Fuse tool
    2.
    发明授权

    公开(公告)号:US06655235B2

    公开(公告)日:2003-12-02

    申请号:US09851799

    申请日:2001-05-09

    IPC分类号: B25B2714

    CPC分类号: H01H85/0208 B25B9/00

    摘要: A tool for installing and extracting a fuse is provided. The tool has a first bar that has a jaw at one end of the first bar. The tool has second bar that is slidably attached to the first bar and that has a jaw at one end of the second bar. The respective jaws are adapted to align by sliding the respective bars relative to each other to retain the fuse between the respective jaws.

    MECHANICAL HOUSING
    4.
    发明申请
    MECHANICAL HOUSING 有权
    机械房

    公开(公告)号:US20080239674A1

    公开(公告)日:2008-10-02

    申请号:US11932103

    申请日:2007-10-31

    IPC分类号: H05K7/20

    摘要: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

    摘要翻译: 用于容纳诸如电子电路卡的物体的装置及其制造方法,该装置具有壳体; 设置在所述壳体内的至少一个壳体,所述壳体适于将所述物体限制在所述壳体内的不同位置并且包括框架,所述框架内的所述区域由第一分区分成两个区域,所述两个区域中的每一个被划分为多个 通过多个第二分区,每个第二分区热耦合到框架和第一分区,每个部分被划分成多个狭槽,每个狭槽具有设置在其中的物体,用于在第一分隔件之间进行热接触, 第二分区,以及第二分区和所述帧中的一个; 以及至少一个适于从壳体吸收热量的散热器,所述散热器热耦合到壳体和壳体。

    Housings for circuit cards
    9.
    发明授权
    Housings for circuit cards 有权
    电路卡外壳

    公开(公告)号:US06862180B2

    公开(公告)日:2005-03-01

    申请号:US10155050

    申请日:2002-05-24

    IPC分类号: H05K5/06 H05K7/20

    摘要: A housing for circuit cards is provided. The housing has a shell. A thermally conductive liner integral with the shell lines an interior of the shell. A protrusion of the liner extends through the shell and contacts the shell to form a pressure seal between the liner and the shell. A heat sink is disposed on an exterior surface of the shell and is thermally coupled to the protrusion of the liner. A case is disposed within the liner and is thermally coupled to the liner. The case is adapted to receive a plurality of circuit cards so that the plurality of circuit cards is thermally coupled to the case.

    摘要翻译: 提供电路卡的外壳。 外壳有一个外壳。 与外壳一体的导热衬套将壳体的内部排列。 衬套的突起延伸穿过壳体并接触壳体,以在衬套和壳体之间形成压力密封。 散热器设置在壳体的外表面上并且热耦合到衬套的突出部。 壳体设置在衬套内并与衬套热耦合。 该情况适于接收多个电路卡,使得多个电路卡热耦合到壳体。