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    Molding compounds containing oxetanyl groups
    3.
    发明授权
    Molding compounds containing oxetanyl groups 失效
    含有OXETANYL组的成型化合物

    公开(公告)号：US5155168A

    公开(公告)日：1992-10-13

    申请号：US633464

    申请日：1990-12-24

    申请人： Holger Lutjens ,  Dieter Wittmann ,  Karl-Erwin Piejko ,  Christian Lindner ,  Gerd Fengler

    发明人： Holger Lutjens ,  Dieter Wittmann ,  Karl-Erwin Piejko ,  Christian Lindner ,  Gerd Fengler

    IPC分类号： C08L51/00 ,  C08K5/1525 ,  C08L51/04 ,  C08L51/06 ,  C08L55/00 ,  C08L55/02 ,  C08L69/00 ,  C08L101/00 ,  C08L101/02

    CPC分类号： C08L51/04 ,  C08L69/00

    摘要： Polymer mixtures ofA) 5 to 98 parts by weight and preferably 20 to 95 parts by weight of an aromatic polycarbonate,B) 2 to 70 parts by weight and preferably 5 to 60 parts by weight of a graft polymer of resin-forming monomers on a particulate diene and/or acrylate rubber having an average particle diameter (d.sub.50) of from 80 to 800 nm and preferably from 100 to 600 nm,C) 0 to 80 parts by weight and preferably 0.5 to 40 parts by weight of an uncrosslinked thermoplastic vinyl copolymer having a softening temperature above 30.degree. C.,in which either the resin-forming monomers in B) or a monomer of the thermoplastic vinyl copolymer C) or both have contained a monomer corresponding to formula (I) ##STR1## in which R.sup.1 =H, CH.sub.3 ; R.sup.2 =C.sub.1-8 alkylene; R.sup.3 =C.sub.1-4 alkylene, in such a quantity that the structural elements containing oxetanyl groups emanating therefrom make up from 0.05 to 5% by weight and the use of the thermoplastic molding compounds.

    摘要翻译： A）5至98重量份，优选20至95重量份的芳族聚碳酸酯的聚合物混合物，B）2至70重量份，优选5至60重量份的树脂形成单体的接枝聚合物 平均粒径（d50）为80〜800nm，优选为100〜600nm的颗粒状二烯和/或丙烯酸酯橡胶，C）0〜80重量份，优选0.5〜40重量份的未交联的热塑性塑料 软化温度高于30℃的乙烯基共聚物，其中B）中的树脂形成单体或热塑性乙烯基共聚物C）的单体或两者都含有对应于式（I）的单体（I） ）其中R1 = H，CH3; R2 = C1-8亚烷基; R3 = C1-4亚烷基，其含有由其发出的氧杂环丁烷基的结构元素占0.05至5重量％，以及使用热塑性模塑料。