摘要:
A semiconductor device includes first and second assembled bodies (12A, 12B). The first assembled body is provided with a first semiconductor chip, a high voltage bus bar (21) connected to one surface of the first semiconductor chip, a first metal wiring board (24-1) connected to the other surface of the first semiconductor chip with a bonding wire, and a third metal wiring board (24-3) connected to the first metal wiring board. The second assembled body is provided with a second semiconductor chip, a low voltage bus bar (23) connected to one surface of the second semiconductor chip with a bonding wire, a second metal wiring board (24-2) connected to the other surface of the second semiconductor chip, and a fourth metal wiring board (24-4) connected by being returned from an end portion of the second metal wiring board and arranged in parallel to the second metal wiring board. The first assembled body and the second assembled body are arranged in a stacked structure wherein the assembled bodies are being separated. Inductance of a main circuit is reduced by the semiconductor module structure.
摘要:
A semiconductor device is composed of a pair of semiconductor chips (402, 404) arranged parallel on the same flat plane; a high voltage bus bar (21) bonded on the surface on the collector side of one semiconductor chip (402); a low voltage bus bar (23) connected to the surface on the emitter side of the other semiconductor chip (404) with a bonding wire (27); a first metal wiring board (24-1) connected to the surface on the emitter side of the semiconductor chip (402) with a bonding wire (26); a second metal wiring board (24-2) bonded on the surface on the collector side of the semiconductor chip (404); a third metal wiring board (24-3) connected to the first metal wiring board (24-1); a fourth metal wiring board (24-4) connected by being bent from an end portion of the second metal wiring board (24-2); and an output bus bar (24) having output terminals (405) extending from each end portion of the third metal wiring board (24-3) and that of the fourth metal wiring board (24-4).
摘要:
A semiconductor device includes first and second assembled bodies (12A, 12B). The first assembled body is provided with a first semiconductor chip, a high voltage bus bar (21) connected to one surface of the first semiconductor chip, a first metal wiring board (24-1) connected to the other surface of the first semiconductor chip with a bonding wire, and a third metal wiring board (24-3) connected to the first metal wiring board. The second assembled body is provided with a second semiconductor chip, a low voltage bus bar (23) connected to one surface of the second semiconductor chip with a bonding wire, a second metal wiring board (24-2) connected to the other surface of the second semiconductor chip, and a fourth metal wiring board (24-4) connected by being returned from an end portion of the second metal wiring board and arranged in parallel to the second metal wiring board. The first assembled body and the second assembled body are arranged in a stacked structure wherein the assembled bodies are being separated. Inductance of a main circuit is reduced by the semiconductor module structure.
摘要:
A semiconductor device is composed of a pair of semiconductor chips (402, 404) arranged parallel on the same flat plane; a high voltage bus bar (21) bonded on the surface on the collector side of one semiconductor chip (402); a low voltage bus bar (23) connected to the surface on the emitter side of the other semiconductor chip (404) with a bonding wire (27); a first metal wiring board (24-1) connected to the surface on the emitter side of the semiconductor chip (402) with a bonding wire (26); a second metal wiring board (24-2) bonded on the surface on the collector side of the semiconductor chip (404); a third metal wiring board (24-3) connected to the first metal wiring board (24-1); a fourth metal wiring board (24-4) connected by being bent from an end portion of the second metal wiring board (24-2); and an output bus bar (24) having output terminals (405) extending from each end portion of the third metal wiring board (24-3) and that of the fourth metal wiring board (24-4).
摘要:
The present invention provides a construction material preservative for wood and the like that retains preservative effects over a long period of time and continuously demonstrates those effects even at low concentrations even when using in combination with an insecticide. The construction material preservative contains a water-soluble silver-amino acid complex composed of 1 molar part of silver and 1 to 3 molar parts of amino acid.
摘要:
A planar lightwave circuit and an optical receiver which reduce degradation in signal quality is provided.A planar lightwave circuit includes: a substrate with a straight groove formed therein; a signal light input port which is formed in the substrate and receives signal light; a first planar filter part which is fitted into the groove and separates the signal light into a signal light component including a first polarization state and that including a second polarization state; a second planar filter part which is fitted into the groove and separates the local oscillator light into a local oscillator light component including the first polarization state and that including the second polarization state; a first interference part formed in the substrate; a second interference part which is formed on a side of the substrate opposite to the side of the first interference part across the groove; a first waveguide which is connected to the signal light input port and also to a reflection surface of the first planar filter part; a second and a third waveguide; a fourth waveguide which is connected to the local oscillator light input port and also to a reflection surface of the second planar filter part; and a fifth and a sixth waveguide.
摘要:
An image formation device includes a receiving section, a formation section, a fixing section, a switching section, and a controller. The receiving section receives image formation data including image data, and sheet data which includes designations of a sheet and a corresponding fixing pressure. The formation section forms a toner image on the sheet. The fixing section fixes the toner image on the sheet. The switching section switches the fixing pressure between a first or second fixing pressure. When the fixing pressure is switched to the second fixing pressure and the fixing pressure designated by the sheet data is the first fixing pressure, the controller performs a mandatory image formation that includes a low-speed control that conveys the sheet at a speed lower than that for the first fixing pressure, and/or a toner suppression control that performs image formation with a smaller amount of toner than in normal.
摘要:
In an optical waveguide device of the present invention, optical element mount (17) includes first base block (19a) for supporting first optical element (18a) and second base block (19b) for supporting second optical element (18b) that has an active layer depth smaller than that of first optical element (18a). Second base block (19b) is formed from stacks of upper clad layers whose number of stacks is larger than that of first base block (19a). Difference (h1) in height between the first and second base blocks is equal to difference (d1−d2) in active layer depth between the first and second optical elements.
摘要:
An optical waveguide device includes: a substrate; an optical element arranged on the substrate; and an optical circuit part having an optical waveguide formed on the substrate. The optical circuit part includes: a core whose optical axis is matched with the optical element; and a dummy core arranged on a same layer to the core and exposed on a side being not opposed to the optical element when the optical element is arranged on the substrate. The relative position between the optical waveguide and the optical element can be recognized by observing the dummy core. The planar shape of the optical circuit has a convex portion. The width of the convex portion and the width of the optical element are same in the opposing edge face where the optical element and the core is opposed to one another.
摘要:
According to the present invention, there is provided a method for preparing an optically active compound, characterized in that said method comprises permitting a mixture of optical isomers relative to the carbon atom in the β-position in relation to the carbon atom bound to an esterified hydroxy group of an enol ester to hydrolyse either one optical isomer preferentially in the presence of an enzyme and allowing the carbonyl compound resulting from such hydrolysis to enrich the proportion of its isomer having either one configuration in the β-position in relation to the carbonyl group or allowing the enol ester left non-hydrolyzed to enrich the proportion of its isomer having either one configuration on the carbon atom in the β-position in relation to the carbon atom to which the esterified hydroxyl group bonds.