公开(公告)号：US20190066812A1

公开(公告)日：2019-02-28

申请号：US15685667

申请日：2017-08-24

Applicant: GLOBALFOUNDRIES INC.

Inventor： Kong Boon Yeap ,  Tian Shen ,  Ronald Gene Filippi, JR. ,  Seungman Choi ,  Linjun Cao

IPC: G11C17/18 ,  G11C17/16

Abstract: An e-fuse structure including a circuit having an e-fuse operably coupling the circuit to a power source, and a redundant circuit for operably coupling the power source in response to opening of the e-fuse, wherein the e-fuse opens in response to a time-dependent dielectric breakdown (TDDB) percolation current in proximity to the circuit migrating through the e-fuse. A method of programming such an e-fuse structure is also disclosed.

公开(公告)号：US20190123005A1

公开(公告)日：2019-04-25

申请号：US15793130

申请日：2017-10-25

Applicant: GLOBALFOUNDRIES INC.

Inventor： Erdem Kaltalioglu ,  Ping-Chuan Wang ,  Ronald Gene Filippi, JR.

IPC: H01L23/00 ,  H01L23/48 ,  H01L21/308

CPC classification number: H01L24/05 ,  H01L21/3081 ,  H01L21/486 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L2021/60022 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/0556 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/11462

Abstract: The present disclosure relates generally to flip chip technology and more particularly, to a method for fabricating a mechanically anchored controlled collapse chip connection (C4) pad on a semiconductor structure and a structure formed thereby. In an embodiment, a method is disclosed that includes forming a C4 pad on a patterned dielectric layer having grooves therein, the grooves providing an interfacial surface area between the patterned dielectric layer and the C4 pad sufficient to inhibit the C4 pad from delaminating during thermal expansion or contraction.