani ,  Tomokazu Takahashi

IPC分类号： B32B7/06 ,  C08F2/46

CPC分类号： H01L21/6836 ,  C08K5/0025 ,  C08L2312/06 ,  C09J7/385 ,  C09J139/06 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/302 ,  C09J2205/31 ,  H01L2221/68327 ,  H01L2924/3025 ,  Y10T428/2809

摘要： The present invention relates to a removable pressure-sensitive adhesive composition containing an acrylic polymer, a photopolymerization initiator and a crosslinking agent, in which the acrylic polymer and the photopolymerization initiator each are chemically bonded to the crosslinking agent. The present invention also relates to a removable pressure-sensitive adhesive composition containing an acrylic polymer and a photopolymerization initiator, the composition further containing a crosslinking agent having a reactive functional group which is capable of reacting with a reactive functional group of the acrylic polymer and a reactive functional group of the photopolymerization initiator.

摘要翻译： 本发明涉及含有丙烯酸类聚合物，光聚合引发剂和交联剂的可除去的压敏粘合剂组合物，其中丙烯酸类聚合物和光聚合引发剂各自与交联剂化学键合。 本发明还涉及含有丙烯酸类聚合物和光聚合引发剂的可除去的压敏粘合剂组合物，该组合物还含有具有能够与丙烯酸类聚合物的反应性官能团反应的反应性官能团的交联剂和 光聚合引发剂的反应性官能团。

公开(公告)号：US20080108262A1

公开(公告)日：2008-05-08

申请号：US11931124

申请日：2007-10-31

申请人： Fumiteru Asai ,  Takatoshi Sasaki ,  Toshio Shintani ,  Tomokazu Takahashi ,  Tsubasa Miki ,  Akiyoshi Yamamoto

发明人： Fumiteru Asai ,  Takatoshi Sasaki ,  Toshio Shintani ,  Tomokazu Takahashi ,  Tsubasa Miki ,  Akiyoshi Yamamoto

IPC分类号： D03D9/00 ,  B32B7/00

CPC分类号： H01L21/6836 ,  B23K26/146 ,  B23K26/40 ,  B23K2103/50 ,  B26F3/004 ,  C09J7/21 ,  C09J7/22 ,  C09J2201/20 ,  C09J2203/326 ,  H01L21/78 ,  H01L2221/68327 ,  Y10T428/26 ,  Y10T428/28 ,  Y10T442/10

摘要： The present invention provides an adhesive sheet for water jet laser dicing, comprising an adhesive layer laminated on a base film which has a mean opening diameter of 5 μm to 30 μm. According to the adhesive sheet of the invention, a base film having a mean opening diameter of a certain size is used, thus ensuring better permeability to liquids originating in a liquid stream, and preventing the material that is being processed from being separated by the liquids from the adhesive sheet. In addition, the relatively low mean opening diameter makes it possible to control rippling on the surface of the base film and kept the surface flat, resulting in better adhesion to the material being processed and ensuring that the material being processed is secured during the dicing stage. The ability to improve the adhesion between the base film and the adhesive layer also makes it possible to prevent the separation of the adhesive form the base film and the adhesion of the adhesion on the material being processed when picked up after dicing.

摘要翻译： 本发明提供一种水喷射激光切割用粘合片，其特征在于，具有层叠在平均开口直径为5〜30μm的基底膜上的粘合剂层。 根据本发明的粘合片，使用具有一定尺寸的平均开口直径的基膜，从而确保对来自液体流的液体的更好的渗透性，并且防止被处理的材料被液体分离 从粘合片。 另外，相对低的平均开口直径使得可以控制基膜的表面上的波纹并保持表面平坦，导致对被处理材料的更好的附着力，并确保在切割阶段期间确保正在加工的材料 。 提高基膜和粘合剂层之间的粘合力的能力也使得可以防止粘合剂从基膜剥离，以及在切割后拾取时对待处理材料的粘合的粘附。

公开(公告)号：US20080085397A1

公开(公告)日：2008-04-10

申请号：US11905567

申请日：2007-10-02

申请人： Fumiteru Asai ,  Toshio Shintani ,  Takatoshi Sasaki ,  Akiyoshi Yamamoto ,  Tomokazu Takahashi

发明人： Fumiteru Asai ,  Toshio Shintani ,  Takatoshi Sasaki ,  Akiyoshi Yamamoto ,  Tomokazu Takahashi

IPC分类号： B32B33/00 ,  B32B7/12

CPC分类号： H01L21/6836 ,  B23K26/40 ,  B23K2103/50 ,  C09J7/22 ,  C09J7/241 ,  C09J7/29 ,  C09J2201/162 ,  C09J2205/114 ,  C09J2423/006 ,  H01L21/78 ,  H01L2221/68327 ,  Y10T428/24355 ,  Y10T428/28

摘要： An adhesive sheet for laser processing comprises an adhesive layer laminated on the surface of a base film, wherein the base film has a textured contact-reducing layer on the back side thereof. According to the adhesive sheet for laser processing of the present invention, the melting of the base film caused by the local concentration of laser beam energy at the places irradiated with the laser beam can be effectively prevented. Accordingly, the back side of the base film can be prevented from locally adhering to the processing table in the dicing apparatus, and subsequent steps, namely, drawing the base film to separate the workpiece from the adhesive layer, and individually recovering these, can be carried out easily and efficiently.

摘要翻译： 用于激光加工的粘合片包括层压在基膜的表面上的粘合剂层，其中所述基膜在其背面具有纹理化的接触减少层。 根据本发明的激光加工用粘合片，能够有效地防止由激光束照射的部位的激光能量的局部浓度引起的基膜熔化。 因此，可以防止基膜的背面局部粘附在切割装置的处理台上，随后的步骤即拉出基膜以将粘合剂层分离出来，并单独地回收它们，可以是 轻松高效地进行。

公开(公告)号：US20080057253A1

公开(公告)日：2008-03-06

申请号：US11892567

申请日：2007-08-24

申请人： Takatoshi Sasaki ,  Tsubasa Miki ,  Fumiteru Asai ,  Tomokazu Takahashi ,  Toshio Shintani ,  Akiyoshi Yamamoto

发明人： Takatoshi Sasaki ,  Tsubasa Miki ,  Fumiteru Asai ,  Tomokazu Takahashi ,  Toshio Shintani ,  Akiyoshi Yamamoto

IPC分类号： B65D65/28 ,  B32B7/12

CPC分类号： H01L21/6836 ,  B23K26/146 ,  B23K26/40 ,  B23K2103/50 ,  C09J7/20 ,  C09J2201/20 ,  C09J2203/326 ,  C09J2407/00 ,  C09J2409/00 ,  C09J2423/006 ,  C09J2433/00 ,  H01L2221/68327 ,  Y10T428/15 ,  Y10T428/28 ,  Y10T428/2852

摘要： An adhesive sheet for water jet laser dicing, comprises an adhesive layer laminated on a base film, wherein the adhesive constituting the adhesive layer is an energy radiation curing type adhesive, and said adhesive sheet has an adhesive strength of at least 1.5 N/20 mm.

摘要翻译： 一种用于水射流激光切割的粘合片，包括层压在基膜上的粘合剂层，其中构成粘合剂层的粘合剂是能量辐射固化型粘合剂，并且所述粘合片具有至少1.5N / 20mm的粘合强度 。

公开(公告)号：US20090311474A1

公开(公告)日：2009-12-17

申请号：US12307882

申请日：2008-04-15

申请人： Tomokazu Takahashi ,  Fumiteru Asai ,  Toshio Shintani ,  Takatoshi Sasaki ,  Akiyoshi Yamamoto ,  Tsubasa Miki

发明人： Tomokazu Takahashi ,  Fumiteru Asai ,  Toshio Shintani ,  Takatoshi Sasaki ,  Akiyoshi Yamamoto ,  Tsubasa Miki

IPC分类号： B32B3/10

CPC分类号： H01L21/67132 ,  C09J7/20 ,  C09J2201/20 ,  C09J2205/31 ,  H01L21/67092 ,  Y10T428/24331

摘要： An object of the present invention is to provide an adhesive sheet which, through improvement in the permeability of liquids originating in a liquid stream during water jet laser dicing, allows chips, IC components, or the like to be detached, prevents machining precision from being compromised such as by chipping or the scattering of chips and the like, and allows extremely thin semiconductor wafers or materials to be processed. The adhesive sheet for water jet laser dicing of the present invention comprises an adhesive layer laminated on a base film, the base film made of mesh fiber.

摘要翻译： 本发明的目的是提供一种粘合片，其通过在喷水激光切割期间通过提高液体流中的液体的渗透性而允许芯片，IC部件等被分离，从而防止加工精度 例如通过切片或芯片等的散射而受到损害，并且允许非常薄的半导体晶片或材料被加工。 本发明的喷水激光切割用粘合片包括层压在基膜上的粘合剂层，由网状纤维构成的基膜。