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公开(公告)号:US06563050B2
公开(公告)日:2003-05-13
申请号:US09804106
申请日:2001-03-12
申请人: Gary Gustine , Charles G. Ham , Matthew Kusz , Fredrick Daniels , Michael Sawyer
发明人: Gary Gustine , Charles G. Ham , Matthew Kusz , Fredrick Daniels , Michael Sawyer
IPC分类号: H02G15013
CPC分类号: H02G15/14 , H02G15/076
摘要: A cable assembly is provided. The cable assembly includes an interface plate having a raised outer surface and an inner surface. The inner surface is adapted to engage with a housing. The interface plate includes a recess having a channel that is adapted to receive a cable and an opening through the interface plate at one end of the channel to allow the cable to pass through the interface plate. The recess is adapted to receive a sealant that covers the cable once the cable is placed in the channel.
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公开(公告)号:US20080239674A1
公开(公告)日:2008-10-02
申请号:US11932103
申请日:2007-10-31
申请人: Gary Gustine , Charles G. Ham , Michael Sawyer , Fredrick Daniels , Michelle Bishop , Lane King , Matthew Kusz
发明人: Gary Gustine , Charles G. Ham , Michael Sawyer , Fredrick Daniels , Michelle Bishop , Lane King , Matthew Kusz
IPC分类号: H05K7/20
CPC分类号: H05K7/20409 , H04Q1/035 , H04Q1/09 , H04Q2201/06 , H04Q2201/10 , H04Q2201/12 , H05K7/20418 , H05K7/20445
摘要: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.
摘要翻译: 用于容纳诸如电子电路卡的物体的装置及其制造方法,该装置具有壳体; 设置在所述壳体内的至少一个壳体,所述壳体适于将所述物体限制在所述壳体内的不同位置并且包括框架,所述框架内的所述区域由第一分区分成两个区域,所述两个区域中的每一个被划分为多个 通过多个第二分区,每个第二分区热耦合到框架和第一分区,每个部分被划分成多个狭槽,每个狭槽具有设置在其中的物体,用于在第一分隔件之间进行热接触, 第二分区,以及第二分区和所述帧中的一个; 以及至少一个适于从壳体吸收热量的散热器,所述散热器热耦合到壳体和壳体。
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公开(公告)号:US06628521B2
公开(公告)日:2003-09-30
申请号:US09804129
申请日:2001-03-12
申请人: Gary Gustine , Charles G. Ham , Michael Sawyer , Fredrick Daniels , Michelle Bishop , Lane King , Matthew Kusz
发明人: Gary Gustine , Charles G. Ham , Michael Sawyer , Fredrick Daniels , Michelle Bishop , Lane King , Matthew Kusz
IPC分类号: H01K720
CPC分类号: H05K7/20409 , H04Q1/035 , H04Q1/09 , H04Q2201/06 , H04Q2201/10 , H04Q2201/12 , H05K7/20418 , H05K7/20445
摘要: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.
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公开(公告)号:US07075789B2
公开(公告)日:2006-07-11
申请号:US10673739
申请日:2003-09-29
申请人: Gary Gustine , Charles G. Ham , Michael Sawyer , Frederick Daniels , Michelle Bishop , Lane King , Matthew Kusz
发明人: Gary Gustine , Charles G. Ham , Michael Sawyer , Frederick Daniels , Michelle Bishop , Lane King , Matthew Kusz
IPC分类号: H05K7/20
CPC分类号: H05K7/20409 , H04Q1/035 , H04Q1/09 , H04Q2201/06 , H04Q2201/10 , H04Q2201/12 , H05K7/20418 , H05K7/20445
摘要: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.
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公开(公告)号:US07633757B2
公开(公告)日:2009-12-15
申请号:US11932103
申请日:2007-10-31
申请人: Gary Gustine , Charles G. Ham , Michael Sawyer , Fredrick A. Daniels , Michelle Bishop , Lane King , Matthew J. Kusz
发明人: Gary Gustine , Charles G. Ham , Michael Sawyer , Fredrick A. Daniels , Michelle Bishop , Lane King , Matthew J. Kusz
IPC分类号: H05K7/20
CPC分类号: H05K7/20409 , H04Q1/035 , H04Q1/09 , H04Q2201/06 , H04Q2201/10 , H04Q2201/12 , H05K7/20418 , H05K7/20445
摘要: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.
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公开(公告)号:US06862180B2
公开(公告)日:2005-03-01
申请号:US10155050
申请日:2002-05-24
CPC分类号: H05K7/20445 , H05K5/061 , H05K5/063
摘要: A housing for circuit cards is provided. The housing has a shell. A thermally conductive liner integral with the shell lines an interior of the shell. A protrusion of the liner extends through the shell and contacts the shell to form a pressure seal between the liner and the shell. A heat sink is disposed on an exterior surface of the shell and is thermally coupled to the protrusion of the liner. A case is disposed within the liner and is thermally coupled to the liner. The case is adapted to receive a plurality of circuit cards so that the plurality of circuit cards is thermally coupled to the case.
摘要翻译: 提供电路卡的外壳。 外壳有一个外壳。 与外壳一体的导热衬套将壳体的内部排列。 衬套的突起延伸穿过壳体并接触壳体,以在衬套和壳体之间形成压力密封。 散热器设置在壳体的外表面上并且热耦合到衬套的突出部。 壳体设置在衬套内并与衬套热耦合。 该情况适于接收多个电路卡,使得多个电路卡热耦合到壳体。
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公开(公告)号:US06655235B2
公开(公告)日:2003-12-02
申请号:US09851799
申请日:2001-05-09
申请人: Michael Sawyer , Matthew Kusz , Charles G. Ham
发明人: Michael Sawyer , Matthew Kusz , Charles G. Ham
IPC分类号: B25B2714
CPC分类号: H01H85/0208 , B25B9/00
摘要: A tool for installing and extracting a fuse is provided. The tool has a first bar that has a jaw at one end of the first bar. The tool has second bar that is slidably attached to the first bar and that has a jaw at one end of the second bar. The respective jaws are adapted to align by sliding the respective bars relative to each other to retain the fuse between the respective jaws.
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公开(公告)号:USD462675S1
公开(公告)日:2002-09-10
申请号:US29132247
申请日:2000-11-06
申请人: Matthew Kusz , Charles G. Ham
设计人: Matthew Kusz , Charles G. Ham
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公开(公告)号:US06781830B2
公开(公告)日:2004-08-24
申请号:US10289132
申请日:2002-11-05
申请人: Michael K. Barth , Charles G. Ham , Gene Tennis , Matthew Kusz , Chad J. Sjodin , Matthew Ferris , Cyle D. Petersen
发明人: Michael K. Barth , Charles G. Ham , Gene Tennis , Matthew Kusz , Chad J. Sjodin , Matthew Ferris , Cyle D. Petersen
IPC分类号: H05K720
CPC分类号: H05K7/20445
摘要: An electronics enclosure is provided. The enclosure includes a modular card cage adapted to receive one or more electronic circuit cards and a heat sink adapted to protrude through an opening of an enclosure and couple to the modular card cage. The modular card cage and the heat sink provide an isolated heat transfer path for heat, produced by each of the one or more electronic circuit cards, to be removed from the enclosure.
摘要翻译: 提供电子外壳。 外壳包括适于接收一个或多个电子电路卡的模块化卡笼和适于突出穿过外壳的开口并耦合到模块化卡笼的散热器。 模块化卡笼和散热器为从外壳中移除的一个或多个电子电路卡中的每一个产生的用于加热的隔离传热路径。
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