公开(公告)号：US06930373B2

公开(公告)日：2005-08-16

申请号：US10649839

申请日：2003-08-27

申请人： Gerd Auerswald ,  Kurt Gross ,  Michael Kirchberger ,  Stefan Kulig ,  Hans Rappl

发明人： Gerd Auerswald ,  Kurt Gross ,  Michael Kirchberger ,  Stefan Kulig ,  Hans Rappl

IPC分类号： H01L23/36 ,  H01L25/16 ,  H01L29/201

CPC分类号： H01L25/162 ,  H01L23/36 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01052 ,  H01L2924/01065 ,  H01L2924/13055 ,  H01L2924/19041 ,  H01L2224/45099

摘要： The circuit has a power stage (LE) with heat generating components mounted around at least one component that generates less heat mounted in an inner region. The heat generating components are connected to at least one conducting metal body (K1) that is mounted on a cooling body (KK) in electrically insulated manner to cool the components. The cooling body encloses the inner region.

摘要翻译： 该电路具有功率级（LE），其中发热组件安装在至少一个组件上，该组件在内部区域中产生较少的热量。 发热部件与以电绝缘方式安装在冷却体（KK）上的至少一个导电金属体（K 1）连接，以冷却部件。 冷却体包围内部区域。

公开(公告)号：US06419980B1

公开(公告)日：2002-07-16

申请号：US09572103

申请日：2000-05-17

申请人： Gerd Auerswald

发明人： Gerd Auerswald

IPC分类号： B05D512

CPC分类号： H05K1/092 ,  H01L23/49883 ,  H01L24/45 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/00014 ,  H01L2924/00

摘要： A process for producing an automatic-machine-bondable LTCC (Low Temperature Cofired Ceramics) circuit carrier includes the steps of applying a conductive paste having a glass content of less than 1.0 percent by weight onto a ceramic substrate having a glass content of at least 30 percent by weight, in order to form contact pads. The circuit carrier is fired such that glass melts out of the ceramic substrate and causes an adhesion between the conductive paste and the ceramic substrate. A ceramic circuit carrier has adhesion-promoting glass between the ceramic substrate and the conductive paste, wherein the adhesion-promoting glass originates from the ceramic substrate.

摘要翻译： 一种用于生产自动机械连接的LTCC（低温共烧陶瓷）电路载体的方法包括以下步骤：将具有小于1.0重量％的玻璃含量的导电膏施加到玻璃含量至少为30的陶瓷基材上 重量百分比，以形成接触垫。 电路载体被烧制，使得玻璃从陶瓷衬底中熔化并引起导电膏和陶瓷衬底之间的粘合。 陶瓷电路载体在陶瓷基板和导电浆料之间具有粘附促进玻璃，其中粘合促进玻璃源自陶瓷基片。

公开(公告)号：US06940136B2

公开(公告)日：2005-09-06

申请号：US10623947

申请日：2003-07-21

申请人： Gerd Auerswald ,  Gunter Ludwig

发明人： Gerd Auerswald ,  Gunter Ludwig

IPC分类号： H01L25/07 ,  H01L29/76

CPC分类号： H01L24/49 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00

摘要： A circuit arrangement with semiconductor elements arranged in chips is described. The circuit arrangement is characterized by at least one metal body (s1) for electrically contacting the semiconductor elements and for dissipating the heat produced by the semiconductor elements, said metal body (s1) being adapted to simultaneously function as the support for the semiconductor elements and the chips (c1) of the semiconductor elements being fastened on the body (s1).

摘要翻译： 描述了以芯片布置的半导体元件的电路装置。 电路装置的特征在于至少一个用于电接触半导体元件并消散由半导体元件产生的热量的金属体（1），所述金属体（1）适于同时用作半导体的支撑体 元件和半导体元件的芯片（c 1）紧固在主体（1）上。