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    METHODS AND APPARATUS FOR POLISHING AN EDGE AND/OR NOTCH OF A SUBSTRATE
    2.
    发明申请
    METHODS AND APPARATUS FOR POLISHING AN EDGE AND/OR NOTCH OF A SUBSTRATE 审中-公开
    用于抛光衬底和/或衬底的方法和装置

    公开(公告)号：US20100105299A1

    公开(公告)日：2010-04-29

    申请号：US12258242

    申请日：2008-10-24

    申请人： Gary C. Ettinger ,  Paul D. Butterfield ,  Antoine P. Manens ,  Sen-Hou Ko

    发明人： Gary C. Ettinger ,  Paul D. Butterfield ,  Antoine P. Manens ,  Sen-Hou Ko

    IPC分类号： B24B21/00

    CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B49/16

    摘要： Apparatus and methods are provided to polish a substrate. In some aspects, the invention includes a polishing head adapted to apply a polishing tape against at least one of a substrate edge and a notch in the substrate edge. The polishing head includes a polisher coupled to the polishing head, wherein the polisher has a hollow portion and is adapted to conform to a shape of at least one of the substrate edge and the notch. Numerous other aspects are provided.

    摘要翻译： 提供设备和方法来抛光基底。 在一些方面，本发明包括一种抛光头，其适于将抛光带应用于衬底边缘中的衬底边缘和凹口中的至少一个。 抛光头包括连接到抛光头的抛光机，其中抛光机具有中空部分并且适于符合基板边缘和凹口中的至少一个的形状。 提供了许多其他方面。

    METHODS AND APPARATUS FOR SUBSTRATE EDGE POLISHING USING A POLISHING ARM
    9.
    发明申请
    METHODS AND APPARATUS FOR SUBSTRATE EDGE POLISHING USING A POLISHING ARM 审中-公开
    使用抛光臂的基板边缘抛光的方法和装置

    公开(公告)号：US20080293335A1

    公开(公告)日：2008-11-27

    申请号：US12124151

    申请日：2008-05-21

    申请人： Gary C. Ettinger ,  Paul D. Butterfield ,  Antoine P. Manens

    发明人： Gary C. Ettinger ,  Paul D. Butterfield ,  Antoine P. Manens

    IPC分类号： B24B1/00

    CPC分类号： B24B21/004 ,  B24B9/065 ,  B24B27/0038

    摘要： Apparatus and methods adapted to polish an edge of a substrate include (1) a polishing tape having a polishing surface and a second surface and (2) a polishing arm having a longitudinal axis and adapted to force the polishing surface of the polishing tape into contact with an edge of a substrate. The polishing arm includes i) a polishing head adapted to contact the second surface of the polishing tape, ii) a rocker arm coupled to the polishing head and adapted to rotate the polishing head around the longitudinal axis of the polishing arm and iii) a load arm extending adjacent to the rocker arm and adapted to move the polishing head in a direction perpendicular to the longitudinal axis of the polishing arm. Numerous other aspects are provided.

    摘要翻译： 适用于抛光衬底边缘的装置和方法包括（1）具有抛光表面和第二表面的抛光带和（2）具有纵向轴线并且适于强制研磨带的抛光表面接触的抛光臂 具有基底的边缘。 抛光臂包括：i）适于接触抛光带的第二表面的抛光头，ii）联接到抛光头的摇臂，其适于围绕抛光臂的纵向轴线旋转抛光头，以及iii）负载 臂相对于摇臂延伸并且适于沿着与抛光臂的纵向轴线垂直的方向移动抛光头。 提供了许多其他方面。

    METHODS AND APPARATUS TO MINIMIZE THE EFFECT OF TAPE TENSION IN ELECTRONIC DEVICE POLISHING
    10.
    发明申请
    METHODS AND APPARATUS TO MINIMIZE THE EFFECT OF TAPE TENSION IN ELECTRONIC DEVICE POLISHING 审中-公开
    最小化电子设备抛光中贴片张力的影响的方法和设备

    公开(公告)号：US20100105294A1

    公开(公告)日：2010-04-29

    申请号：US12603858

    申请日：2009-10-22

    申请人： Gary C. Ettinger ,  Wendy Luo ,  Antoine P. Manens

    发明人： Gary C. Ettinger ,  Wendy Luo ,  Antoine P. Manens

    IPC分类号： B24B9/02 ,  B24B21/02 ,  B24B21/20

    CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/20

    摘要： Methods and apparatus are provided for reducing tension on a polishing roller. In some aspects, a polishing head may be provided that is adapted to contact a substrate. The polishing head includes: a polishing unit having a polisher and at least one pair of tension distributors adapted to reduce tension on the polisher; and one or more pairs feed guides. Numerous other aspects are provided.

    摘要翻译： 提供了减少抛光辊张力的方法和装置。 在一些方面，可以提供适于接触基底的抛光头。 抛光头包括：具有抛光机的抛光单元和适于减小抛光机上的张力的至少一对张力分布器; 和一对或多对进给导轨。 提供了许多其他方面。