公开(公告)号：US20140084191A1

公开(公告)日：2014-03-27

申请号：US13838824

申请日：2013-03-15

Applicant: GENESIS PHOTONICS INC

Inventor： TAI-CHENG TSAI ,  TAI-WEI WU ,  GWO-JIUN SHEU ,  SHOU-WEN HSU ,  YUN-LI LI

IPC: G01J1/42

CPC classification number: G01J1/42 ,  G01J1/04 ,  G01J1/0407 ,  G01J1/0411 ,  G01J1/0422 ,  G01J1/0425 ,  G01J1/4257 ,  G01J2001/4247 ,  G01R31/2635 ,  G02B19/0066 ,  G02B19/0076

Abstract: A detection apparatus comprising a chuck, a probe device, a light-sensing device and a light-concentrating unit is disclosed. The chuck bears light-emitting diode chips. The probe device includes two probes and a power supply. The end point of the probes respectively electrically connects with one of the light-emitting diode chips and the power supply to make the light-emitting diode chip emits a plurality of light beams. The light-sensing device is disposed on one side of a light-emitting surface of the light-emitting diode chip so as to receive the light beams emitted by the light-emitting diode chip. The light-concentrating unit is disposed between the light-emitting diode chip and the light-sensing device to concentrate the light beams emitted by the light-emitting diode chip.

Abstract translation: 公开了一种包括卡盘，探针装置，感光装置和聚光装置的检测装置。 卡盘带有发光二极管芯片。 探头装置包括两个探针和一个电源。 探针的终点分别与发光二极管芯片和电源中的一个电连接，以使发光二极管芯片发射多个光束。 光感测装置设置在发光二极管芯片的发光面的一侧，以便接收由发光二极管芯片发射的光束。 光集中单元设置在发光二极管芯片和感光装置之间，以集中由发光二极管芯片发射的光束。

公开(公告)号：US20140159733A1

公开(公告)日：2014-06-12

申请号：US13836493

申请日：2013-03-15

Applicant: GENESIS PHOTONICS INC

Inventor： TAI-CHENG TSAI ,  TAI-WEI WU ,  HSIN-HUNG LIN ,  PING-TSUNG TSAI ,  GWO-JIUN SHEU ,  SHOU-WEN HSU ,  YUN-LI LI

IPC: G01R31/44

CPC classification number: G01R31/44 ,  G01J1/0223 ,  G01J2001/0481 ,  G01J2001/4247 ,  G01R31/2635

Abstract: A detection apparatus for light-emitting diode chip comprising a light-collecting apparatus having an opening, a bracing component and a probing device is disclosed. The bracing component is designed to bear at least one light-emitting diode chip. The probing device comprises a power supply and at least two flexible current-transporting elements. The two ends of the current-transporting elements are respectively electrically connected to the light-emitting diode chip and the power supply to enable the light-emitting diode chip to emit light beams. Besides, the detection apparatus for light-emitting diode chip of the present invention further comprises a thimble to push the light-emitting diode chip into the inside of the light-collecting apparatus via the opening such that the light beams emitted by the light-emitting diode chip are collected by the light-collecting apparatus.

Abstract translation: 公开了一种发光二极管芯片的检测装置，其包括具有开口的光收集装置，支撑部件和探测装置。 支撑部件被设计成承载至少一个发光二极管芯片。 探测装置包括电源和至少两个柔性电流传输元件。 电流传输元件的两端分别电连接到发光二极管芯片和电源，以使得发光二极管芯片能够发射光束。 此外，本发明的发光二极管芯片的检测装置还包括通过开口将发光二极管芯片推入集光装置的内部的套管，使得由发光二极管芯片发出的光束 二极管芯片由光收集装置收集。

公开(公告)号：US20140159732A1

公开(公告)日：2014-06-12

申请号：US13836181

申请日：2013-03-15

Applicant: GENESIS PHOTONICS INC

Inventor： TAI-WEI WU ,  TAI-CHENG TSAI ,  Hsin-Hung Lin ,  Ping-Tsung Tsai ,  Pei-Yi Huang ,  Gwo-Jiun Sheu ,  Shou-Wen Hsu ,  YUN-LI LI

IPC: G01R31/44

CPC classification number: G01R31/44 ,  G01J2001/4252 ,  G01R31/2635

Abstract: A detection apparatus for light-emitting diode chip comprising a substrate with the function of photoelectric conversion and a probing device is disclosed. The substrate is designed to bear at least one light-emitting diode chip. The probing device comprises a power supply and at least two conductive elements. The two ends of the conductive elements are respectively electrically connected to the light-emitting diode chip and the power supply to enable the light-emitting diode chip to emit light beams. Some of the light beams are emitted from the light-emitting diode chip toward the substrate such that the light beams emitted by the light-emitting diode chip are converted into an electric signal by the substrate.

Abstract translation: 公开了一种包括具有光电转换功能的基板和探测装置的发光二极管芯片的检测装置。 基板被设计成承载至少一个发光二极管芯片。 探测装置包括电源和至少两个导电元件。 导电元件的两端分别电连接到发光二极管芯片和电源，以使得发光二极管芯片能够发射光束。 一些光束从发光二极管芯片朝向基板发射，使得由发光二极管芯片发射的光束被基板转换成电信号。

公开(公告)号：US20140084931A1

公开(公告)日：2014-03-27

申请号：US13836762

申请日：2013-03-15

Applicant: GENESIS PHOTONICS INC

Inventor： TAI-WEI WU ,  TAI-CHENG TSAI ,  GWO-JIUN SHEU ,  SHOU-WEN HSU ,  YUN-LI LI

IPC: G01R31/26 ,  G01R1/073 ,  G01R1/04 ,  G01R31/44

CPC classification number: G01R31/2635 ,  G01J1/0411 ,  G01J2001/4247 ,  G01R1/04 ,  G01R1/073 ,  G01R31/44 ,  G02B3/00 ,  H01L33/00

Abstract: A detection apparatus for light-emitting diode chips comprises a transparent chuck with the light-concentration capability, a probing device and a light-sensing device. The transparent chuck comprises a light-incident plane and a light-emitting plane. The light-incident plane is used to bear a plurality of light-emitting diode chips under detection. The probing device comprises two probe pins and a power supply. The two ends of each probe pin is electrically connected to one of the light-emitting diode chips and the power supply, respectively, to make the light-emitting diode chip emit a plurality of light beams. The light beams penetrate through the transparent chuck by emitting into the incident plane of the transparent chuck. The light-sensing device is disposed on one side of the light-emitting plane of the transparent chuck to receive the light beams which penetrate through the transparent chuck.

Abstract translation: 用于发光二极管芯片的检测装置包括具有光集中能力的透明卡盘，探测装置和光感测装置。 透明卡盘包括光入射面和发光面。 光入射面用于承受检测下的多个发光二极管芯片。 探测装置包括两个探针和电源。 每个探针的两端分别电连接到发光二极管芯片和电源之一，以使发光二极管芯片发射多个光束。 光束穿过透明卡盘通过发射到透明卡盘的入射平面中。 光感测装置设置在透明卡盘的发光平面的一侧，以容纳透过透明卡盘的光束。

公开(公告)号：US20130134464A1

公开(公告)日：2013-05-30

申请号：US13661272

申请日：2012-10-26

Applicant: GENESIS PHOTONICS INC.

Inventor： YU-YUN LO ,  YI-RU HUANG ,  CHIH-LING WU ,  TZU-YANG LIN ,  YUN-LI LI

IPC: H01L33/60

CPC classification number: H01L33/42 ,  H01L33/38 ,  H01L33/405 ,  H01L33/46 ,  H01L2224/14 ,  H01L2933/0016

Abstract: The present invention relates to a light emitting diode (LED) and a flip-chip packaged LED device. The present invention provides an LED device. The LED device is flipped on and connected electrically with a packaging substrate and thus forming the flip-chip packaged LED device. The LED device mainly has an Ohmic-contact layer and a planarized buffer layer between a second-type doping layer and a reflection layer. The Ohmic-contact layer improves the Ohmic-contact characteristics between the second-type doping layer and the reflection layer without affecting the light emitting efficiency of the LED device and the flip-chip packaged LED device. The planarized buffer layer id disposed between the Ohmic-contact layer and the reflection layer for smoothening the Ohmic-contact layer and hence enabling the reflection layer to adhere to the planarized buffer layer smoothly. Thereby, the reflection layer can have the effect of mirror reflection and the scattering phenomenon on the reflected light can be reduced as well.

Abstract translation: 本发明涉及发光二极管（LED）和倒装芯片封装的LED器件。 本发明提供一种LED装置。 LED装置被翻转并与封装基板电连接，从而形成倒装芯片封装的LED器件。 LED装置主要在第二种掺杂层和反射层之间具有欧姆接触层和平坦化缓冲层。 欧姆接触层改善了第二型掺杂层和反射层之间的欧姆接触特性，而不影响LED器件和倒装芯片封装的LED器件的发光效率。 设置在欧姆接触层和反射层之间的平坦化缓冲层id，用于使欧姆接触层平滑，从而使反射层平滑地粘附到平坦化缓冲层。 因此，反射层可以具有镜面反射的效果，并且也可以减小反射光上的散射现象。