公开(公告)号：US08552517B1

公开(公告)日：2013-10-08

申请号：US12881905

申请日：2010-09-14

申请人： Giuseppe Selli ,  Michael DeVita ,  Bob Shih-Wei Kuo

发明人： Giuseppe Selli ,  Michael DeVita ,  Bob Shih-Wei Kuo

IPC分类号： H01L31/00

CPC分类号： H01L31/02008 ,  H01L31/048 ,  H01L31/054 ,  H01L2224/32225 ,  Y02E10/52

摘要： In accordance with the present invention, there is provided a CPV module wherein a solder paste is used as an alternative to wire bonds or braided ribbon/mesh connectors to facilitate the electrical connectivity between the concentrated photovoltaic receiver cell or die of the CPV module and the conductive pattern of the underlying substrate thereof. In accordance with the present invention, the possibility of accidentally shorting the top of the receiver die with the other metal parts of the CPV module is avoided by molding at least the periphery of the receiver die with a mold body, and then dispensing or printing the conductive paste between the top of the receiver die and the substrate, the mold body defining a reservoir which facilities the flow of the conductive paste in a prescribed pattern.

摘要翻译： 根据本发明，提供了一种CPV模块，其中使用焊膏作为引线键合或编织带/网格连接器的替代方案，以便于CPV模块的集中的光伏接收器单元或管芯之间的电连接和 导电图案。 根据本发明，通过用模具本体至少模制接收器模具的周边，然后分配或印刷该模块来避免与CPV模块的其它金属部件意外短路接收器模具的顶部的可能性 在接收器管芯的顶部和基底之间的导电糊料，模具主体限定了以规定的模式设置导电膏的流动的储存器。

公开(公告)号：US08199518B1

公开(公告)日：2012-06-12

申请号：US12708033

申请日：2010-02-18

申请人： Jong Ok Chun ,  Nozad Karim ,  Richard Chen ,  Giuseppe Selli ,  Michael Kelly

发明人： Jong Ok Chun ,  Nozad Karim ,  Richard Chen ,  Giuseppe Selli ,  Michael Kelly

IPC分类号： H05K7/10

CPC分类号： H01L24/49 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0215 ,  H05K1/0218 ,  H05K1/115 ,  H05K1/165 ,  H05K7/10 ,  H05K2201/09436 ,  H05K2201/09481 ,  H05K2201/10287 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.

摘要翻译： 电子部件封装包括基板和安装到基板的电子部件，电子部件包括接合焊盘。 第一天线端子电连接到接合焊盘，第一天线端子电连接到衬底的第二天线端子。 封装体包围电子部件，封装主体具有主表面。 通过施加导电涂层在主表面上形成天线。 嵌入式互连件在基板和主表面之间延伸穿过封装主体并将第二天线端子电连接到天线。 施加导电涂层以形成天线相对简单，从而使整体封装制造成本最小化。 此外，天线相对较薄，从而使整体封装尺寸最小化。

公开(公告)号：US09433117B1

公开(公告)日：2016-08-30

申请号：US13475469

申请日：2012-05-18

申请人： Jong Ok Chun ,  Nozad Karim ,  Richard Chen ,  Giuseppe Selli ,  Michael Kelly

发明人： Jong Ok Chun ,  Nozad Karim ,  Richard Chen ,  Giuseppe Selli ,  Michael Kelly

IPC分类号： H05K7/10 ,  H05K1/02

CPC分类号： H01L24/49 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0215 ,  H05K1/0218 ,  H05K1/115 ,  H05K1/165 ,  H05K7/10 ,  H05K2201/09436 ,  H05K2201/09481 ,  H05K2201/10287 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.

摘要翻译： 电子部件封装包括基板和安装到基板的电子部件，电子部件包括接合焊盘。 第一天线端子电连接到接合焊盘，第一天线端子电连接到衬底的第二天线端子。 封装体包围电子部件，封装主体具有主表面。 通过施加导电涂层在主表面上形成天线。 嵌入式互连件在基板和主表面之间延伸穿过封装主体并将第二天线端子电连接到天线。 施加导电涂层以形成天线相对简单，从而使整体封装制造成本最小化。 此外，天线相对较薄，从而使整体封装尺寸最小化。