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    Top port MEMS microphone package and method
    1.
    发明授权
    Top port MEMS microphone package and method 有权
    顶端口MEMS麦克风封装及方法

    公开(公告)号：US09420378B1

    公开(公告)日：2016-08-16

    申请号：US12834682

    申请日：2010-07-12

    申请人： Ahmer Raza Syed ,  Bob Shih-Wei Kuo ,  Louis B. Troche, Jr.

    发明人： Ahmer Raza Syed ,  Bob Shih-Wei Kuo ,  Louis B. Troche, Jr.

    IPC分类号： H04R9/08 ,  H04R11/04

    CPC分类号： H04R9/08 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R11/04 ,  H04R19/005 ,  H04R19/04 ,  H01L2924/00014

    摘要： A top port MEMS microphone package includes a substrate having a back volume expanding aperture therein. A MEMS microphone electronic component is mounted to the substrate directly above the back volume expanding aperture such that an aperture of the MEMS microphone electronic component is in fluid communication with the back volume expanding aperture. A lid having a lid cavity is mounted to the substrate. The back volume expanding aperture couples the aperture of the MEMS microphone electronic component to the lid cavity. By coupling the lid cavity to the aperture with the back volume expanding aperture, the resulting back volume is essentially the size of the entire top port MEMS microphone package. In this manner, the noise to signal ratio is minimized thus maximizing the sensitivity of the top port MEMS microphone package as well as the range of applications.

    摘要翻译： 顶端MEMS麦克风封装包括其中具有后体积扩展孔的衬底。 MEMS麦克风电子部件直接安装在背面体积扩张孔上方的基板上，使得MEMS麦克风电子部件的孔径与后扩张孔径流体连通。 具有盖腔的盖子安装到基板上。 后体积扩大孔将MEMS麦克风电子部件的孔耦合到盖腔。 通过将盖腔与后体积扩大孔耦合到孔，所产生的背部体积基本上是整个顶端MEMS麦克风封装的尺寸。 以这种方式，噪声与信号的比例被最小化，从而使顶端MEMS麦克风封装的灵敏度以及应用范围最大化。

    Frame interconnect for concentrated photovoltaic module
    2.
    发明授权
    Frame interconnect for concentrated photovoltaic module 有权
    集中光伏组件的框架互连

    公开(公告)号：US08866004B1

    公开(公告)日：2014-10-21

    申请号：US12481512

    申请日：2009-06-09

    申请人： Bob Shih-Wei Kuo ,  SungSun Park

    发明人： Bob Shih-Wei Kuo ,  SungSun Park

    IPC分类号： H01L31/00 ,  H01L31/042

    CPC分类号： H01L31/042 ,  H01L31/02008 ,  Y02E10/50

    摘要： In accordance with the present invention, there is provided multiple embodiments of a concentrated photovoltaic (CPV) receiver package or module which includes a uniquely configured frame interconnect to facilitate the electrical connection of a receiver die of the CPV module to the conductive pattern of an underlying substrate thereof. In each embodiment of the present invention, a single piece of sheet metal is bent to form features to fit over the bus bar on the receiver die and bond pads of the conductive pattern on the substrate. Electrical connections can be made by soldering or conductive paste attach. Elevated, flat areas between connections facilitates vacuum pick up and automatic assembly and provides high potential insulation between connects. Additionally, in each embodiment of the present invention, the piece of bent sheet metal used to form the frame interconnect of the CPV module includes a solderable surface finish, and defines a window to accommodate an optical prism or other light guide for concentrating solar rays.

    摘要翻译： 根据本发明，提供了集中光伏（CPV）接收器封装或模块的多个实施例，其包括唯一配置的帧互连，以便于将CPV模块的接收器管芯电连接到基础的导电图案 底物。 在本发明的每个实施例中，单片金属片被弯曲以形成特征以配合在接收器管芯上的汇流条上以及衬底上的导电图案的接合焊盘。 电连接可以通过焊接或导电膏附着。 两个连接之间的高平坦区域有助于真空吸附和自动组装，并提供连接之间的高电位绝缘。 此外，在本发明的每个实施例中，用于形成CPV模块的框架互连件的弯曲金属板片包括可焊接的表面光洁度，并且限定了用于容纳用于聚集太阳光线的光学棱镜或其他光导的窗口。

    Reversible top/bottom MEMS package
    3.
    发明授权
    Reversible top/bottom MEMS package 有权
    可逆顶/底MEMS封装

    公开(公告)号：US08030722B1

    公开(公告)日：2011-10-04

    申请号：US12397470

    申请日：2009-03-04

    申请人： David Bolognia ,  Bob Shih Wei Kuo ,  Bud Troche

    发明人： David Bolognia ,  Bob Shih Wei Kuo ,  Bud Troche

    IPC分类号： H01L31/0203

    CPC分类号： B81B7/0061 ,  B81B7/0064 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/092 ,  B81B2207/095 ,  B81B2207/096 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/15151

    摘要： A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. A cover substrate having a plurality of metal traces and a plurality of cover vias is provided. A first die is attached to the first surface of the substrate and positioned over the opening. Side members are coupled to ground planes on the base substrate and cover substrate to form an RF shield around the first die. At least one wirebond having a first end attached to the first die and a second end attached to a metal trace of the base substrate is provided. The at least one wirebond forms a loop wherein a top section of the loop contacts a metal trace of the cover substrate.

    摘要翻译： 半导体器件具有具有多个金属迹线和多个基极通孔的基底基板。 通过基底基板形成开口。 提供具有多个金属迹线和多个覆盖通孔的覆盖基板。 第一模具附接到基板的第一表面并且定位在开口上方。 侧构件耦合到基底基板和覆盖基板上的接地平面，以在第一裸片周围形成RF屏蔽。 提供了至少一个引线键，其具有附接到第一管芯的第一端和附接到基底衬底的金属迹线的第二端。 所述至少一个引线键形成环，其中所述环的顶部部分接触所述覆盖基板的金属迹线。

    Conductive paste and mold for electrical connection of photovoltaic die to substrate
    5.
    发明授权
    Conductive paste and mold for electrical connection of photovoltaic die to substrate 有权
    导电浆料和模具用于将光电晶片与基板电连接

    公开(公告)号：US08552517B1

    公开(公告)日：2013-10-08

    申请号：US12881905

    申请日：2010-09-14

    申请人： Giuseppe Selli ,  Michael DeVita ,  Bob Shih-Wei Kuo

    发明人： Giuseppe Selli ,  Michael DeVita ,  Bob Shih-Wei Kuo

    IPC分类号： H01L31/00

    CPC分类号： H01L31/02008 ,  H01L31/048 ,  H01L31/054 ,  H01L2224/32225 ,  Y02E10/52

    摘要： In accordance with the present invention, there is provided a CPV module wherein a solder paste is used as an alternative to wire bonds or braided ribbon/mesh connectors to facilitate the electrical connectivity between the concentrated photovoltaic receiver cell or die of the CPV module and the conductive pattern of the underlying substrate thereof. In accordance with the present invention, the possibility of accidentally shorting the top of the receiver die with the other metal parts of the CPV module is avoided by molding at least the periphery of the receiver die with a mold body, and then dispensing or printing the conductive paste between the top of the receiver die and the substrate, the mold body defining a reservoir which facilities the flow of the conductive paste in a prescribed pattern.

    摘要翻译： 根据本发明，提供了一种CPV模块，其中使用焊膏作为引线键合或编织带/网格连接器的替代方案，以便于CPV模块的集中的光伏接收器单元或管芯之间的电连接和 导电图案。 根据本发明，通过用模具本体至少模制接收器模具的周边，然后分配或印刷该模块来避免与CPV模块的其它金属部件意外短路接收器模具的顶部的可能性 在接收器管芯的顶部和基底之间的导电糊料，模具主体限定了以规定的模式设置导电膏的流动的储存器。

    Stacked and staggered die MEMS package and method
    8.
    发明授权
    Stacked and staggered die MEMS package and method 有权
    堆叠和交错模具MEMS封装和方法

    公开(公告)号：US09013011B1

    公开(公告)日：2015-04-21

    申请号：US13046071

    申请日：2011-03-11

    申请人： Bob Shih-Wei Kuo ,  Brett Arnold Dunlap ,  Louis B. Troche, Jr. ,  Ahmer Syed ,  Russell Shumway

    发明人： Bob Shih-Wei Kuo ,  Brett Arnold Dunlap ,  Louis B. Troche, Jr. ,  Ahmer Syed ,  Russell Shumway

    IPC分类号： H01L23/49 ,  H01L27/04

    CPC分类号： H01L27/04 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A staggered die MEMS package includes a substrate having a converter cavity formed therein. A converter electronic component is mounted within the converter cavity. Further, a MEMS electronic component is mounted to both the substrate and the converter electronic component in a staggered die arrangement. By staggering the MEMS electronic component directly on the converter electronic component instead of locating the MEMS electronic component in a side by side arrangement with the converter electronic component, the total package width of the staggered die MEMS package is minimized. Further, by locating the converter electronic component within the converter cavity and staggering the MEMS electronic component directly on the converter electronic component, the total package height, sometimes called Z-height, of the staggered die MEMS package is minimized.

    摘要翻译： 交错的模具MEMS封装包括其中形成有转换器腔的衬底。 A转换器电子部件安装在转换器腔内。 此外，MEMS电子部件以交错的管芯装置安装到基板和转换器电子部件两者。 通过直接在转换器电子部件上交错MEMS电子部件，而不是将MEMS电子部件与转换器电子部件并排布置，使交错的模具MEMS封装的总封装宽度最小化。 此外，通过将转换器电子部件定位在转换器腔内并将MEMS电子部件直接交错在转换器电子部件上，交错模具MEMS封装的总封装高度（有时称为Z高度）被最小化。

    Leadframe structure for concentrated photovoltaic receiver package
    10.
    发明授权
    Leadframe structure for concentrated photovoltaic receiver package 有权
    集中光伏接收器封装的引线框架结构

    公开(公告)号：US08680656B1

    公开(公告)日：2014-03-25

    申请号：US12348853

    申请日：2009-01-05

    申请人： Bob Shih Wei Kuo ,  John Merrill Nickelsen, Jr. ,  Timothy L. Olson

    发明人： Bob Shih Wei Kuo ,  John Merrill Nickelsen, Jr. ,  Timothy L. Olson

    IPC分类号： H01L23/495

    CPC分类号： H01L31/0547 ,  H01L23/49562 ,  H01L31/0508 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/1815 ,  Y02E10/52 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

    摘要： In accordance with the present invention, there is provided multiple embodiments of a concentrated photovoltaic receiver package or module. In each embodiment of the present invention, the module comprises a leadframe including a first section and a second section disposed in spaced relation to each other. Mounted to the first section of the leadframe is a receiver die. The receiver die is electrically connected to both the first and second sections of the leadframe. In one embodiment of the present invention, the receiver die is electrically connected to the second section of the leadframe by a plurality of conductive wires. In another embodiment of the present invention, the receiver die is electrically connected to the second section of the leadframe by a conductive bonding material. Portions of the leadframe may optionally be covered by a molded body which can be used to define an alignment feature for a light concentrating device such as a light guide or optical rod.

    摘要翻译： 根据本发明，提供了集中光伏接收器封装或模块的多个实施例。 在本发明的每个实施例中，模块包括引线框架，该引线框架包括彼此间隔开设置的第一部分和第二部分。 安装在引线框架的第一部分是接收器模具。 接收器管芯电连接到引线框架的第一和第二部分。 在本发明的一个实施例中，接收器管芯通过多个导电线电连接到引线框架的第二部分。 在本发明的另一个实施例中，接收器管芯通过导电接合材料电连接到引线框架的第二部分。 引线框架的部分可以可选地被成型体覆盖，该成型体可以用于限定用于诸如光导或光棒的聚光装置的对准特征。