公开(公告)号：US08445984B2

公开(公告)日：2013-05-21

申请号：US13100004

申请日：2011-05-03

申请人： Bradley Morgan Haskett ,  John Patrick O'Connor ,  Mark Myron Miller ,  Sean Timothy Crowley ,  Jeffrey Alan Miks ,  Mark Phillip Popovich

发明人： Bradley Morgan Haskett ,  John Patrick O'Connor ,  Mark Myron Miller ,  Sean Timothy Crowley ,  Jeffrey Alan Miks ,  Mark Phillip Popovich

IPC分类号： H01L31/0203

CPC分类号： B81B7/0067 ,  B81B7/007 ,  B81B2201/042 ,  B81B2207/07 ,  B81C2203/0109 ,  H01L24/48 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/16235 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.

摘要翻译： 根据一个实施例，微光学装置包括电光电路和设置在基板的表面上的环形框架。 电光电路具有由窗口和邻近电光电路的至少一个边缘的互连区域封装的有源区域。 环形框架围绕窗户的外周延伸并且通过间隙与窗户分离，环形框架和电光电路形成用于将多个接合线放置的空腔，电光电路的互连 基质。

公开(公告)号：US20110204464A1

公开(公告)日：2011-08-25

申请号：US13100004

申请日：2011-05-03

申请人： Bradley Morgan Haskett ,  John Patrick O'Connor ,  Mark Myron Miller ,  Sean Timothy Crowley ,  Jeffery Alan Miks ,  Mark Phillip Popovich

发明人： Bradley Morgan Haskett ,  John Patrick O'Connor ,  Mark Myron Miller ,  Sean Timothy Crowley ,  Jeffery Alan Miks ,  Mark Phillip Popovich

IPC分类号： H01L31/0203

CPC分类号： B81B7/0067 ,  B81B7/007 ,  B81B2201/042 ,  B81B2207/07 ,  B81C2203/0109 ,  H01L24/48 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/16235 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.

摘要翻译： 根据一个实施例，微光学装置包括电光电路和设置在基板的表面上的环形框架。 电光电路具有由窗口和邻近电光电路的至少一个边缘的互连区域封装的有源区域。 环形框架围绕窗户的外周延伸并且通过间隙与窗户分离，环形框架和电光电路形成用于将多个接合线放置的空腔，电光电路的互连 基质。

公开(公告)号：US07936033B2

公开(公告)日：2011-05-03

申请号：US12345421

申请日：2008-12-29

申请人： Bradley Morgan Haskett ,  John Patrick O'Connor ,  Mark Myron Miller ,  Sean Timothy Crowley ,  Jeffery Alan Miks ,  Mark Phillip Popovich

发明人： Bradley Morgan Haskett ,  John Patrick O'Connor ,  Mark Myron Miller ,  Sean Timothy Crowley ,  Jeffery Alan Miks ,  Mark Phillip Popovich

IPC分类号： H01L31/0203

CPC分类号： B81B7/0067 ,  B81B7/007 ,  B81B2201/042 ,  B81B2207/07 ,  B81C2203/0109 ,  H01L24/48 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/16235 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.

摘要翻译： 根据一个实施例，微光学装置包括电光电路和设置在基板的表面上的环形框架。 电光电路具有由窗口和邻近电光电路的至少一个边缘的互连区域封装的有源区域。 环形框架围绕窗户的外周延伸并且通过间隙与窗户分离，环形框架和电光电路形成用于将多个接合线放置的空腔，电光电路的互连 基质。

公开(公告)号：US20100164081A1

公开(公告)日：2010-07-01

申请号：US12345421

申请日：2008-12-29

申请人： Bradley Morgan Haskett ,  John Patrick O'Connor ,  Mark Myron Miller ,  Sean Timothy Crowley ,  Jeffery Alan Miks ,  Mark Phillip Popovich

发明人： Bradley Morgan Haskett ,  John Patrick O'Connor ,  Mark Myron Miller ,  Sean Timothy Crowley ,  Jeffery Alan Miks ,  Mark Phillip Popovich

IPC分类号： H01L23/02 ,  H01L21/50

CPC分类号： B81B7/0067 ,  B81B7/007 ,  B81B2201/042 ,  B81B2207/07 ,  B81C2203/0109 ,  H01L24/48 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/16235 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.

摘要翻译： 根据一个实施例，微光学装置包括电光电路和设置在基板的表面上的环形框架。 电光电路具有由窗口和邻近电光电路的至少一个边缘的互连区域封装的有源区域。 环形框架围绕窗户的外周延伸并且通过间隙与窗户分离，环形框架和电光电路形成用于将多个接合线放置的空腔，电光电路的互连 基质。

公开(公告)号：US06639308B1

公开(公告)日：2003-10-28

申请号：US09687876

申请日：2000-10-13

申请人： Sean Timothy Crowley ,  Angel Orabuena Alvarez ,  Jun Young Yang

发明人： Sean Timothy Crowley ,  Angel Orabuena Alvarez ,  Jun Young Yang

IPC分类号： H01L23495

CPC分类号： H01L23/4951 ,  H01L23/3114 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor package that can fit semiconductor chips of various sizes without having to change the footprint of the carrier package. One aspect of the semiconductor package comprises a leadframe, a semiconductor chip attached to the leadframe, electrical connectors electrically connecting the semiconductor to the leadframe, and a sealing material. The leadframe has a plurality of leads, with each one of the plurality of leads having an upper side, a lower exposed side, and a laterally exposed side. The upper side of each one of the plurality of leads define a generally co-planar surface. Further, after sealing material encapsulates the components of the semiconductor package in a spacial relationship, the lower exposed side and the lateral exposed side of the plurality of leads are exposed to the outside surface of the semiconductor package.

摘要翻译： 半导体封装，可以适应各种尺寸的半导体芯片，而不必改变载体封装的占位面积。 半导体封装的一个方面包括引线框，连接到引线框的半导体芯片，将半导体电连接到引线框的电连接器和密封材料。 引线框架具有多个引线，多个引线中的每一个引线具有上侧，下暴露侧和侧向露出侧。 多个引线中的每一个的上侧限定一个大致共面的表面。 此外，在密封材料以空间关系密封半导体封装的部件之后，多个引线的下暴露侧和侧面暴露侧暴露于半导体封装的外表面。

公开(公告)号：US06605866B1

公开(公告)日：2003-08-12

申请号：US09687531

申请日：2000-10-13

申请人： Sean Timothy Crowley ,  Angel Orabuena Alvarez ,  Jun Young Yang

发明人： Sean Timothy Crowley ,  Angel Orabuena Alvarez ,  Jun Young Yang

IPC分类号： H01L2348

CPC分类号： H01L23/3107 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Micro lead frame (MLF)-type semiconductor packages that allow the semiconductor packages to be stacked on top of each other. One aspect of the semiconductor package includes a leadframe, a plurality of electrical connectors, a semiconductor chip, and a sealing material for encapsulating the above components. The leadframe has a plurality of leads, with each one of the plurality of leads running from the top of the semiconductor package to the bottom of the semiconductor package. Each one of the plurality of leads has a top portion protruding from the top surface of the semiconductor package and a bottom portion protruding from the bottom surface of the semiconductor package. The leads allow for electrical connection of a second semiconductor package placed on top of the first semiconductor package. Further, the protruding parts of the leads form a space between the stacked semiconductor packages for improved heat dissipation.

摘要翻译： 微引线框架（MLF）型半导体封装，允许半导体封装堆叠在彼此之上。 半导体封装的一个方面包括引线框架，多个电连接器，半导体芯片和用于封装上述部件的密封材料。 引线框具有多个引线，多个引线中的每一个引线从半导体封装的顶部延伸到半导体封装的底部。 多个引线中的每一个具有从半导体封装的顶表面突出的顶部和从半导体封装的底表面突出的底部。 引线允许放置在第一半导体封装顶部上的第二半导体封装的电连接。 此外，引线的突出部分在堆叠的半导体封装之间形成空间，以改善散热。

公开(公告)号：US07045396B2

公开(公告)日：2006-05-16

申请号：US10439671

申请日：2003-05-16

申请人： Sean Timothy Crowley ,  Angel Orabuena Alvarez ,  Jun Young Yang

发明人： Sean Timothy Crowley ,  Angel Orabuena Alvarez ,  Jun Young Yang

IPC分类号： H01L21/44

CPC分类号： H01L23/3107 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Leadframe-type semiconductor packages that allow the semiconductor packages to be stacked on top of each other. One aspect of the semiconductor package includes a leadframe, a plurality of electrical connectors, a semiconductor chip, and a sealing material for encapsulating the above components. The leadframe has a plurality of leads, with each one of the plurality of leads running from the top of the semiconductor package to the bottom of the semiconductor package. Each one of the plurality of leads has a top portion protruding from the top surface of the semiconductor package and a bottom portion protruding from the top surface of the semiconductor package and a bottom portion protruding from the bottom surface of the semiconductor package. The leads allow for electrical connection of a second semiconductor package placed on top of the first semiconductor package. Further, the protruding parts of the leads form a space between the stacked semiconductor packages for improved heat dissipation.

摘要翻译： 允许半导体封装层叠在一起的引线框型半导体封装。 半导体封装的一个方面包括引线框架，多个电连接器，半导体芯片和用于封装上述部件的密封材料。 引线框具有多个引线，多个引线中的每一个引线从半导体封装的顶部延伸到半导体封装的底部。 多个引线中的每一个具有从半导体封装的顶表面突出的顶部和从半导体封装的顶表面突出的底部和从半导体封装的底表面突出的底部。 引线允许放置在第一半导体封装顶部上的第二半导体封装的电连接。 此外，引线的突出部分在堆叠的半导体封装之间形成空间，以改善散热。

公开(公告)号：US06753597B1

公开(公告)日：2004-06-22

申请号：US09687495

申请日：2000-10-13

申请人： Sean Timothy Crowley ,  Angel Orabuena Alvarez

发明人： Sean Timothy Crowley ,  Angel Orabuena Alvarez

IPC分类号： H01L23495

CPC分类号： H01L23/49548 ,  H01L23/49503 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package that can accommodate a larger semiconductor chip while keeping the foot print area afforded to a conventional semiconductor package. The semiconductor package of the present invention also has an improved locking strength between a chip paddle and an encapsulation material. Additionally, the semiconductor chip of the present invention exhibits an improved heat radiation of the semiconductor chip over conventional semiconductor packages. The package of the present invention comprises a semiconductor chip having a plurality of bond pads on its upper surface; a chip paddle bonded to the bottom surface of the semiconductor chip by an adhesive; a plurality of internal leads, each having an etched part at the end facing the chip paddle, which are formed at regular intervals along the perimeter of the chip paddle; conductive wires for electrically connecting the bond pads of the semiconductor chip to the internal leads; and a package body in which the semiconductor chip, the conductive wires, the chip paddle and the internal leads are encapsulated by an encapsulation material while the chip paddle and the internal leads are externally exposed at their side surfaces and bottom surfaces.

摘要翻译： 半导体封装，其可以容纳更大的半导体芯片，同时保持足部打印面积提供给传统的半导体封装。 本发明的半导体封装还具有改进的芯片焊盘和封装材料之间的锁定强度。 此外，本发明的半导体芯片表现出比常规半导体封装改善了半导体芯片的散热。 本发明的封装包括在其上表面上具有多个接合焊盘的半导体芯片; 通过粘合剂结合到半导体芯片的底表面的芯片焊盘; 多个内部引线，每个内部引线在面向芯片桨的一端具有蚀刻部分，沿着芯片桨的周边以规则的间隔形成; 用于将半导体芯片的接合焊盘电连接到内部引线的导线; 以及封装体，其中半导体芯片，导线，芯片焊盘和内部引线由封装材料封装，而芯片焊盘和内部引线在其侧表面和底表面处外露。

公开(公告)号：US06198163B1

公开(公告)日：2001-03-06

申请号：US09420065

申请日：1999-10-18

申请人： Sean Timothy Crowley ,  Bradley David Boland

发明人： Sean Timothy Crowley ,  Bradley David Boland

IPC分类号： H01L2310

CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A thin, small-outline semiconductor package, and a thermally enhanced leadframe for use in it, comprise a plurality of electrically conductive leads held together in a spaced, planar relationship about a central opening defined by the leads, and a thick, plate-like heat sink made of an electrically and thermally conductive metal attached to the leads such that it is centered within the opening and parallel to the plane of the leads. The heat sink has a lower surface exposed through the outer surface of a molded resin envelope encapsulating the package for the efficient dissipation of heat therefrom, and an upper surface having a recess formed into it. The recess has a planar floor with a semiconductor die attached to it, and defines a grounding ring around the periphery of the upper surface of the heat sink immediately adjacent to the edges of the die for the down-bonding of grounding wires from the die and the leads. The package provides enhanced heat dissipating capabilities, an improved resistance to long-term penetration by moisture, and a down-bonding region that substantially shortens the length of grounding wires down-bonded thereto and substantially reduces the residual shear stress acting on the down-bonds.

摘要翻译： 薄的小轮廓半导体封装以及用于其中的热增强引线框架包括多个导电引线，其以关于由引线限定的中心开口的间隔开的平面关系固定在一起，以及厚的板状 散热片由导电和导电金属制成，附着在引线上，使其在开口内居中并平行于引线的平面。 散热器具有通过封装封装的模制树脂封套的外表面暴露的下表面，以便有效地散发热量，并且具有形成在其中的凹部的上表面。 该凹部具有平坦的底板，半导体芯片附接到其上，并且在紧邻模具的边缘的散热片的上表面的周边周围限定接地环，用于将来自模具的接地线下降接合，以及 导线。 该封装提供增强的散热能力，改善的耐受长时间渗透的阻力，以及下降接合区域，其大大缩短了下降接合线的长度，并且基本上减小作用在下键上的残余剪切应力 。

公开(公告)号：US08154111B2

公开(公告)日：2012-04-10

申请号：US10662248

申请日：2003-09-15

申请人： Sean Timothy Crowley ,  Angel Orabuena Alvarez ,  Jun Young Yang

发明人： Sean Timothy Crowley ,  Angel Orabuena Alvarez ,  Jun Young Yang

IPC分类号： H01L23/495

CPC分类号： H01L23/4951 ,  H01L23/3114 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor package that can fit semiconductor chips of various sizes without having to change the footprint of the carrier package. One aspect of the semiconductor package comprises a leadframe, a semiconductor chip attached to the leadframe, electrical connectors electrically connecting the semiconductor chip to the leadframe, and a sealing material. The leadframe has a plurality of leads, with each one of the plurality of leads having an upper side, a lower exposed side, and a laterally exposed side. The upper side of each one of the plurality of leads defines a generally co-planar surface. Further, after sealing material encapsulates the components of the semiconductor package in a spatial relationship, the lower exposed side and the lateral exposed side of the plurality of leads are exposed to the outside surface of the semiconductor package.

摘要翻译： 半导体封装，可以适应各种尺寸的半导体芯片，而不必改变载体封装的占位面积。 半导体封装的一个方面包括引线框架，附接到引线框架的半导体芯片，将半导体芯片电连接到引线框架的电连接器以及密封材料。 引线框架具有多个引线，多个引线中的每一个引线具有上侧，下暴露侧和侧向露出侧。 多个引线中的每一个的上侧限定了大致共面的表面。 此外，在密封材料以空间关系封装半导体封装的部件之后，多个引线的下暴露侧和侧向暴露侧暴露于半导体封装的外表面。