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公开(公告)号：US5892417A
公开(公告)日：1999-04-06
申请号：US775074
申请日：1996-12-27
申请人： Gary Carl Johnson , Michael J. Anderson , Gregory Jon Kennison , Jeffrey Eanes Christensen , Mark Phillip Popovich
发明人： Gary Carl Johnson , Michael J. Anderson , Gregory Jon Kennison , Jeffrey Eanes Christensen , Mark Phillip Popovich
IPC分类号： H03H9/10 , H03H9/64 , H03H9/05 , H01L41/053
CPC分类号： H03H9/1085 , H03H9/1092 , H03H9/64 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L24/45 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , Y10T29/42
摘要： A method for packaging an acoustic wave filter die, and an acoustic wave filter die packaged by the method. The method includes steps of providing an acoustic wave filter die having an active area disposed on a first surface thereof, providing a leadframe including a die flag and sealing the first surface to the die flag. The method also includes steps of molding a plastic package body about the die and the die flag and singulating the plastic body, the die and the die flag. The molding step desirably includes substeps of placing the acoustic wave filter die sealed to the leadframe in a mold, applying a thermosetting plastic material at a suitable temperature less than the glass transition temperature and at a suitable pressure to the acoustic wave filter die sealed to the leadframe in the mold and maintaining the suitable temperature for a suitable period of time.
摘要翻译： 一种用于封装声波滤波器芯片的方法，以及通过该方法封装的声波滤波器芯片。 该方法包括以下步骤：提供具有设置在其第一表面上的有源区的声波滤波器芯片，提供包括管芯标记并将第一表面密封到管芯标记的引线框架。 该方法还包括以下步骤：塑料封装体围绕模具和模具标记成型，并且分离塑料体，模具和模具标记。 成型步骤理想地包括将密封到引线框的声波滤波器模具放置在模具中的子步骤，在适合低于玻璃化转变温度的温度下，以合适的压力施加热固性塑料材料到密封到 引线框架在模具中并保持合适的温度一段适当的时间。
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公开(公告)号：US5702775A
公开(公告)日：1997-12-30
申请号：US578801
申请日：1995-12-26
CPC分类号： H03H9/1064 , H03H3/08 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , Y10T428/1095 , Y10T428/23 , Y10T428/232 , Y10T428/239 , Y10T428/31511 , Y10T428/3154 , Y10T428/31612 , Y10T428/31623 , Y10T428/31627 , Y10T428/31649 , Y10T428/31663 , Y10T428/31667 , Y10T428/31721 , Y10T428/31786
摘要： A method (38) for packaging a microelectronic device (10) and a device (10) packaged by the method (38). The method (38) includes a step of providing (42) a first material (16) on an active surface of the microelectronic device (10). The first material (16) has a first temperature coefficient of expansion. The method (38) also includes steps of heating (46) the microelectronic device (10) and the first material (16) to a predetermined first temperature and molding (48) a second material (20) about the microelectronic device (10) and the first material (16). The second material (20) has a second temperature coefficient of expansion less than that of the first material (16). A final step of cooling (50) the first material (16), the second material (20) and the microelectronic device (10) provides a packaged microelectronic device (30).
摘要翻译： 一种用于封装由所述方法（38）封装的微电子器件（10）和器件（10）的方法（38）。 方法（38）包括在微电子装置（10）的有源表面上提供（42）第一材料（16）的步骤。 第一材料（16）具有第一温度膨胀系数。 方法（38）还包括以下步骤：将微电子器件（10）和第一材料（16）加热到预定的第一温度并围绕微电子器件（10）模制（48）第二材料（20），以及 第一材料（16）。 第二材料（20）的第二温度膨胀系数小于第一材料（16）的膨胀系数。 冷却（50）第一材料（16），第二材料（20）和微电子器件（10）的最终步骤提供封装的微电子器件（30）。
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公开(公告)号：US5928598A
公开(公告)日：1999-07-27
申请号：US854239
申请日：1997-05-09
IPC分类号： H01L23/28 , H01L21/56 , H01L23/29 , H01L23/31 , H03H3/02 , H03H9/10 , H03H9/25 , B29C45/14 , B29C70/70
CPC分类号： H03H9/1064 , H03H3/08 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , Y10T428/1095 , Y10T428/23 , Y10T428/232 , Y10T428/239 , Y10T428/31511 , Y10T428/3154 , Y10T428/31612 , Y10T428/31623 , Y10T428/31627 , Y10T428/31649 , Y10T428/31663 , Y10T428/31667 , Y10T428/31721 , Y10T428/31786
摘要： A method (38) for packaging a microelectronic device (10) and a device (10) packaged by the method (38). The method (38) includes a step of providing (42) a first material (16) on an active surface of the microelectronic device (10). The first material (16) has a first temperature coefficient of expansion. The method (38) also includes steps of heating (46) the microelectronic device (10) and the first material (16) to a predetermined first temperature and molding (48) a second material (20) about the microelectronic device (10) and the first material (16). The second material (20) has a second temperature coefficient of expansion less than that of the first material (16). A final step of cooling (50) the first material (16), the second material (20) and the microelectronic device (10) provides a packaged microelectronic device (30).
摘要翻译： 一种用于封装由所述方法（38）封装的微电子器件（10）和器件（10）的方法（38）。 方法（38）包括在微电子器件（10）的有源表面上提供（42）第一材料（16）的步骤。 第一材料（16）具有第一温度膨胀系数。 方法（38）还包括以下步骤：将微电子器件（10）和第一材料（16）加热到预定的第一温度并围绕微电子器件（10）模制（48）第二材料（20），以及 第一材料（16）。 第二材料（20）的第二温度膨胀系数小于第一材料（16）的膨胀系数。 冷却（50）第一材料（16），第二材料（20）和微电子器件（10）的最终步骤提供封装的微电子器件（30）。
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公开(公告)号：US20110204464A1
公开(公告)日：2011-08-25
申请号：US13100004
申请日：2011-05-03
申请人： Bradley Morgan Haskett , John Patrick O'Connor , Mark Myron Miller , Sean Timothy Crowley , Jeffery Alan Miks , Mark Phillip Popovich
发明人： Bradley Morgan Haskett , John Patrick O'Connor , Mark Myron Miller , Sean Timothy Crowley , Jeffery Alan Miks , Mark Phillip Popovich
IPC分类号： H01L31/0203
CPC分类号： B81B7/0067 , B81B7/007 , B81B2201/042 , B81B2207/07 , B81C2203/0109 , H01L24/48 , H01L27/14618 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/14 , H01L2924/16235 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.
摘要翻译： 根据一个实施例，微光学装置包括电光电路和设置在基板的表面上的环形框架。 电光电路具有由窗口和邻近电光电路的至少一个边缘的互连区域封装的有源区域。 环形框架围绕窗户的外周延伸并且通过间隙与窗户分离，环形框架和电光电路形成用于将多个接合线放置的空腔，电光电路的互连 基质。
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公开(公告)号：US08445984B2
公开(公告)日：2013-05-21
申请号：US13100004
申请日：2011-05-03
申请人： Bradley Morgan Haskett , John Patrick O'Connor , Mark Myron Miller , Sean Timothy Crowley , Jeffrey Alan Miks , Mark Phillip Popovich
发明人： Bradley Morgan Haskett , John Patrick O'Connor , Mark Myron Miller , Sean Timothy Crowley , Jeffrey Alan Miks , Mark Phillip Popovich
IPC分类号： H01L31/0203
CPC分类号： B81B7/0067 , B81B7/007 , B81B2201/042 , B81B2207/07 , B81C2203/0109 , H01L24/48 , H01L27/14618 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/14 , H01L2924/16235 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.
摘要翻译： 根据一个实施例，微光学装置包括电光电路和设置在基板的表面上的环形框架。 电光电路具有由窗口和邻近电光电路的至少一个边缘的互连区域封装的有源区域。 环形框架围绕窗户的外周延伸并且通过间隙与窗户分离，环形框架和电光电路形成用于将多个接合线放置的空腔，电光电路的互连 基质。
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公开(公告)号：US07936033B2
公开(公告)日：2011-05-03
申请号：US12345421
申请日：2008-12-29
申请人： Bradley Morgan Haskett , John Patrick O'Connor , Mark Myron Miller , Sean Timothy Crowley , Jeffery Alan Miks , Mark Phillip Popovich
发明人： Bradley Morgan Haskett , John Patrick O'Connor , Mark Myron Miller , Sean Timothy Crowley , Jeffery Alan Miks , Mark Phillip Popovich
IPC分类号： H01L31/0203
CPC分类号： B81B7/0067 , B81B7/007 , B81B2201/042 , B81B2207/07 , B81C2203/0109 , H01L24/48 , H01L27/14618 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/14 , H01L2924/16235 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.
摘要翻译： 根据一个实施例，微光学装置包括电光电路和设置在基板的表面上的环形框架。 电光电路具有由窗口和邻近电光电路的至少一个边缘的互连区域封装的有源区域。 环形框架围绕窗户的外周延伸并且通过间隙与窗户分离，环形框架和电光电路形成用于将多个接合线放置的空腔，电光电路的互连 基质。
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公开(公告)号：US20100164081A1
公开(公告)日：2010-07-01
申请号：US12345421
申请日：2008-12-29
申请人： Bradley Morgan Haskett , John Patrick O'Connor , Mark Myron Miller , Sean Timothy Crowley , Jeffery Alan Miks , Mark Phillip Popovich
发明人： Bradley Morgan Haskett , John Patrick O'Connor , Mark Myron Miller , Sean Timothy Crowley , Jeffery Alan Miks , Mark Phillip Popovich
CPC分类号： B81B7/0067 , B81B7/007 , B81B2201/042 , B81B2207/07 , B81C2203/0109 , H01L24/48 , H01L27/14618 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/14 , H01L2924/16235 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.
摘要翻译： 根据一个实施例，微光学装置包括电光电路和设置在基板的表面上的环形框架。 电光电路具有由窗口和邻近电光电路的至少一个边缘的互连区域封装的有源区域。 环形框架围绕窗户的外周延伸并且通过间隙与窗户分离，环形框架和电光电路形成用于将多个接合线放置的空腔，电光电路的互连 基质。
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