公开(公告)号：US06566612B2

公开(公告)日：2003-05-20

申请号：US10055294

申请日：2002-01-22

申请人： Guy P. Brouillette ,  David H. Danovitch ,  Peter A. Gruber ,  Michael Liehr ,  Carlos J. Sambucetti

发明人： Guy P. Brouillette ,  David H. Danovitch ,  Peter A. Gruber ,  Michael Liehr ,  Carlos J. Sambucetti

IPC分类号： H01R909

CPC分类号： H01L21/563 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  H01L2924/00

摘要： A method for direct chip attach of a semiconductor chip to a circuit board by using solder bumps and an underfill layer is disclosed. In the method, a layer of in-situ polymeric mold material is first screen printed on the top surface of the semiconductor chip exposing a multiplicity of bond pads. The in-situ polymeric mold layer is formed with a multiplicity of apertures which are then filled with solder material in a molten solder screening process to form solder bumps. A thin flux-containing underfill material layer is then placed on top of a circuit board over a plurality of conductive pads which are arranged in a mirror image to the bond pads on the semiconductor chip. The semiconductor chip and the circuit board are then pressed together with the underfill layer inbetween and heated to a reflow temperature of higher than the melting temperature of the solder material until electrical communication is established between the bond pads and the conductive pads. In the bonded assembly, the in-situ polymeric mold layer and the underfill material layer forms a composite underfill to replace a conventional underfill material that must be injected between bonded chip and substrate by a capillary action in a time consuming process.

公开(公告)号：US06341418B1

公开(公告)日：2002-01-29

申请号：US09301890

申请日：1999-04-29

申请人： Guy P. Brouillette ,  David H. Danovitch ,  Peter A. Gruber ,  Michael Liehr ,  Carlos J. Sambucetti

发明人： Guy P. Brouillette ,  David H. Danovitch ,  Peter A. Gruber ,  Michael Liehr ,  Carlos J. Sambucetti

IPC分类号： H05K334

CPC分类号： H01L21/563 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  H01L2924/00

摘要： A method for direct chip attach of a semiconductor chip to a circuit board by using solder bumps and an underfill layer is disclosed. In the method, a layer of in-situ polymeric mold material is first screen printed on the top surface of the semiconductor chip exposing a multiplicity of bond pads. The in-situ polymeric mold layer is formed with a multiplicity of apertures which are then filled with solder material in a molten solder screening process to form solder bumps. A thin flux-containing underfill material layer is then placed on top of a circuit board over a plurality of conductive pads which are arranged in a mirror image to the bond pads on the semiconductor chip. The semiconductor chip and the circuit board are then pressed together with the underfill layer inbetween and heated to a reflow temperature of higher than the melting temperature of the solder material until electrical communication is established between the bond pads and the conductive pads. In the bonded assembly, the in-situ polymeric mold layer and the underfill material layer forms a composite underfill to replace a conventional underfill material that must be injected between bonded chip and substrate by a capillary action in a time consuming process.

摘要翻译： 公开了一种通过使用焊料凸块和底部填充层将半导体芯片直接贴合到电路板的方法。 在该方法中，首先在半导体芯片的顶表面上丝网印刷一层原位聚合物模材料，暴露出多个接合焊盘。 原位聚合物模具层形成有多个孔，然后在熔融焊料筛选过程中用焊料材料填充以形成焊料凸块。 然后将薄的含有焊剂的底层填充材料层放置在电路板的顶部上，该多个导电焊盘以镜像形式布置在半导体芯片上的接合焊盘上。 然后将半导体芯片和电路板与其中的底部填充层一起压在一起，并被加热到高于焊料材料的熔融温度的回流温度，直到在焊盘和导电焊盘之间建立电连通。 在粘合组件中，原位聚合物模层和底部填充材料层形成复合底层填料，以代替在耗时的过程中必须通过毛细管作用在粘合的芯片和衬底之间注入的常规底部填充材料。

公开(公告)号：US06276596B1

公开(公告)日：2001-08-21

申请号：US09649487

申请日：2000-08-28

申请人： Peter A. Gruber ,  Lannie R. Bolde ,  Guy P. Brouillette ,  James H. Covell ,  David Danovitch ,  Chon C. Lei

发明人： Peter A. Gruber ,  Lannie R. Bolde ,  Guy P. Brouillette ,  James H. Covell ,  David Danovitch ,  Chon C. Lei

IPC分类号： B23K3102

CPC分类号： H05K3/3468 ,  B23K3/0638 ,  B23K35/0222 ,  B23K2101/40 ,  H01L21/4846 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/0415 ,  H05K2203/074 ,  H05K2203/128

摘要： A method for joining a multiplicity of multi-alloy solder columns to an electronic substrate and the structure formed by such method are disclosed. In the method, a mold plate equipped with a multiplicity of cavities is first filled by an injection molded solder technique with a high temperature solder forming a multiplicity of solder columns. The mold plate is then sandwiched between an extraction plate and a transfer plate by utilizing a multiplicity of displacement means equipped in the extraction plate to displace the multiplicity of solder columns from the mold plate into a multiplicity of apertures equipped in the transfer plate. The multiplicity of cavities in the transfer plate each has a straight opening and a flared opening. The flared opening is then filled with a low temperature solder paste to encapsulate one end of the high temperature solder column. The low temperature solder paste is then reflown on top of a conductive pad on an electronic substrate at a temperature lower than the melting temperature of the high temperature solder to form a bond between the solder column and the conductive pad.

摘要翻译： 公开了一种将多种多合金焊料柱连接到电子基板的方法以及通过这种方法形成的结构。 在该方法中，首先通过注射成型的焊接技术填充配备有多个空腔的模板，其中高温焊料形成多个焊料柱。 然后通过利用设置在提取板中的多个位移装置将模板夹在提取板和转印板之间，以将多个焊料柱从模板移位成装配在转印板中的多个孔。 传递板中的多个空腔各具有直的开口和扩口的开口。 然后用扩散的开口填充低温焊膏以封装高温焊料柱的一端。 然后在低于高温焊料的熔融温度的温度下，将低温焊膏在电子基板上的导电焊盘的顶部上进行退火，以在焊料柱和导电焊盘之间形成接合。