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公开(公告)号:US20140175454A1
公开(公告)日:2014-06-26
申请号:US14105569
申请日:2013-12-13
Applicant: GAN SYSTEMS INC.
Inventor: John ROBERTS , Greg KLOWAK
IPC: H01L25/18
CPC classification number: H03K17/687 , H01F19/08 , H01L23/49524 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L23/645 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/18 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05555 , H01L2224/0557 , H01L2224/06051 , H01L2224/06131 , H01L2224/06181 , H01L2224/13147 , H01L2224/16145 , H01L2224/32245 , H01L2224/40245 , H01L2224/48137 , H01L2224/48195 , H01L2224/48247 , H01L2224/49107 , H01L2224/49175 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/12035 , H01L2924/1204 , H01L2924/1305 , H01L2924/1306 , H01L2924/13064 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/19104 , H01L2924/30107 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: Devices and systems comprising driver circuits are disclosed for MOSFET driven, normally-on gallium nitride (GaN) power transistors. Preferably, a low power, high speed CMOS driver circuit with an integrated low voltage, lateral MOSFET driver is series coupled, in a hybrid cascode arrangement to a high voltage GaN HEMT, for improved control of noise and voltage transients. Co-packaging of a GaN transistor die and a CMOS driver die using island topology contacts, through substrate vias, and a flip-chip, stacked configuration provides interconnections with low inductance and resistance, and provides effective thermal management. Co-packaging of a CMOS input interface circuit with the CMOS driver and GaN transistor allows for a compact, integrated CMOS driver with enhanced functionality including shut-down and start-up conditioning for safer operation, particularly for high voltage and high current switching. Preferred embodiments also provide isolated, self-powered, high speed driver devices, with reduced input losses.
Abstract translation: 公开了包括驱动电路的器件和系统,用于MOSFET驱动的常规氮化镓(GaN)功率晶体管。 优选地,具有集成的低电压横向MOSFET驱动器的低功率高速CMOS驱动器电路以混合共源共栅布置串联耦合到高电压GaN HEMT,用于改善噪声和电压瞬变的控制。 使用岛拓扑触点,通过衬底通孔和倒装芯片堆叠配置来共同封装GaN晶体管管芯和CMOS驱动器管芯,提供低电感和电阻的互连,并提供有效的热管理。 CMOS输入接口电路与CMOS驱动器和GaN晶体管的共同封装允许具有增强功能的紧凑集成CMOS驱动器,包括关闭和启动调节,以实现更安全的操作,特别是对于高电压和高电流切换。 优选实施例还提供具有减小的输入损耗的隔离,自供电的高速驱动器件。