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    CONDENSATION AND CURING OF MATERIALS WITHIN A COATING SYSTEM
    1.
    发明申请
    CONDENSATION AND CURING OF MATERIALS WITHIN A COATING SYSTEM 审中-公开
    涂料系统中材料的凝结和固化

    公开(公告)号：US20110008525A1

    公开(公告)日：2011-01-13

    申请号：US12501308

    申请日：2009-07-10

    申请人： George Theodore Dalakos ,  Christian Maria Anton Heller ,  Ahmet Gun Erlat

    发明人： George Theodore Dalakos ,  Christian Maria Anton Heller ,  Ahmet Gun Erlat

    IPC分类号： B05D5/12 ,  B05D3/04 ,  C23C16/00 ,  B05D3/06

    CPC分类号： B05D1/62 ,  B05D3/0254 ,  B05D3/067

    摘要： Present embodiments are directed to a system and method for condensing and curing organic materials within a deposition chamber. Present embodiments may include condensing an organic component from a gas phase into a liquid phase on a target surface within the deposition chamber, wherein the gas phase of the organic component might be mixed with an inert gas. Further, present embodiments may include solidifying the liquid phase of the organic component into a solid phase within the deposition chamber using an inert plasma formed from the inert gas.

    摘要翻译： 本实施例涉及用于在沉积室内冷凝和固化有机材料的系统和方法。 本实施方案可以包括将有机组分从气相中冷凝到沉积室内的目标表面上的液相，其中有机组分的气相可能与惰性气体混合。 此外，本实施例可以包括使用由惰性气体形成的惰性等离子体将有机组分的液相固化成沉积室内的固相。

    ENCAPSULATION STRUCTURE AND METHOD OF ORGANIC ELECTROLUMINESCENCE DEVICE
    2.
    发明申请
    ENCAPSULATION STRUCTURE AND METHOD OF ORGANIC ELECTROLUMINESCENCE DEVICE 有权
    有机电致发光器件的封装结构与方法

    公开(公告)号：US20100148661A1

    公开(公告)日：2010-06-17

    申请号：US12336683

    申请日：2008-12-17

    申请人： Donald Seton Farquhar ,  Ahmet Gun Erlat ,  Christian Maria Anton Heller ,  Anil Raj Duggal

    发明人： Donald Seton Farquhar ,  Ahmet Gun Erlat ,  Christian Maria Anton Heller ,  Anil Raj Duggal

    IPC分类号： H01L51/50 ,  H01L51/56

    CPC分类号： H01L51/5259 ,  H01L51/5203 ,  H01L51/5243 ,  H01L51/5246

    摘要： An encapsulation structure comprises a first barrier layer, and an electroluminescence device configured to be coupled to the first barrier layer and comprising a substrate and an electroluminescence element both defining a lateral side. The electroluminescence element comprises a first electrode disposed on the substrate, a second electrode, and an organic light-emitting layer disposed between the first and second electrodes. Further, the encapsulation structure comprises a second barrier layer configured to be coupled to the electroluminescence device, and an adhesive configured to locate between and connect the first and second barrier layers, and at least to be coupled to the lateral side of the electroluminescence device to seal the electroluminescence device between the first and second barrier layers. An encapsulation method is also presented.

    摘要翻译： 封装结构包括第一阻挡层和被配置为耦合到第一阻挡层并且包括限定侧面的基板和电致发光元件的电致发光器件。 电致发光元件包括设置在基板上的第一电极，第二电极和设置在第一和第二电极之间的有机发光层。 此外，封装结构包括被配置为耦合到电致发光器件的第二阻挡层和被配置为定位在第一和第二阻挡层之间并连接第一和第二势垒层的粘合剂，并且至少要连接到电致发光器件的侧面， 密封第一和第二阻挡层之间的电致发光器件。 还提出了一种封装方法。

    Encapsulation structures of organic electroluminescence devices
    5.
    发明授权
    Encapsulation structures of organic electroluminescence devices 有权
    有机电致发光器件的封装结构

    公开(公告)号：US08350470B2

    公开(公告)日：2013-01-08

    申请号：US12336683

    申请日：2008-12-17

    申请人： Donald Seton Farquhar ,  Ahmet Gun Erlat ,  Christian Maria Anton Heller ,  Anil Raj Duggal

    发明人： Donald Seton Farquhar ,  Ahmet Gun Erlat ,  Christian Maria Anton Heller ,  Anil Raj Duggal

    IPC分类号： H01J1/62 ,  H01J63/04

    CPC分类号： H01L51/5259 ,  H01L51/5203 ,  H01L51/5243 ,  H01L51/5246

    摘要： An encapsulation structure comprises a first barrier layer, and an electroluminescence device configured to be coupled to the first barrier layer and comprising a substrate and an electroluminescence element both defining a lateral side. The electroluminescence element comprises a first electrode disposed on the substrate, a second electrode, and an organic light-emitting layer disposed between the first and second electrodes. Further, the encapsulation structure comprises a second barrier layer configured to be coupled to the electroluminescence device, and an adhesive configured to locate between and connect the first and second barrier layers, and at least to be coupled to the lateral side of the electroluminescence device to seal the electroluminescence device between the first and second barrier layers. An encapsulation method is also presented.

    摘要翻译： 封装结构包括第一阻挡层和被配置为耦合到第一阻挡层并且包括限定侧面的基板和电致发光元件的电致发光器件。 电致发光元件包括设置在基板上的第一电极，第二电极和设置在第一和第二电极之间的有机发光层。 此外，封装结构包括被配置为耦合到电致发光器件的第二阻挡层和被配置为定位在第一和第二阻挡层之间并连接第一和第二阻挡层的粘合剂，并且至少要耦合到电致发光器件的侧面， 密封第一和第二阻挡层之间的电致发光器件。 还提出了一种封装方法。