LASER PROCESSING METHOD AND CIRCUIT BOARD MANUFACTURING METHOD

    公开(公告)号:US20230071592A1

    公开(公告)日:2023-03-09

    申请号:US18053737

    申请日:2022-11-08

    Abstract: A laser processing method according to a viewpoint of the present disclosure includes radiating ultraviolet pulse laser light onto a workpiece having a stacked structure in which a conductor layer, an insulating layer, and a sacrificial layer are stacked on each other in the presented order, the pulse laser light radiated from the side facing the sacrificial layer, to change a laser ablation processing mode in the sacrificial layer and form a through hole in the sacrificial layer, radiating the pulse laser light onto the insulating layer through the through hole to form an opening in the insulating layer, and removing the sacrificial layer after the formation of the opening.

    LASER PROCESSING SYSTEM AND LASER PROCESSING METHOD

    公开(公告)号:US20190283177A1

    公开(公告)日:2019-09-19

    申请号:US16429091

    申请日:2019-06-03

    Abstract: A laser processing system includes a wavelength tunable laser apparatus capable of changing the wavelength of pulsed laser light to be outputted, an optical system irradiating a workpiece with the pulsed laser light, a reference wavelength acquisition section acquiring a reference wavelength corresponding to photon absorption according to the material of the workpiece, a laser processing controller controlling the wavelength tunable laser apparatus to perform preprocessing before final processing performed on the workpiece, changes the wavelength of the pulsed laser light over a predetermined range containing the reference wavelength, and performs wavelength search preprocessing at a plurality of wavelengths, a processed state measurer measuring a processed state on a wavelength basis achieved by the wavelength search preprocessing performed at the plurality of wavelengths, and an optimum wavelength determination section assessing the processed state on a wavelength basis to determine an optimum wavelength used in the final processing.

    LASER PROCESSING SYSTEM AND LASER PROCESSING METHOD

    公开(公告)号:US20190283179A1

    公开(公告)日:2019-09-19

    申请号:US16378102

    申请日:2019-04-08

    Abstract: A laser processing system includes: a wavelength-variable laser device configured to output each of a laser beam at an absorption line as a wavelength at which light is absorbed by oxygen and a laser beam at a non-absorption line as a wavelength at which the amount of light absorption by oxygen is smaller than at the absorption line; an optical system configured to irradiate a workpiece with the laser beam; and a laser control unit configured to control the wavelength-variable laser device, set the wavelength of the laser beam output from the wavelength-variable laser device to be the non-absorption line when laser processing is performed on the surface of the workpiece in gas containing oxygen, and set the wavelength of the laser beam output from the wavelength-variable laser device to be the absorption line when ozone cleaning is performed on the surface of the workpiece in gas containing oxygen.

    LASER APPARATUS AND LASER PROCESSING SYSTEM
    5.
    发明申请

    公开(公告)号:US20190245321A1

    公开(公告)日:2019-08-08

    申请号:US16389860

    申请日:2019-04-19

    CPC classification number: H01S3/10015 H01S3/10 H01S3/10084 H01S3/11 H01S3/2251

    Abstract: A laser apparatus includes: (A) a solid-state laser apparatus that outputs burst seed pulsed light containing a plurality of pulses; (B) an excimer amplifier that amplifies the burst seed pulsed light in a discharge space in a single occurrence of discharge and outputs the amplified light as amplified burst pulsed light; (C) an energy sensor that measures the energy of the amplified burst pulsed light; and (D) a laser controller that corrects the timing at which the solid-state laser apparatus is caused to output the burst seed pulsed light based on the relationship of the difference between the timing at which the solid-state laser apparatus outputs the burst seed pulsed light and the timing at which the discharge occurs in the discharge space with a measured value of the energy.

    LASERSYSTEM
    6.
    发明申请

    公开(公告)号:US20160344158A1

    公开(公告)日:2016-11-24

    申请号:US15227028

    申请日:2016-08-03

    Abstract: There is provided a laser system that may include a Raman cell, a pumping light generator, and a Raman cell laser unit. The pumping light generator may include one or more optical parametric amplifiers (OPAs), and may be configured to output first Raman-cell pumping light and second Raman-cell pumping light to the Raman cell. The Raman cell laser unit may be configured to output probing light as a target of wavelength conversion to the Raman cell.

    Abstract translation: 提供了可以包括拉曼单元,泵浦光发生器和拉曼单元激光器单元的激光系统。 泵浦光发生器可以包括一个或多个光学参量放大器(OPA),并且可以被配置为将第一拉曼单元泵浦光和第二拉曼单元泵浦光输出到拉曼单元。 拉曼单元激光单元可以被配置为将作为波长转换的目标的探测光输出到拉曼单元。

    EXCIMER LASER APPARATUS AND EXCIMER LASER SYSTEM
    7.
    发明申请
    EXCIMER LASER APPARATUS AND EXCIMER LASER SYSTEM 有权
    EXCIMER激光设备和激光激光系统

    公开(公告)号:US20160254634A1

    公开(公告)日:2016-09-01

    申请号:US15150800

    申请日:2016-05-10

    CPC classification number: H01S3/036 H01S3/038 H01S3/134 H01S3/225

    Abstract: The excimer laser apparatus may include a laser chamber configured to contain gas, a pair of electrodes provided in the laser chamber, a power source unit configured to supply a pulse voltage between the pair of electrodes, a gas supply unit configured to supply gas into the laser chamber, a gas exhaust unit configured to partially exhaust gas from within the laser chamber, and a gas control unit configured to control the gas supply unit and the gas exhaust unit, where a replacement ratio of gas to be replaced from within the laser chamber increases as deterioration of the pair of electrodes progresses, the deterioration being represented by a deterioration parameter of the pair of electrodes.

    Abstract translation: 准分子激光装置可以包括配置为容纳气体的激光室,设置在激光室中的一对电极,配置为在一对电极之间提供脉冲电压的电源单元,被配置为将气体供应到 激光室,构成为从激光室内部分地排出气体的排气单元,以及气体控制单元,其配置为控制气体供给单元和排气单元,在所述气体供给单元和所述排气单元中, 随着一对电极的劣化进一步增加,劣化由一对电极的劣化参数表示。

    TEMPERATURE CONTROLLER FOR GAS LASER
    9.
    发明申请
    TEMPERATURE CONTROLLER FOR GAS LASER 有权
    气体激光温度控制器

    公开(公告)号:US20130294470A1

    公开(公告)日:2013-11-07

    申请号:US13936819

    申请日:2013-07-08

    Abstract: A temperature controller for a gas laser which controls temperatures of a plurality of temperature-controlled apparatuses including a first temperature-controlled portion requiring a high-precision temperature-control and a second temperature-controlled portion requiring a low-precision temperature-control as compared with the first temperature-controlled portion and allowing a temperature-control with a low or high temperature as compared with the first temperature-controlled portion, comprises a first temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each first temperature-controlled portion, a second temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each second temperature-controlled portion, a first piping system connecting the first temperature control portion and each first temperature-controlled portion in parallel, and a second piping system connecting the second temperature control portion and each second temperature-controlled portion in parallel.

    Abstract translation: 一种用于气体激光器的温度控制器,其控制多个温度控制装置的温度,包括需要高精度温度控制的第一温度控制部分和需要低精度温度控制的第二温度控制部分 与第一温度控制部分相比,第一温度控制部分与低温或高温的温度控制相比,包括产生冷却剂的第一温度控制部分或用于调节每个第一温度控制部分的温度的加热剂 温度控制部分,产生冷却剂的第二温度控制部分或用于调节每个第二温度控制部分的温度的加热剂,将第一温度控制部分和第一温度控制部分并联连接的第一管道系统, 以及连接第二回火的第二管道系统 所述控制部分和每个第二温度控制部分并联。

    TEMPERATURE CONTROLLER FOR GAS LASER

    公开(公告)号:US20130294469A1

    公开(公告)日:2013-11-07

    申请号:US13936734

    申请日:2013-07-08

    Abstract: A temperature controller for a gas laser which controls temperatures of a plurality of temperature-controlled apparatuses including a first temperature-controlled portion requiring a high-precision temperature-control and a second temperature-controlled portion requiring a low-precision temperature-control as compared with the first temperature-controlled portion and allowing a temperature-control with a low or high temperature as compared with the first temperature-controlled portion, comprises a first temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each first temperature-controlled portion, a second temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each second temperature-controlled portion, a first piping system connecting the first temperature control portion and each first temperature-controlled portion in parallel, and a second piping system connecting the second temperature control portion and each second temperature-controlled portion in parallel.

Patent Agency Ranking