公开(公告)号：US20180323067A1

公开(公告)日：2018-11-08

申请号：US15587597

申请日：2017-05-05

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Jiehui Shu ,  Xusheng Yu ,  John H. Zhang ,  Xiaoqiang Zhang

IPC: H01L21/033 ,  H01L23/525 ,  H01L23/532 ,  H01L21/311

CPC classification number: H01L21/0337 ,  H01L21/31116 ,  H01L21/768 ,  H01L23/5256 ,  H01L23/53214 ,  H01L23/53228

Abstract: Interconnect structures and methods of fabricating an interconnect structure. A first mandrel line, a second mandrel line, and a non-mandrel line between the first mandrel line and the second mandrel line are provided. A first sidewall spacer is formed adjacent to a section of the first mandrel line and is arranged between the section of the first mandrel line and the non-mandrel line. A first cut is formed that extends partially across the non-mandrel line adjacent to the first spacer to narrow a section of the non-mandrel line. The section of the first mandrel line is removed selective to the first sidewall spacer to form a second cut. An interconnect is formed using the non-mandrel line. The interconnect includes a narrowed section coinciding with a location of the narrowed section of the non-mandrel line.

公开(公告)号：US10249496B2

公开(公告)日：2019-04-02

申请号：US15587597

申请日：2017-05-05

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Jiehui Shu ,  Xusheng Yu ,  John H. Zhang ,  Xiaoqiang Zhang

IPC: H01L21/033 ,  H01L23/525 ,  H01L23/532 ,  H01L21/311

Abstract: Interconnect structures and methods of fabricating an interconnect structure. A first mandrel line, a second mandrel line, and a non-mandrel line between the first mandrel line and the second mandrel line are provided. A first sidewall spacer is formed adjacent to a section of the first mandrel line and is arranged between the section of the first mandrel line and the non-mandrel line. A first cut is formed that extends partially across the non-mandrel line adjacent to the first spacer to narrow a section of the non-mandrel line. The section of the first mandrel line is removed selective to the first sidewall spacer to form a second cut. An interconnect is formed using the non-mandrel line. The interconnect includes a narrowed section coinciding with a location of the narrowed section of the non-mandrel line.