公开(公告)号：US20170373019A1

公开(公告)日：2017-12-28

申请号：US15193700

申请日：2016-06-27

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Mohamed RABIE

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L23/585 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/10125 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00012 ,  H01L2924/014

Abstract: A method for producing semiconductor devices including reinforcing metal tiles and the resulting semiconductor package are provided. Embodiments include forming one or more reinforcing metal tiles at corners of an upper portion of a metal stack of semiconductor die during manufacturing of the semiconductor die; and attaching the semiconductor die to a packaging substrate.

公开(公告)号：US20170033061A1

公开(公告)日：2017-02-02

申请号：US14812340

申请日：2015-07-29

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Mohamed RABIE ,  Premachandran CHIRAYARIKATHUVEEDU

IPC: H01L23/64 ,  H01L23/528 ,  H01L21/768 ,  H01L21/3205 ,  H01L23/58 ,  H01L23/48

CPC classification number: H01L23/528 ,  H01L21/32055 ,  H01L21/76877 ,  H01L23/481 ,  H01L23/585 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06544 ,  H01L2225/06565

Abstract: Methods for creating effective noise reducing structures in an IC device to significantly reduce TSV-induced noise in an IC substrate of the IC device and the resulting device are disclosed. Embodiments include providing a plurality of circuits on an upper surface of an IC substrate; providing an active TSV in proximity to the circuits, wherein the TSV extends through the IC substrate; forming a noise reducing structure connected to a perimeter of a vertical segment of the active TSV; and connecting the noise reducing structure to an electrical ground node in common with the circuits.

Abstract translation: 公开了一种用于在IC器件中产生有效的降噪结构以显着降低IC器件的IC衬底和所得器件中的TSV感应噪声的方法。 实施例包括在IC基板的上表面上设置多个电路; 在所述电路附近提供有源TSV，其中所述TSV延伸穿过所述IC基板; 形成连接到有源TSV的垂直段的周边的降噪结构; 并将降噪结构连接到与电路共同的电接地节点。