-
公开(公告)号：US06915563B2
公开(公告)日：2005-07-12
申请号：US10604150
申请日：2003-06-27
CPC分类号： H01L21/67144 , Y10T29/49117 , Y10T29/49139 , Y10T29/49822 , Y10T29/53257 , Y10T29/53274 , Y10T29/53283
摘要： An apparatus for removing attached die having a pivoting means, having a pivot point and first and second sides, the pivot point having a corresponding first y coordinate, the first and second sides positioned opposite to one another, said pivoting means capable of attaching to a die carrier. The apparatus also having a shaft attached to the first side of the pivoting means. The apparatus further having a counterweight attached to the second side of the pivoting means. The apparatus lastly having a clamping means capable of attaching to at least one die, the die having a corresponding second y coordinate, wherein the first y coordinate is greater than the second y coordinate.
摘要翻译： 一种用于去除连接的模具的装置，具有枢转装置，具有枢转点和第一和第二侧面，所述枢轴点具有对应的第一y坐标，所述第一和第二侧面彼此相对定位，所述枢转装置能够附接到 模具载体 该装置还具有附接到枢转装置的第一侧的轴。 该装置还具有附接到枢转装置的第二侧的配重。 该装置最后具有能够附接到至少一个模具的夹紧装置，该模具具有对应的第二y坐标，其中第一y坐标大于第二y坐标。
-
公开(公告)号：US06182356B2
公开(公告)日：2001-02-06
申请号：US08977523
申请日：1997-11-24
申请人： Lannie R. Bolde
发明人： Lannie R. Bolde
IPC分类号： B23P1920
CPC分类号： H01L21/67144 , B23K3/0623 , B23K2101/40 , H05K3/3478 , Y10T29/49895 , Y10T29/53535
摘要： A method and apparatus for loading solder balls into a mold. Solder balls are loaded into a reservoir having multiple exit ports. A removable mold is fitted into the apparatus and the reservoir is passed across the top of the mold while solder balls are fed into cavities in the mold. After the reservoir has advanced across the mold and the mold cavities are filled with solder balls, the reservoir is reset as a roller is simultaneously guided across the mold to seat the solder balls firmly within the mold. Alternatively, the roller may be applied to the solder balls while the reservoir advances across the mold, or both as the the reservoir is advanced and when it is returned to its original position.
摘要翻译： 一种用于将焊球加载到模具中的方法和装置。 焊球被装载到具有多个出口的储存器中。 将可移除的模具装配到装置中，并且将储存器穿过模具的顶部，同时将焊球进给到模具中的空腔中。 在储存器已经推进穿过模具并且模具腔充满焊球之后，当辊同时被引导穿过模具以将焊球牢固地安置在模具内时，储存器被复位。 或者，当储存器前进并且当其返回到其初始位置时，可以将储存器推进到模具上，或者两者都可以将滚筒施加到焊球。
-
公开(公告)号：US06888363B1
公开(公告)日：2005-05-03
申请号：US10710223
申请日：2004-06-28
申请人： Lannie R. Bolde , David C. Olson
发明人： Lannie R. Bolde , David C. Olson
IPC分类号： G01R31/26
CPC分类号： G01R31/2891
摘要： A system for burn-in testing of integrated circuits employs a cooling module with an aperture that accommodates a standard size holder for various chips, the holder being placed in the mouth of the aperture, in contact with a flexible seal. When the module is raised to make contact from below with a socket on a test board, the seal confines the cooling fluid and contacts on the upper surface of the holder are pressed against a set of corresponding contacts on the test board.
摘要翻译： 用于集成电路的老化测试的系统采用具有孔的冷却模块，其容纳用于各种芯片的标准尺寸保持器，所述保持器放置在孔的口中，与柔性密封件接触。 当模块升高以从下方与测试板上的插座接触时，密封件限制冷却流体，并且保持器的上表面上的触点被压在测试板上的一组对应的触点上。
-
公开(公告)号：US06360940B1
公开(公告)日：2002-03-26
申请号：US09709092
申请日：2000-11-08
IPC分类号： B23K1018
CPC分类号： H01L21/67144 , B23K1/018 , H01L21/67253
摘要： Preferred embodiments for methods of removing an integrated circuit (“IC”) from a substrate, where the IC is attached to the substrate by multiple solder connections are disclosed. One preferred embodiment of the inventive methods provides the steps of heating the IC and substrate to the reflow temperature for the solder connections and pulling the IC from the substrate by means of a vacuum force. Another preferred embodiment of the inventive method provides the step of shearing the IC from the substrate after the substrate and IC are heated, but before solder reflow temperature has been reached, and where the shearing force may be programmed through a computer controlled servomotor. Preferred embodiments of certain apparatus applying the inventive methods for removing an integrated circuit from a substrate are also disclosed. One preferred embodiment of the inventive apparatus includes a vented pallet to hold the substrate and IC and through which the vacuum force is applied to pull the IC from the substrate without the use of physical clamping or contact forces applied to the substrate or IC. In a further preferred embodiment of the inventive apparatus, shear elements are provided and used with a programmable servomotor for precisely controlling the forces applied to the substrate and IC as a function of time, temperature and translational distance.
摘要翻译： 公开了用于通过多个焊接连接将集成电路附接到衬底的衬底去除集成电路（“IC”）的方法的优选实施例。 本发明方法的一个优选实施例提供了将IC和衬底加热至用于焊料连接的回流温度并通过真空力将IC从衬底拉出的步骤。 本发明方法的另一优选实施例提供了在衬底和IC被加热之后但在达到焊锡回流温度之前以及剪切力可以通过计算机控制的伺服电动机编程的情况下从衬底剪切IC的步骤。 还公开了应用本发明的从基板去除集成电路的方法的某些设备的优选实施例。 本发明装置的一个优选实施例包括一个通风的托盘，用于保持基板和IC，并且通过其施加真空力以将IC从基板拉出，而不用施加到基板或IC上的物理夹紧或接触力。 在本发明装置的另一优选实施例中，提供剪切元件并与可编程伺服电机一起使用，用于根据时间，温度和平移距离精确控制施加到基板和IC的力。
-
5.发明授权Low temperature solder column attach by injection molded solder and structure formed 失效低温焊料柱通过注塑焊料附着并形成结构公开(公告)号：US06276596B1
公开(公告)日：2001-08-21
申请号：US09649487
申请日：2000-08-28
申请人： Peter A. Gruber , Lannie R. Bolde , Guy P. Brouillette , James H. Covell , David Danovitch , Chon C. Lei
发明人： Peter A. Gruber , Lannie R. Bolde , Guy P. Brouillette , James H. Covell , David Danovitch , Chon C. Lei
IPC分类号： B23K3102
CPC分类号： H05K3/3468 , B23K3/0638 , B23K35/0222 , B23K2101/40 , H01L21/4846 , H05K2203/0113 , H05K2203/0338 , H05K2203/0415 , H05K2203/074 , H05K2203/128
摘要： A method for joining a multiplicity of multi-alloy solder columns to an electronic substrate and the structure formed by such method are disclosed. In the method, a mold plate equipped with a multiplicity of cavities is first filled by an injection molded solder technique with a high temperature solder forming a multiplicity of solder columns. The mold plate is then sandwiched between an extraction plate and a transfer plate by utilizing a multiplicity of displacement means equipped in the extraction plate to displace the multiplicity of solder columns from the mold plate into a multiplicity of apertures equipped in the transfer plate. The multiplicity of cavities in the transfer plate each has a straight opening and a flared opening. The flared opening is then filled with a low temperature solder paste to encapsulate one end of the high temperature solder column. The low temperature solder paste is then reflown on top of a conductive pad on an electronic substrate at a temperature lower than the melting temperature of the high temperature solder to form a bond between the solder column and the conductive pad.
摘要翻译： 公开了一种将多种多合金焊料柱连接到电子基板的方法以及通过这种方法形成的结构。 在该方法中，首先通过注射成型的焊接技术填充配备有多个空腔的模板，其中高温焊料形成多个焊料柱。 然后通过利用设置在提取板中的多个位移装置将模板夹在提取板和转印板之间，以将多个焊料柱从模板移位成装配在转印板中的多个孔。 传递板中的多个空腔各具有直的开口和扩口的开口。 然后用扩散的开口填充低温焊膏以封装高温焊料柱的一端。 然后在低于高温焊料的熔融温度的温度下，将低温焊膏在电子基板上的导电焊盘的顶部上进行退火，以在焊料柱和导电焊盘之间形成接合。
-
公开(公告)号：US07806312B2
公开(公告)日：2010-10-05
申请号：US11551754
申请日：2006-10-23
IPC分类号： B23K1/018
CPC分类号： H01L21/67144 , B23K1/018
摘要： A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the shear force is created by a bimetallic disk that, when heat is applied, is transformed into shearing force. The shearing force is delayed by a delaying device until the connectors connecting the chip to the substrate are soft enough that the application of shear force will separate the chip from the substrate without damaging the chip's connectors. The delaying device includes a physical gap that may be adjusted to control when the shear force is applied to the chip.
摘要翻译： 公开了一种用于将芯片从衬底上分离的方法和结构，其将剪切力的传递延迟到芯片，直到将芯片附接到衬底的连接器足够柔软，使得剪切力的传递不会损坏芯片的连接器。 更具体地，剪切力由双金属盘产生，当加热时，双金属盘被转化为剪切力。 剪切力由延迟装置延迟，直到将芯片连接到基板的连接器足够柔软，使得施加剪切力将使芯片与基板分离而不损坏芯片的连接器。 该延迟装置包括物理间隙，该物理间隙可以被调整以控制何时施加剪切力到芯片。
-
公开(公告)号：US07296725B2
公开(公告)日：2007-11-20
申请号：US11426986
申请日：2006-06-28
申请人： Peter M. Gruber , Lannie R. Bolde
发明人： Peter M. Gruber , Lannie R. Bolde
IPC分类号： B23K15/02
CPC分类号： B23K3/0638 , B23K3/053 , B23K3/0607
摘要： A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second leads are in electrical communication with the drive unit. The first lead is positioned in the reservoir so that it electrically communicates with the second lead through the molten solder when the molten solder reaches a triggering level, but so that it does not electrically communicate with the second lead when the level is below the triggering level. The drive unit feeds the solid solder wire into the reservoir based upon a state of electrical communication between the first and second leads.
摘要翻译： 提供具有储存器，驱动单元，第一引线和第二引线的焊料馈送装置。 储存器将固体焊丝熔化成熔融焊料，而驱动单元选择性地将固体焊丝馈送到储存器中。 第一和第二引线与驱动单元电连通。 第一引线定位在储存器中，使得当熔融焊料达到触发水平时，其通过熔融焊料与第二引线电连通，但是当电平低于触发电平时它不与第二引线电连通 。 驱动单元基于第一和第二引线之间的电连通状态将固体焊丝馈送到储存器中。
-
公开(公告)号：US6029882A
公开(公告)日：2000-02-29
申请号：US67904
申请日：1998-04-27
CPC分类号： B23K3/0638 , H01L21/4853 , H05K3/3468 , B23K2201/40 , H01L2224/11003 , H01L2924/01019 , H01L2924/01068 , H01L2924/01322 , H01L2924/10253 , H05K2201/10424 , H05K2203/0113 , H05K2203/0338 , H05K2203/128
摘要： Disclosed is a solder injection mold apparatus and method for providing solder balls to a printed circuit board substrate using the solder injection mold apparatus in the plastic ball grid array (PBGA). The solder mold through holes are chamfered at entry and at exit ends to assist in receipt of molten solder and the formation and transfer of solder balls to lands on the substrate. A blind recess is provided in the second major surface of the mold, i.e. the side facing the substrate, in order to accommodate electronic components mounted thereon. Solder balls are delivered and metallurgically affixed to the lands in a process that requires only one reflow, leaving the through holes clean of solder and the mold ready for reuse. The material of which the substrate, mold and base plate are comprised is selected to be non-wettable by solder and mutually compatible with respect to CTE when exposed to temperatures of molten solder.
摘要翻译： 公开了一种使用塑料球栅阵列（PBGA）中的焊料注射模具装置向印刷电路板基板提供焊球的焊料注射模具装置和方法。 焊接模具通孔在入口处和出口端被倒角，以帮助接收熔融焊料，并且将焊球形成和转移到衬底上的焊盘上。 在模具的第二主表面，即面向衬底的一侧设置盲孔，以容纳安装在其上的电子部件。 焊球在仅需要一个回流的过程中输送和冶金地附着在焊盘上，留下通孔清洁焊料并且模具准备好重新使用。 选择基材，模具和基板的材料，当暴露于熔融焊料的温度时，被选择为不被焊料润湿并且相对于CTE相互兼容。
-
公开(公告)号：US07168609B2
公开(公告)日：2007-01-30
申请号：US10235007
申请日：2002-09-03
IPC分类号： B23K31/02
CPC分类号： H01L21/67144 , B23K1/018
摘要： A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the shear force is created by a bimetallic disk that, when heat is applied, is transformed into shearing force. The shearing force is delayed by a delaying device until the connectors connecting the chip to the substrate are soft enough that the application of shear force will separate the chip from the substrate without damaging the chip's connectors. The delaying device includes a physical gap that may be adjusted to control when the shear force is applied to the chip.
摘要翻译： 公开了一种用于将芯片从衬底上分离的方法和结构，其将剪切力的传递延迟到芯片，直到将芯片附接到衬底的连接器足够柔软，使得剪切力的传递不会损坏芯片的连接器。 更具体地，剪切力由双金属盘产生，当加热时，双金属盘被转化为剪切力。 剪切力由延迟装置延迟，直到将芯片连接到基板的连接器足够柔软，使得施加剪切力将使芯片与基板分离而不损坏芯片的连接器。 该延迟装置包括物理间隙，该物理间隙可以被调整以控制何时施加剪切力到芯片。
-
公开(公告)号：US06811072B2
公开(公告)日：2004-11-02
申请号：US09756832
申请日：2001-01-09
申请人： Lannie R. Bolde
发明人： Lannie R. Bolde
IPC分类号： B23K0018
CPC分类号： B23K1/018 , B23K2101/40
摘要： A method and apparatus for separating a chip from substrate where the chip is attached to the substrate by solder connections to form an assembly involve applying a loading force to drive a coil spring biased shearing element comprising a slide block with carrying a shearing blade into a loading position. Load the assembly of the substrate and the chip into a fixture with a window therethrough for the chip with the shearing blade in contact with the chip. Remove the loading force to arm the shearing blade to apply a shearing force from the shearing blade to the chip. Heat the solder connections of the assembly in the fixture to a predetermined temperature, preferably below the melting temperature of the solder at which shearing of the solder connections occurs. The shearing blade comprises a slidable plastic blade backed up by a metal blade. The shearing blades are affixed to a the slide block that is connected by a linkage to a coil spring which applies the biasing force thereto and which provides a nest for catching a chip which has been sheared away from a substrate.
摘要翻译： 一种用于将芯片与衬底分离的方法和装置，其中芯片通过焊接连接附接到衬底以形成组件，包括施加负载力以驱动螺旋弹簧偏置剪切元件，该剪切元件包括将剪切刀片承载在载荷 位置。 将基板和芯片的组件装载到具有穿过其中的窗口的夹具中，其中剪切刀片与芯片接触。 卸下装载力以将剪切刀片施加到剪切刀片上的剪切力到芯片上。 将组件中的组件的焊接连接加热到预定的温度，优选低于在焊料连接发生剪切的焊料的熔化温度。 剪切刀片包括由金属刀片支撑的可滑动的塑料刀片。 剪切刀片固定在滑动块上，该滑动块通过连接件与螺旋弹簧连接，螺旋弹簧向其施加偏置力，并且提供用于捕获已经剪切离开基底的芯片的嵌套。
-
-
-
-
-
-
-
-
-
搜索结果
21 条记录 (耗时 0.011 秒)
