公开(公告)号：US20230071592A1

公开(公告)日：2023-03-09

申请号：US18053737

申请日：2022-11-08

Applicant: Gigaphoton Inc.

Inventor： Akira SUWA ,  Kouji KAKIZAKI ,  Masakazu KOBAYASHI ,  Junichi FUJIMOTO ,  Yasufumi KAWASUJI

IPC: H05K3/46 ,  H05K3/40 ,  B23K26/066

Abstract: A laser processing method according to a viewpoint of the present disclosure includes radiating ultraviolet pulse laser light onto a workpiece having a stacked structure in which a conductor layer, an insulating layer, and a sacrificial layer are stacked on each other in the presented order, the pulse laser light radiated from the side facing the sacrificial layer, to change a laser ablation processing mode in the sacrificial layer and form a through hole in the sacrificial layer, radiating the pulse laser light onto the insulating layer through the through hole to form an opening in the insulating layer, and removing the sacrificial layer after the formation of the opening.

公开(公告)号：US20200290156A1

公开(公告)日：2020-09-17

申请号：US16889791

申请日：2020-06-01

Applicant: Gigaphoton Inc.

Inventor： Akira SUWA ,  Kouji KAKIZAKI ,  Masakazu KOBAYASHI ,  Osamu WAKABAYASHI

IPC: B23K26/382 ,  B23K26/0622 ,  B23K26/066 ,  B23K26/06 ,  B23K26/04 ,  B23K26/03

Abstract: A laser processing method of performing laser processing on a transparent material that is transparent to ultraviolet light includes: A. a positioning step of performing positioning so that a transfer position of a transfer image is set at a position inside the transparent material at a predetermined depth ΔZsf from a surface of the transparent material in an optical axis direction; B. an irradiation condition acquisition step; C. a determination step of determining whether a maximum fluence of a pulse laser beam at the surface of the transparent material is within a predetermined range based on irradiation conditions; and D. a control step of allowing irradiation with the pulse laser beam when the maximum fluence is determined to be in the predetermined range.

公开(公告)号：US20200209760A1

公开(公告)日：2020-07-02

申请号：US16812784

申请日：2020-03-09

Applicant: Gigaphoton Inc.

Inventor： Koji KAKIZAKI ,  Masakazu KOBAYASHI ,  Akira SUWA ,  Osamu WAKABAYASHI

IPC: G03F7/20 ,  H01S3/225 ,  H01S3/11

Abstract: A laser processing method of performing laser processing on a transparent material that is transparent to ultraviolet light by using a laser processing system includes: performing relative positioning of a transfer position of a transfer image and the transparent material in an optical axis direction of a pulse laser beam so that the transfer position is set at a position inside the transparent material at a predetermined depth ΔZsf from a surface of the transparent material in the optical axis direction; and irradiating the transparent material with the pulse laser beam having a pulse width of 1 ns to 100 ns inclusive and a beam diameter of 10 μm to 150 μm inclusive at the transfer position.

公开(公告)号：US20240058894A1

公开(公告)日：2024-02-22

申请号：US18487994

申请日：2023-10-16

Applicant: Gigaphoton Inc.

Inventor： Akira SUWA ,  Osamu WAKABAYASHI ,  Masashi SHIMBORI ,  Masakazu KOBAYASHI

IPC: B23K26/14 ,  B23K26/12

CPC classification number: B23K26/1462 ,  B23K26/126

Abstract: A laser processing apparatus according to the present disclosure includes a placement base on which a processing receiving object is placed, an optical system that guides laser light to the processing receiving object, a gas supply port via which a gas is supplied to a laser light irradiated region of the processing receiving object, a gas recovery port via which the supplied gas is recovered, a mover that moves the irradiated region, and a controller that controls, in accordance with the moving direction of the irradiated region, the direction of the flow of the gas flowing from the gas supply port to the gas recovery port, and the controller changes the direction of the gas flow in response to a change in the moving direction of the irradiated region in such a way that the gas flows in the direction opposite the moving direction of the irradiated region.

公开(公告)号：US20210046584A1

公开(公告)日：2021-02-18

申请号：US17088704

申请日：2020-11-04

Applicant: Gigaphoton Inc.

Inventor： Akira SUWA ,  Osamu WAKABAYASHI ,  Masashi SHIMBORI ,  Masakazu KOBAYASHI

IPC: B23K26/14 ,  B23K26/12

Abstract: A laser processing apparatus according to the present disclosure includes a placement base on which a processing receiving object is placed, an optical system that guides laser light to the processing receiving object, a gas supply port via which a gas is supplied to a laser light irradiated region of the processing receiving object, a gas recovery port via which the supplied gas is recovered, a mover that moves the irradiated region, and a controller that controls, in accordance with the moving direction of the irradiated region, the direction of the flow of the gas flowing from the gas supply port to the gas recovery port, and the controller changes the direction of the gas flow in response to a change in the moving direction of the irradiated region in such a way that the gas flows in the direction opposite the moving direction of the irradiated region.