公开(公告)号：US06276596B1

公开(公告)日：2001-08-21

申请号：US09649487

申请日：2000-08-28

申请人： Peter A. Gruber ,  Lannie R. Bolde ,  Guy P. Brouillette ,  James H. Covell ,  David Danovitch ,  Chon C. Lei

发明人： Peter A. Gruber ,  Lannie R. Bolde ,  Guy P. Brouillette ,  James H. Covell ,  David Danovitch ,  Chon C. Lei

IPC分类号： B23K3102

CPC分类号： H05K3/3468 ,  B23K3/0638 ,  B23K35/0222 ,  B23K2101/40 ,  H01L21/4846 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/0415 ,  H05K2203/074 ,  H05K2203/128

摘要： A method for joining a multiplicity of multi-alloy solder columns to an electronic substrate and the structure formed by such method are disclosed. In the method, a mold plate equipped with a multiplicity of cavities is first filled by an injection molded solder technique with a high temperature solder forming a multiplicity of solder columns. The mold plate is then sandwiched between an extraction plate and a transfer plate by utilizing a multiplicity of displacement means equipped in the extraction plate to displace the multiplicity of solder columns from the mold plate into a multiplicity of apertures equipped in the transfer plate. The multiplicity of cavities in the transfer plate each has a straight opening and a flared opening. The flared opening is then filled with a low temperature solder paste to encapsulate one end of the high temperature solder column. The low temperature solder paste is then reflown on top of a conductive pad on an electronic substrate at a temperature lower than the melting temperature of the high temperature solder to form a bond between the solder column and the conductive pad.

摘要翻译： 公开了一种将多种多合金焊料柱连接到电子基板的方法以及通过这种方法形成的结构。 在该方法中，首先通过注射成型的焊接技术填充配备有多个空腔的模板，其中高温焊料形成多个焊料柱。 然后通过利用设置在提取板中的多个位移装置将模板夹在提取板和转印板之间，以将多个焊料柱从模板移位成装配在转印板中的多个孔。 传递板中的多个空腔各具有直的开口和扩口的开口。 然后用扩散的开口填充低温焊膏以封装高温焊料柱的一端。 然后在低于高温焊料的熔融温度的温度下，将低温焊膏在电子基板上的导电焊盘的顶部上进行退火，以在焊料柱和导电焊盘之间形成接合。

公开(公告)号：US5982038A

公开(公告)日：1999-11-09

申请号：US850092

申请日：1997-05-01

申请人： Hilton T. Toy ,  Lannie R. Bolde ,  James H. Covell, II ,  David L. Edwards ,  Lewis S. Goldmann ,  Peter A. Gruber

发明人： Hilton T. Toy ,  Lannie R. Bolde ,  James H. Covell, II ,  David L. Edwards ,  Lewis S. Goldmann ,  Peter A. Gruber

IPC分类号： H01L23/02 ,  H01L23/10 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/10 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/16152

摘要： The present invention relates generally to a new scheme of providing a seal for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection.For the preferred embodiment the multi-layer metallic seal is a two layer, solder structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder structure has a thick high melting point temperature region that is attached to a cap, and a thin interconnecting region of lower melting point temperature region for sealing the substrate to the cap.

摘要翻译： 本发明一般涉及为半导体衬底和芯片载体提供密封的新方案。 更具体地，本发明包括使用多层金属密封件来为芯片载体上的芯片提供保护的结构和方法。 这种多层金属密封提供增强的气密寿命和环境保护。 对于优选实施例，多层金属密封件是用于为模块产生低成本，高可靠性气密密封的两层焊料结构。 这种焊料结构具有连接到盖的厚的高熔点温度区域和用于将衬底密封到帽的较低熔点温度区域的薄互连区域。

公开(公告)号：US5821161A

公开(公告)日：1998-10-13

申请号：US850091

申请日：1997-05-01

申请人： James H. Covell, II ,  Lannie R. Bolde ,  David L. Edwards ,  Lewis S. Goldmann ,  Peter A. Gruber ,  Hilton T. Toy

发明人： James H. Covell, II ,  Lannie R. Bolde ,  David L. Edwards ,  Lewis S. Goldmann ,  Peter A. Gruber ,  Hilton T. Toy

IPC分类号： H01L21/50 ,  H01L23/10 ,  H01L21/44

CPC分类号： H01L23/10 ,  H01L21/50 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/163

摘要： The present invention relates generally to a new scheme of providing a seal for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal is a two layer, solder structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder structure has a thick high melting point temperature region that is attached to a cap, and a thin interconnecting region of lower melting point temperature region for sealing the substrate to the cap.

摘要翻译： 本发明一般涉及为半导体衬底和芯片载体提供密封的新方案。 更具体地，本发明包括使用多层金属密封件来为芯片载体上的芯片提供保护的结构和方法。 这种多层金属密封提供增强的气密寿命和环境保护。 对于优选实施例，多层金属密封件是用于为模块产生低成本，高可靠性气密密封的两层焊料结构。 这种焊料结构具有连接到盖的厚的高熔点温度区域和用于将衬底密封到帽的较低熔点温度区域的薄互连区域。

公开(公告)号：US06566612B2

公开(公告)日：2003-05-20

申请号：US10055294

申请日：2002-01-22

申请人： Guy P. Brouillette ,  David H. Danovitch ,  Peter A. Gruber ,  Michael Liehr ,  Carlos J. Sambucetti

发明人： Guy P. Brouillette ,  David H. Danovitch ,  Peter A. Gruber ,  Michael Liehr ,  Carlos J. Sambucetti

IPC分类号： H01R909

CPC分类号： H01L21/563 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  H01L2924/00

摘要： A method for direct chip attach of a semiconductor chip to a circuit board by using solder bumps and an underfill layer is disclosed. In the method, a layer of in-situ polymeric mold material is first screen printed on the top surface of the semiconductor chip exposing a multiplicity of bond pads. The in-situ polymeric mold layer is formed with a multiplicity of apertures which are then filled with solder material in a molten solder screening process to form solder bumps. A thin flux-containing underfill material layer is then placed on top of a circuit board over a plurality of conductive pads which are arranged in a mirror image to the bond pads on the semiconductor chip. The semiconductor chip and the circuit board are then pressed together with the underfill layer inbetween and heated to a reflow temperature of higher than the melting temperature of the solder material until electrical communication is established between the bond pads and the conductive pads. In the bonded assembly, the in-situ polymeric mold layer and the underfill material layer forms a composite underfill to replace a conventional underfill material that must be injected between bonded chip and substrate by a capillary action in a time consuming process.

公开(公告)号：US06341418B1

公开(公告)日：2002-01-29

申请号：US09301890

申请日：1999-04-29

申请人： Guy P. Brouillette ,  David H. Danovitch ,  Peter A. Gruber ,  Michael Liehr ,  Carlos J. Sambucetti

发明人： Guy P. Brouillette ,  David H. Danovitch ,  Peter A. Gruber ,  Michael Liehr ,  Carlos J. Sambucetti

IPC分类号： H05K334

CPC分类号： H01L21/563 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  H01L2924/00

摘要： A method for direct chip attach of a semiconductor chip to a circuit board by using solder bumps and an underfill layer is disclosed. In the method, a layer of in-situ polymeric mold material is first screen printed on the top surface of the semiconductor chip exposing a multiplicity of bond pads. The in-situ polymeric mold layer is formed with a multiplicity of apertures which are then filled with solder material in a molten solder screening process to form solder bumps. A thin flux-containing underfill material layer is then placed on top of a circuit board over a plurality of conductive pads which are arranged in a mirror image to the bond pads on the semiconductor chip. The semiconductor chip and the circuit board are then pressed together with the underfill layer inbetween and heated to a reflow temperature of higher than the melting temperature of the solder material until electrical communication is established between the bond pads and the conductive pads. In the bonded assembly, the in-situ polymeric mold layer and the underfill material layer forms a composite underfill to replace a conventional underfill material that must be injected between bonded chip and substrate by a capillary action in a time consuming process.

摘要翻译： 公开了一种通过使用焊料凸块和底部填充层将半导体芯片直接贴合到电路板的方法。 在该方法中，首先在半导体芯片的顶表面上丝网印刷一层原位聚合物模材料，暴露出多个接合焊盘。 原位聚合物模具层形成有多个孔，然后在熔融焊料筛选过程中用焊料材料填充以形成焊料凸块。 然后将薄的含有焊剂的底层填充材料层放置在电路板的顶部上，该多个导电焊盘以镜像形式布置在半导体芯片上的接合焊盘上。 然后将半导体芯片和电路板与其中的底部填充层一起压在一起，并被加热到高于焊料材料的熔融温度的回流温度，直到在焊盘和导电焊盘之间建立电连通。 在粘合组件中，原位聚合物模层和底部填充材料层形成复合底层填料，以代替在耗时的过程中必须通过毛细管作用在粘合的芯片和衬底之间注入的常规底部填充材料。

公开(公告)号：US5961032A

公开(公告)日：1999-10-05

申请号：US884977

申请日：1997-06-30

申请人： James H. Covell, II ,  Shaji Farooq ,  Peter A. Gruber ,  Sudipta K. Ray

发明人： James H. Covell, II ,  Shaji Farooq ,  Peter A. Gruber ,  Sudipta K. Ray

IPC分类号： B22C9/22 ,  B23K3/06 ,  B23K35/02 ,  H01L21/60 ,  H01L23/12 ,  H01L23/50 ,  H05K3/34 ,  B23K35/012 ,  B23K31/002 ,  B22C9/020

CPC分类号： H05K3/3468 ,  B22C9/22 ,  B23K3/0607 ,  B23K35/0222 ,  B23K2201/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K2201/0379 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  H05K3/3463

摘要： A method is described for forming solder mounds for attachment to electronic devices. The solder mounds are preferably in the form of columns and comprise a first solder portion and a second solder portion with the two solder portions having different melting points. The solder columns are preferably formed using an injection molding device. The method is directed to the use of a single column mold to form the multi-solder column. In one embodiment, deformable material is used to partially block a portion of the through opening of the mold during a first solder injection process. The deformable material is then removed and the remainder of the through openings of the mold filled with a second molten solder. The multi-solder column is then electrically connected to a substrate by reflowing.

摘要翻译： 描述了用于形成用于附接到电子设备的焊接凸块的方法。 焊料块优选为柱状，并且包括第一焊料部分和第二焊料部分，其中两个焊料部分具有不同的熔点。 焊料柱优选使用注射成型装置形成。 该方法涉及使用单柱模具来形成多焊料柱。 在一个实施例中，可变形材料用于在第一次焊接注入过程期间部分地阻挡模具的通孔的一部分。 然后去除可变形材料，并且模具的通孔的其余部分填充有第二熔融焊料。 然后通过回流将多焊料柱电连接到衬底。

公开(公告)号：US06924171B2

公开(公告)日：2005-08-02

申请号：US09782494

申请日：2001-02-13

申请人： Stephen L. Buchwalter ,  David Danovitch ,  Fuad Elias Doany ,  Claudius Feger ,  Peter A. Gruber ,  Revathi Iyengar ,  Nancy C. LaBianca

发明人： Stephen L. Buchwalter ,  David Danovitch ,  Fuad Elias Doany ,  Claudius Feger ,  Peter A. Gruber ,  Revathi Iyengar ,  Nancy C. LaBianca

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L23/295 ,  H01L24/11 ,  H01L24/29 ,  H01L24/94 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/01083 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/05599

摘要： Methods for fabricating microelectronic interconnection structures as well as the structures formed by the methods are disclosed which improve the manufacturing throughput for assembling flip chip semiconductor devices. The use of a bilayer of polymeric materials applied on the wafer prior to dicing eliminates the need for dispensing and curing underfill for each semiconductor at the package level, thereby improving manufacturing throughput and reducing cost.

摘要翻译： 公开了制造微电子互连结构的方法以及通过这些方法形成的结构，其提高了组装倒装芯片半导体器件的制造吞吐量。 在切割之前使用在晶片上施加的聚合物材料的双层，消除了在封装级别为每个半导体分配和固化底部填充物的需要，从而提高制造产量并降低成本。

公开(公告)号：US20120234902A1

公开(公告)日：2012-09-20

申请号：US13487378

申请日：2012-06-04

申请人： S. Jay Chey ,  David Danovitch ,  Peter A. Gruber ,  Cornelia K. Tsang

发明人： S. Jay Chey ,  David Danovitch ,  Peter A. Gruber ,  Cornelia K. Tsang

IPC分类号： B23K31/02 ,  B23K3/06

CPC分类号： B23K1/0016 ,  B23K3/0638 ,  B23K2101/40

摘要： A plurality of through-substrate holes is formed in each of at least one substrate. Each through-substrate hole extends from a top surface of the at least one substrate to the bottom surface of the at least one substrate. The at least one substrate is held by a stationary chuck or a rotating chuck. Vacuum suction is provided to a set of through-substrate holes among the plurality of through-substrate holes through a vacuum manifold attached to the bottom surface of the at least one substrate. An injection mold solder head located above the top surface of the at least one substrate injects a solder material into the set of through-substrate holes to form a plurality of through-substrate solders that extend from the top surface to the bottom surface of the at least one substrate. The vacuum suction prevents formation of air bubbles or incomplete filling in the plurality of through-substrate holes.

摘要翻译： 在至少一个基板中的每一个中形成多个贯通基板孔。 每个贯穿基板孔从至少一个基板的顶表面延伸到至少一个基板的底表面。 至少一个基板由固定卡盘或旋转卡盘保持。 通过安装在至少一个基板的底面上的真空歧管，将多个通孔基板孔内的一组贯通基板孔提供真空抽吸。 位于至少一个衬底的顶表面上方的注射模具焊头将焊料材料注入到一组通孔衬底孔中，以形成从顶表面延伸到底表面的多个通孔衬底焊料 至少一个底物。 真空吸力防止在多个贯通基板孔中形成气泡或不完全填充。

公开(公告)号：US20110079632A1

公开(公告)日：2011-04-07

申请号：US12571965

申请日：2009-10-01

申请人： S. Jay Chey ,  David Danovitch ,  Peter A. Gruber ,  Cornelia K. Tsang

发明人： S. Jay Chey ,  David Danovitch ,  Peter A. Gruber ,  Cornelia K. Tsang

IPC分类号： B23K31/02 ,  B23K37/06

CPC分类号： B23K1/0016 ,  B23K3/0638 ,  B23K2101/40

摘要： A plurality of through-substrate holes is formed in each of at least one substrate. Each through-substrate hole extends from a top surface of the at least one substrate to the bottom surface of the at least one substrate. The at least one substrate is held by a stationary chuck or a rotating chuck. Vacuum suction is provided to a set of through-substrate holes among the plurality of through-substrate holes through a vacuum manifold attached to the bottom surface of the at least one substrate. An injection mold solder head located above the top surface of the at least one substrate injects a solder material into the set of through-substrate holes to form a plurality of through-substrate solders that extend from the top surface to the bottom surface of the at least one substrate. The vacuum suction prevents formation of air bubbles or incomplete filling in the plurality of through-substrate holes.

摘要翻译： 在至少一个基板中的每一个中形成多个贯通基板孔。 每个贯穿基板孔从至少一个基板的顶表面延伸到至少一个基板的底表面。 至少一个基板由固定卡盘或旋转卡盘保持。 通过安装在至少一个基板的底面上的真空歧管，将多个通孔基板孔内的一组贯通基板孔提供真空抽吸。 位于至少一个衬底的顶表面上方的注射模具焊头将焊料材料注入到一组通孔衬底孔中，以形成从顶表面延伸到底表面的多个通孔衬底焊料 至少一个底物。 真空吸力防止在多个贯通基板孔中形成气泡或不完全填充。

公开(公告)号：US08828860B2

公开(公告)日：2014-09-09

申请号：US13600204

申请日：2012-08-30

申请人： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

发明人： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

IPC分类号： H01L21/00

CPC分类号： H05K3/3436 ,  B23K1/0016 ,  B23K3/0638 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/11011 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16113 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81065 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/14 ,  H01L2924/20104 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/35 ,  H05K3/3494 ,  H05K13/0465 ,  H05K2203/043 ,  H01L2924/00014 ,  H01L2924/014

摘要： Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting temperature of the inner portions of the solder bumps. As the inner portions of the solder bumps do not collapse during reflow, a flip chip assembly can be made at relatively low temperatures and have a high stand-off height. A structure having double solder bumps facilitates flip chip assembly.

摘要翻译： 采用多次注入熔融焊料来形成双层焊料凸点，其外层在比其内部部分更低的温度下熔化。 在倒装芯片组装过程中，回流温度高于外层的熔化温度并低于焊料凸块的内部部分的熔化温度。 由于焊料凸块的内部在回流期间不会塌陷，所以可以在相对低的温度下制造倒装芯片组件并具有高的间隔高度。 具有双重焊料凸块的结构有助于倒装芯片组装。