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公开(公告)号：US06652290B2
公开(公告)日：2003-11-25
申请号：US09978128
申请日：2001-10-15
IPC分类号： H01R1200
CPC分类号： H01R12/57 , H01L23/49811 , H01L2224/16225 , H01L2224/16235 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H05K3/325 , H05K7/1061 , Y10T29/49149
摘要： An integrated circuit package having metallized contact pads is provided with electrically conducting devices permanently attached to each contact pad. The devices are flexed when so attached, and are aligned and assembled onto corresponding pads of a second electrical component (e.g., a printed circuit board) to provide electrical connection between the integrated circuit package and the second electrical component.
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公开(公告)号：US06302702B1
公开(公告)日：2001-10-16
申请号：US09516904
申请日：2000-03-01
IPC分类号： H01R100
CPC分类号： H01R12/57 , H01L23/49811 , H01L2224/16225 , H01L2224/16235 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H05K3/325 , H05K7/1061 , Y10T29/49149
摘要： An integrated circuit package having metallized contact pads is provided with electrically conducting devices permanently attached to each contact pad. The devices are flexed when so attached, and are aligned and assembled onto corresponding pads of a second electrical component (e.g., a printed circuit board) to provide electrical connection between the integrated circuit package and the second electrical component.
摘要翻译： 具有金属化接触焊盘的集成电路封装设置有永久地附接到每个接触焊盘的导电装置。 当这样安装时，这些装置被弯曲，并被对准并组装到第二电气部件（例如，印刷电路板）的相应焊盘上，以提供集成电路封装和第二电气部件之间的电连接。
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3.发明申请PISTON RESET APPARATUS FOR A MULTICHIP MODULE AND METHOD FOR RESETTING PISTONS IN THE SAME 有权用于多芯片模块的活塞复位装置及其中的活塞重置方法公开(公告)号：US20080264606A1
公开(公告)日：2008-10-30
申请号：US12143940
申请日：2008-06-23
IPC分类号： F28D21/00
CPC分类号： H05K7/1061 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a piston reset apparatus for a multichip module that includes a base with multiple projections and two unit associating pegs extending from opposite ends of the base, a hat disposed upwardly of the base and including multiple adjustable pistons vertically adjustable within the hat, each of the plurality of adjustable pistons being disposed in alignment with one of the multiple projections, a mass equivalent plate disposed upwardly of the hat and being configured to hold a spring loaded sleeve, the spring loaded sleeve including a plurality of springs, each of the springs being aligned with and configured to apply pressure upon one of the multiple pistons, a spring loaded clamp disposed upwardly of the plate and including a spring loaded portion and a retaining portion, the retaining portion defining two cavities configured to fixedly associate with an associating groove defined by each of the unit associating pegs.
摘要翻译： 公开了一种用于多芯片模块的活塞复位装置，其包括具有多个突起的基座和从基座的相对端延伸的两个单元关联钉，帽子设置在基座的上方，并且包括在帽子内可垂直调节的多个可调节活塞， 所述多个可调节活塞与所述多个突起中的一个突起对准设置，所述质量当量板设置在所述帽子的上方并且被构造成保持弹簧加载的套筒，所述弹簧加载的套筒包括多个弹簧，每个所述弹簧为 对准并构造成在多个活塞中的一个上施加压力，弹簧加载的夹具，其设置在板的上方并且包括弹簧加载部分和保持部分，所述保持部分限定两个空腔，其被构造成与由 每个单位关联栓。
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4.发明授权Piston reset apparatus for a multichip module and method for resetting pistons in the same 有权用于多芯片模块的活塞复位装置和用于复位活塞的活塞的方法公开(公告)号：US07826228B2
公开(公告)日：2010-11-02
申请号：US12143940
申请日：2008-06-23
IPC分类号： H05K7/20
CPC分类号： H05K7/1061 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a piston reset apparatus for a multichip module that includes a base with multiple projections and two unit associating pegs extending from opposite ends of the base, a hat disposed upwardly of the base and including multiple adjustable pistons vertically adjustable within the hat, each of the plurality of adjustable pistons being disposed in alignment with one of the multiple projections, a mass equivalent plate disposed upwardly of the hat and being configured to hold a spring loaded sleeve, the spring loaded sleeve including a plurality of springs, each of the springs being aligned with and configured to apply pressure upon one of the multiple pistons, a spring loaded clamp disposed upwardly of the plate and including a spring loaded portion and a retaining portion, the retaining portion defining two cavities configured to fixedly associate with an associating groove defined by each of the unit associating pegs.
摘要翻译： 公开了一种用于多芯片模块的活塞复位装置，其包括具有多个突起的基座和从基座的相对端延伸的两个单元关联钉，帽子设置在基座的上方，并且包括在帽子内可垂直调节的多个可调节活塞， 所述多个可调节活塞与所述多个突起中的一个突起对准设置，所述质量当量板设置在所述帽子的上方并且被构造成保持弹簧加载的套筒，所述弹簧加载的套筒包括多个弹簧，每个所述弹簧为 对准并构造成在多个活塞中的一个上施加压力，弹簧加载的夹具，其设置在板的上方并且包括弹簧加载部分和保持部分，所述保持部分限定两个空腔，其被构造成与由 每个单位关联栓。
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5.发明授权Piston reset apparatus for a multichip module and method for resetting pistons in the same 有权用于多芯片模块的活塞复位装置和用于复位活塞的活塞的方法公开(公告)号：US07405940B1
公开(公告)日：2008-07-29
申请号：US11739773
申请日：2007-04-25
IPC分类号： H05K7/20
CPC分类号： H05K7/1061 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a piston reset apparatus for a multichip module that includes a base with multiple projections and two unit associating pegs extending from opposite ends of the base, a hat disposed upwardly of the base and including multiple adjustable pistons vertically adjustable within the hat, each of the plurality of adjustable pistons being disposed in alignment with one of the multiple projections, a mass equivalent plate disposed upwardly of the hat and being configured to hold a spring loaded sleeve, the spring loaded sleeve including a plurality of springs, each of the springs being aligned with and configured to apply pressure upon one of the multiple pistons, a spring loaded clamp disposed upwardly of the plate and including a spring loaded portion and a retaining portion, the retaining portion defining two cavities configured to fixedly associate with an associating groove defined by each of the unit associating pegs.
摘要翻译： 公开了一种用于多芯片模块的活塞复位装置，其包括具有多个突起的基座和从基座的相对端延伸的两个单元关联钉，帽子设置在基座的上方，并且包括在帽子内可垂直调节的多个可调节活塞， 所述多个可调节活塞与所述多个突起中的一个突起对准设置，所述质量当量板设置在所述帽子的上方并且被构造成保持弹簧加载的套筒，所述弹簧加载的套筒包括多个弹簧，每个所述弹簧为 对准并构造成在多个活塞中的一个上施加压力，弹簧加载的夹具，其设置在板的上方并且包括弹簧加载部分和保持部分，所述保持部分限定两个空腔，其被构造成与由 每个单位关联栓。
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