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公开(公告)号:US10084057B2
公开(公告)日:2018-09-25
申请号:US15237794
申请日:2016-08-16
Applicant: GLOBALFOUNDRIES Inc.
Inventor: Sven Beyer , Martin Trentzsch , Stefan Flachowsky , Axel Henke
CPC classification number: H01L29/516 , H01L21/02181 , H01L21/02266 , H01L21/0228 , H01L21/02321 , H01L21/823857 , H01L21/84 , H01L27/1159 , H01L27/1203 , H01L29/0642 , H01L29/40111 , H01L29/4908 , H01L29/517 , H01L29/66628 , H01L29/78391 , H01L29/78654
Abstract: The present disclosure provides in one aspect a semiconductor device including a substrate structure comprising an active semiconductor material formed over a base substrate and a buried insulating material formed between the active semiconductor material and the base substrate, a ferroelectric gate structure disposed over the active semiconductor material in an active region of the substrate structure, the ferroelectric gate structure comprising a gate electrode and a ferroelectric material layer, and a contact region formed in the base substrate under the ferroelectric gate structure.
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公开(公告)号:US20180053832A1
公开(公告)日:2018-02-22
申请号:US15237794
申请日:2016-08-16
Applicant: GLOBALFOUNDRIES Inc.
Inventor: Sven Beyer , Martin Trentzsch , Stefan Flachowsky , Axel Henke
CPC classification number: H01L29/516 , H01L21/02266 , H01L21/0228 , H01L21/28185 , H01L21/28291 , H01L21/84 , H01L27/1159 , H01L27/1203 , H01L29/0642 , H01L29/517 , H01L29/66628 , H01L29/78391 , H01L29/786
Abstract: The present disclosure provides in one aspect a semiconductor device including a substrate structure comprising an active semiconductor material formed over a base substrate and a buried insulating material formed between the active semiconductor material and the base substrate, a ferroelectric gate structure disposed over the active semiconductor material in an active region of the substrate structure, the ferroelectric gate structure comprising a gate electrode and a ferroelectric material layer, and a contact region formed in the base substrate under the ferroelectric gate structure.
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