公开(公告)号：US20140084191A1

公开(公告)日：2014-03-27

申请号：US13838824

申请日：2013-03-15

Applicant: GENESIS PHOTONICS INC

Inventor： TAI-CHENG TSAI ,  TAI-WEI WU ,  GWO-JIUN SHEU ,  SHOU-WEN HSU ,  YUN-LI LI

IPC: G01J1/42

CPC classification number: G01J1/42 ,  G01J1/04 ,  G01J1/0407 ,  G01J1/0411 ,  G01J1/0422 ,  G01J1/0425 ,  G01J1/4257 ,  G01J2001/4247 ,  G01R31/2635 ,  G02B19/0066 ,  G02B19/0076

Abstract: A detection apparatus comprising a chuck, a probe device, a light-sensing device and a light-concentrating unit is disclosed. The chuck bears light-emitting diode chips. The probe device includes two probes and a power supply. The end point of the probes respectively electrically connects with one of the light-emitting diode chips and the power supply to make the light-emitting diode chip emits a plurality of light beams. The light-sensing device is disposed on one side of a light-emitting surface of the light-emitting diode chip so as to receive the light beams emitted by the light-emitting diode chip. The light-concentrating unit is disposed between the light-emitting diode chip and the light-sensing device to concentrate the light beams emitted by the light-emitting diode chip.

Abstract translation: 公开了一种包括卡盘，探针装置，感光装置和聚光装置的检测装置。 卡盘带有发光二极管芯片。 探头装置包括两个探针和一个电源。 探针的终点分别与发光二极管芯片和电源中的一个电连接，以使发光二极管芯片发射多个光束。 光感测装置设置在发光二极管芯片的发光面的一侧，以便接收由发光二极管芯片发射的光束。 光集中单元设置在发光二极管芯片和感光装置之间，以集中由发光二极管芯片发射的光束。

公开(公告)号：US20140159733A1

公开(公告)日：2014-06-12

申请号：US13836493

申请日：2013-03-15

Applicant: GENESIS PHOTONICS INC

Inventor： TAI-CHENG TSAI ,  TAI-WEI WU ,  HSIN-HUNG LIN ,  PING-TSUNG TSAI ,  GWO-JIUN SHEU ,  SHOU-WEN HSU ,  YUN-LI LI

IPC: G01R31/44

CPC classification number: G01R31/44 ,  G01J1/0223 ,  G01J2001/0481 ,  G01J2001/4247 ,  G01R31/2635

Abstract: A detection apparatus for light-emitting diode chip comprising a light-collecting apparatus having an opening, a bracing component and a probing device is disclosed. The bracing component is designed to bear at least one light-emitting diode chip. The probing device comprises a power supply and at least two flexible current-transporting elements. The two ends of the current-transporting elements are respectively electrically connected to the light-emitting diode chip and the power supply to enable the light-emitting diode chip to emit light beams. Besides, the detection apparatus for light-emitting diode chip of the present invention further comprises a thimble to push the light-emitting diode chip into the inside of the light-collecting apparatus via the opening such that the light beams emitted by the light-emitting diode chip are collected by the light-collecting apparatus.

Abstract translation: 公开了一种发光二极管芯片的检测装置，其包括具有开口的光收集装置，支撑部件和探测装置。 支撑部件被设计成承载至少一个发光二极管芯片。 探测装置包括电源和至少两个柔性电流传输元件。 电流传输元件的两端分别电连接到发光二极管芯片和电源，以使得发光二极管芯片能够发射光束。 此外，本发明的发光二极管芯片的检测装置还包括通过开口将发光二极管芯片推入集光装置的内部的套管，使得由发光二极管芯片发出的光束 二极管芯片由光收集装置收集。

公开(公告)号：US20140084931A1

公开(公告)日：2014-03-27

申请号：US13836762

申请日：2013-03-15

Applicant: GENESIS PHOTONICS INC

Inventor： TAI-WEI WU ,  TAI-CHENG TSAI ,  GWO-JIUN SHEU ,  SHOU-WEN HSU ,  YUN-LI LI

IPC: G01R31/26 ,  G01R1/073 ,  G01R1/04 ,  G01R31/44

CPC classification number: G01R31/2635 ,  G01J1/0411 ,  G01J2001/4247 ,  G01R1/04 ,  G01R1/073 ,  G01R31/44 ,  G02B3/00 ,  H01L33/00

Abstract: A detection apparatus for light-emitting diode chips comprises a transparent chuck with the light-concentration capability, a probing device and a light-sensing device. The transparent chuck comprises a light-incident plane and a light-emitting plane. The light-incident plane is used to bear a plurality of light-emitting diode chips under detection. The probing device comprises two probe pins and a power supply. The two ends of each probe pin is electrically connected to one of the light-emitting diode chips and the power supply, respectively, to make the light-emitting diode chip emit a plurality of light beams. The light beams penetrate through the transparent chuck by emitting into the incident plane of the transparent chuck. The light-sensing device is disposed on one side of the light-emitting plane of the transparent chuck to receive the light beams which penetrate through the transparent chuck.

Abstract translation: 用于发光二极管芯片的检测装置包括具有光集中能力的透明卡盘，探测装置和光感测装置。 透明卡盘包括光入射面和发光面。 光入射面用于承受检测下的多个发光二极管芯片。 探测装置包括两个探针和电源。 每个探针的两端分别电连接到发光二极管芯片和电源之一，以使发光二极管芯片发射多个光束。 光束穿过透明卡盘通过发射到透明卡盘的入射平面中。 光感测装置设置在透明卡盘的发光平面的一侧，以容纳透过透明卡盘的光束。