摘要:
Structures and a computer program product are provided for implementing enhanced wiring capability for electronic laminate packages. Electronic package physical design data are received. Instances of line width and space limit violations in the electronic package physical design data are identified. The identified instances of line width and space limit violations are evaluated using predefined qualified options and tolerance limitations and the electronic package physical design data are modified to optimize shapes to replace the instances of line width and space limit violations.
摘要:
Structures and a computer program product are provided for implementing enhanced wiring capability for electronic laminate packages. Electronic package physical design data are received. Instances of line width and space limit violations in the electronic package physical design data are identified. The identified instances of line width and space limit violations are evaluated using predefined qualified options and tolerance limitations and the electronic package physical design data are modified to optimize shapes to replace the instances of line width and space limit violations.
摘要:
A method, structures and computer program product are provided for implementing enhanced wiring capability for electronic laminate packages. Electronic package physical design data are received. Instances of line width and space limit violations in the electronic package physical design data are identified. The identified instances of line width and space limit violations are evaluated using predefined qualified options and tolerance limitations and the electronic package physical design data are modified to optimize shapes to replace the instances of line width and space limit violations.
摘要:
A method is provided for implementing enhanced wiring capability for electronic laminate packages. Electronic package physical design data are received. Instances of line width and space limit violations in the electronic package physical design data are identified. The identified instances of line width and space limit violations are evaluated using predefined qualified options and tolerance limitations and the electronic package physical design data are modified to optimize shapes to replace the instances of line width and space limit violations.
摘要:
A method, apparatus and computer program product are provided for implementing vertically coupled noise control through a mesh plane in an electronic package design. Electronic package physical design data are received. Instances of vertically coupled noise in the electronic package physical design data are identified. The identified instances of vertically coupled noise are quantified. Then the electronic package physical design data are modified to limit the vertically coupled noise.
摘要:
A method, an apparatus and a computer program product are provided for implementing At-Speed Wafer Final Test (WFT) with total integrated circuit chip coverage including high speed off-chip receiver and driver input/output (I/O) circuits. An integrated circuit (IC) chip includes off-chip Controlled Collapse Chip Connection (C4) nodes and a driver and a receiver of the off-chip receiver and driver input/output (I/O) circuits connected to respective off-chip C4 nodes. Through Silicon Vias (TSVs) are added to the connections of the driver and the receiver and the respective off-chip C4 nodes to a backside of the IC chip. A metal wire is added to the IC chip backside connecting the TSVs and creating a connection path between the driver and the receiver that is used for the at-speed WFT testing of the I/O circuits.
摘要:
A computer system having a memory system having a memory controller and a memory. The memory controller is coupled to a processor and to the memory. The memory comprises one or more daisy chains of memory chips. An address/command word is chained through a daisy chain of memory chips and is handled by one of the memory chips in the daisy chain of memory chips. Data to be written to a memory chip is sent as part of the address/command word, or is transferred on an outgoing data bus chain. Data read from a memory chip is transferred on an incoming data bus chain. A daisy chain of memory chips can include memory chips on multiple carriers, or the daisy chain of memory chips can all be attached to a single carrier.
摘要:
A carrier having at least one self timed memory chip in a daisy chain of memory chips. A first carrier has at least a portion of a daisy chain of memory chips attached to the first carrier. An address/command bus input on the first carrier carries an address/command word to a first memory chip in the daisy chain of memory chips. If the first memory chip determines that the address/command word is not directed to the first memory chip, the first memory chip re-drives the address/command word to a second memory chip in the daisy chain of memory chips using a point to point address/command bus link. If there are no more memory chips on the first carrier, the address/command word is re-driven to an address/command bus off-carrier connector. An array on a memory chip has an access time dynamically determined by how fast the array can be accessed.
摘要:
A memory chip having a data bus having a plurality of bits. The number of bits is apportioned between a read portion and a write portion. The write portion is dedicated to receiving data that is to be written into an array on the memory chip; the read portion is dedicated to driving data that has been read from the array on the memory chip. The apportionment is programmable. Apportionment can be specified by programming signal pins on the memory chip, connecting the signal pins to appropriate logical values. The apportionment can alternatively be specified by scanning apportionment information into the memory chip at bring up time. The apportionment and also alternatively be specified by receiving apportionment information in an address/command word.
摘要:
A carrier having at least one memory chip in a daisy chain of memory chips. A first carrier has at least a portion of an entire daisy chain of memory chips attached to the first carrier. An address/command bus input on the first carrier carries an address/command word to a first memory chip in the daisy chain of memory chips. If the first memory chip determines that the address/command word is not directed to the first memory chip, the first memory chip re-drives the address/command word to a second memory chip in the daisy chain of memory chips using a point to point address/command bus link. If there are no more memory chips on the first carrier, the address/command word is re-driven to a memory chip on a second carrier.