Housing for an electronic circuit with improved heat dissipation means
    3.
    发明授权
    Housing for an electronic circuit with improved heat dissipation means 失效
    具有改善散热方式的电子电路的外壳

    公开(公告)号:US5272593A

    公开(公告)日:1993-12-21

    申请号:US941068

    申请日:1992-10-08

    IPC分类号: B60R16/02 H05K5/00 H05K7/20

    CPC分类号: H05K7/20854

    摘要: The housing for an electronic circuit is box-shaped, and on each of its longitudinal sides in its interior has a shoulder (44, 45), and above each of those a ridge (47, 48) and -- extending along a longitudinal side. A cooling frame (11) is pushed into the grooves (52, 53) formed between shoulder and ridge, with a printed circuit board (10) being fixed to the underside of the cooling frame. In its interior, the cooling frame has cooling tabs (15, 16, 17) which stand perpendicular to the surface of the printed circuit board and on which power components (20) are fixed.

    摘要翻译: PCT No.PCT / DE91 / 00440 Sec。 371日期:1992年10月8日 102(e)日期1992年10月8日PCT 1991年5月25日PCT PCT。 出版物WO92 / 00660 日期:1992年1月9日。电子电路的壳体是箱形的,并且在其内部的每个纵向侧上具有肩部(44,45),并且在其上方的脊部(47,48)和 - 沿纵向延伸。 冷却框架(11)被推入形成在肩部和脊部之间的槽(52,53)中,印刷电路板(10)固定在冷却框架的下侧。 在其内部,冷却框架具有垂直于印刷电路板的表面并且固定有功率部件(20)的冷却突片(15,16,17)。

    Housing for electronic circuit
    4.
    发明授权
    Housing for electronic circuit 失效
    电子电路外壳

    公开(公告)号:US5140500A

    公开(公告)日:1992-08-18

    申请号:US705326

    申请日:1991-05-24

    IPC分类号: H05K7/14 H05K5/00 H05K7/20

    CPC分类号: H05K7/20854

    摘要: A housing for an electronic circuit, especially for a control electronic device of a motor vehicle, has a printed circuit board adapted to carry an electronic circuit, a plug strip, a front plate, a cooling frame mounted on the board and having at least one cooling portion, power elements connected with the cooling portion in a heat conductive manner. The front plate is provided with cooling ribs and the cooling frame is provided with at least one cooling leg facing toward the plug strip so that the plug strip is located between the front plate with the cooling ribs and the cooling leg of the cooling frame. The front plate and the cooling frame are connected through a heat conducting web on the front plate in a heat conducting manner.

    摘要翻译: 用于电子电路的壳体,特别是用于机动车辆的控制电子设备的壳体具有印刷电路板,其适用于承载电子电路,插头条,前板,安装在电路板上的冷却框架,并具有至少一个 冷却部分,以导热方式与冷却部分连接的功率元件。 前板设置有冷却肋,并且冷却框架设置有至少一个面向插头条的冷却腿,使得插头条位于具有冷却肋的前板和冷却框架的冷却腿之间。 前板和冷却框架以导热方式通过前板上的导热网连接。

    Tightly-closing housing for an electronic circuit, particularly for a
control device of an internal combustion engine
    5.
    发明授权
    Tightly-closing housing for an electronic circuit, particularly for a control device of an internal combustion engine 失效
    用于电子电路的紧密封闭的外壳,特别是用于内燃机的控制装置

    公开(公告)号:US5118903A

    公开(公告)日:1992-06-02

    申请号:US679031

    申请日:1991-05-17

    IPC分类号: H05K7/20 H05K5/00

    摘要: The housing for an electronic circuit provided with a connection plug, particularly for control electronics of an internal combustion engine of a vehicle, includes a frame, to which a printed circuit board having the electronic circuit is fastened, and a heat sink, the power components of the electronic circuit being positionally adjacent the heat sink so as to be able to transfer heat to the heat sink during operation of the electronic circuit board. The frame is constructed as an injection molded plastic frame (2) with a heat sink (14) including at least one built-in heat conducting crosspiece (13) having one end (15) and another end (17). The one end (15) has a component assembly surface (16) located in the housing interior and the other end (17) is constructed as a heat removing element (18) extending from the frame (2) toward the exterior (FIGS. 1 and 2). The power components are located next to the component assembly surface (16).

    摘要翻译: PCT No.PCT / DE90 / 00741 Sec。 371日期1991年5月17日 102(e)日期1991年5月17日PCT提交1990年9月28日PCT公布。 第WO91 / 05451号公报 日期为1991年04月18日。具有连接插头的电子电路的壳体,特别是用于车辆的内燃机的控制电子装置的电子电路的壳体包括:框架,其上紧固有电子电路的印刷电路板,以及 散热器,电子电路的功率部件位于与散热器相邻的位置,以便能够在电子电路板的操作期间将热传递到散热器。 框架被构造为具有散热器(14)的注模塑料框架(2),散热器(14)包括至少一个具有一端(15)和另一端(17)的内置导热横档(13)。 一端(15)具有位于壳体内部的部件组装表面(16),另一端(17)被构造为从框架(2)向外部延伸的散热元件(18)(图1 和2)。 功率部件位于组件组件表面(16)的旁边。