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公开(公告)号：US4669599A
公开(公告)日：1987-06-02
申请号：US704652
申请日：1985-02-22
IPC分类号： B23Q7/16 , B65G43/08 , B65G47/244 , B65G47/24
CPC分类号： B65G47/244 , B65G2203/042
摘要： An apparatus and method for handling a workpiece includes the combination of a first workpiece position for checking the presence of a workpiece and a second subsequent position for checking the orientation of a workpiece. An orientation device adjacent the orientation checking position orients the workpiece to a proper position for subsequent transportation to a third workpiece position such that acceptable workpieces may be segregatably removed to a subsequent handling location.
摘要翻译： 用于处理工件的装置和方法包括用于检查工件的存在的第一工件位置和用于检查工件的取向的第二后续位置的组合。 邻近取向检查位置的定向装置将工件定位到适当的位置，以便随后运送到第三工件位置，使得可接受的工件可以分离地移除到随后的操作位置。
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公开(公告)号：US4877387A
公开(公告)日：1989-10-31
申请号：US798677
申请日：1985-11-15
CPC分类号： B29C43/361 , B23Q7/1426 , B29C33/36 , B29C43/06 , B29C43/18 , B29C45/0433 , B29C2043/046 , B29C2043/3444 , B29C2043/3615 , B29C31/006 , B29C70/72 , B29L2031/3406
摘要： An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are recirculatingly moved through the system for repeated usage.
摘要翻译： 一种自动连续循环模制系统，其中多个模具组以预定的定时循环通过一系列工作站运输，其中完成各种模制，固化和工件处理操作，并且其中模具组再循环移动通过系统以重复 用法。
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公开(公告)号：US06531083B1
公开(公告)日：2003-03-11
申请号：US08434336
申请日：1995-05-02
申请人： Mario A. Bolanos , Jeremias L. Libres , George A. Bednarz , Tay LiangChee , Julius Lim , Ireneus J. T. M. Pas
发明人： Mario A. Bolanos , Jeremias L. Libres , George A. Bednarz , Tay LiangChee , Julius Lim , Ireneus J. T. M. Pas
IPC分类号： B29C4502
CPC分类号： B29C45/14655 , B29C45/463 , H01L21/565 , H01L2224/48091 , H01L2924/00014
摘要： A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged sproutless mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 81 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 90 is placed over the bottom mold chase 81 and the mold compound package 71. The top mold chase 90 has die cavities 95 corresponding to those in the bottom mold chase 81. The mold compound insert 71 is preferably packaged in a plastic film 75 which has heat sealed edges 77. The mold compound is forced through the package 75 and heat seals 77 during the molding process by the pressure applied by a rectangular plunger 101. The sproutless mold compound insert is packaged so that the mold compound will exit the packaging only where runners intersect the receptacle. The sproutless mold compound insert requires no alignment or cutting tools within the mold station. The plunger is applied using variable speed and pressure to control the rate the mold compound fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and mining wire sweep of the bond wires of the integrated circuit assemblies.
摘要翻译： 一种用于封装集成电路管芯和引线框架组件的方法和装置。 将预先包装的无芽模具复合插入件71放置在底部模具追逐器81中的矩形插座91中。插座通过流道87连接到多个模具空腔85.引线框架组件包含引线框架，集成电路管芯和接合线 引线框架和模具放置在底部模具走沿81上方，使得集成电路模具均位于底部模具模腔85的上方。顶部模具追逐90放置在底部模具追逐器81和模具复合封装件71上。 顶模90具有对应于底模追逐81中的那些的模腔95.模具化合物插入件71优选地包装在具有热封边缘77的塑料膜75中。模具化合物被迫通过包装75并且热封 在模制过程中，通过由矩形柱塞101施加的压力来形成。77将无芽模具复合物插入物包装，使得模具化合物仅在运行时才离开包装 内部与插座相交。 无模具复合插入件不需要在模具台内对准或切割工具。 使用可变速度和压力施加柱塞以控制模具化合物填充顶部和底部模具中的空腔的速率，从而避免完成的包装中的空隙和集成电路组件的接合线的采矿线扫描。
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公开(公告)号：US5965078A
公开(公告)日：1999-10-12
申请号：US962694
申请日：1997-11-03
CPC分类号： B29C45/463
摘要： A method and apparatus for providing a prepackaged mold compound for use in encapsulating integrated circuit die and leadframe assemblies. A piece of mold compound 71 is placed in a receptacle 91 in a bottom mold chase 83. The receptacle 91 is coupled to a group of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 83 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 93 is placed over the bottom mold chase and the prepackaged mold compound 71. The prepackaged mold compound 71 is a piece of mold compound 73 packaged in a plastic film which has sealed edges 77. The edges are peelable seals, which are released during the molding process. The mold compound 73 is then forced through the seals during the molding process by the pressure applied by a plunger 101. The plunger 101 can be applied using variable speed and pressure to control the rate the mold compound 73 fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and minimizing wire sweep of the bond wires of the integrated circuit assemblies.
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公开(公告)号：US5912024A
公开(公告)日：1999-06-15
申请号：US643661
申请日：1996-05-06
申请人： Mario A. Bolanos , Jeremias L. Libres , George A. Bednarz , Tay LiangChee , Julius Lim , Ireneus J. T. M. Pas
发明人： Mario A. Bolanos , Jeremias L. Libres , George A. Bednarz , Tay LiangChee , Julius Lim , Ireneus J. T. M. Pas
IPC分类号： B29C45/26 , B29C45/02 , B29C45/14 , B29C45/46 , B29C45/77 , B29K101/10 , B29L31/34 , H01L21/56
CPC分类号： B29C45/14655 , B29C45/463 , H01L21/565 , H01L2224/48091
摘要： A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged sproutless mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 81 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 90 is placed over the bottom mold chase 81 and the mold compound package 71. The top mold chase 90 has die cavities 95 corresponding to those in the bottom mold chase 81. The mold compound insert 71 is preferably packaged in a plastic film 75 which has heat sealed edges 77. The mold compound is forced through the package 75 and heat seals 77 during the molding process by the pressure applied by a rectangular plunger 101. The sproutless mold compound insert is packaged so that the mold compound will exit the packaging only where runners intersect the receptacle. The sproutless mold compound insert requires no alignment or cutting tools within the mold station. The plunger is applied using variable speed and pressure to control the rate the mold compound fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and minimizing wire sweep of the bond wires of the integrated circuit assemblies.
摘要翻译： 一种用于封装集成电路管芯和引线框架组件的方法和装置。 将预先包装的无芽模具复合插入件71放置在底部模具追逐器81中的矩形插座91中。插座通过流道87连接到多个模具空腔85.引线框架组件包含引线框架，集成电路管芯和接合线 引线框架和模具放置在底部模具走沿81上方，使得集成电路模具均位于底部模具模腔85的上方。顶部模具追逐90放置在底部模具追逐器81和模具复合封装件71上。 顶模90具有对应于底模追逐81中的那些的模腔95.模具化合物插入件71优选地包装在具有热封边缘77的塑料膜75中。模具化合物被迫通过包装75并且热封 在模制过程中，通过由矩形柱塞101施加的压力来形成。77将无芽模具复合物插入物包装，使得模具化合物仅在运行时才离开包装 内部与插座相交。 无模具复合插入件不需要在模具台内对准或切割工具。 使用可变速度和压力施加柱塞以控制模具化合物填充顶部和底部模具中的空腔的速率，从而避免完成的包装中的空隙并且最小化集成电路组件的接合线的丝线扫掠。
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公开(公告)号：US5891377A
公开(公告)日：1999-04-06
申请号：US632253
申请日：1996-04-15
IPC分类号： B29C45/14 , B29C45/46 , H01L21/56 , H01L23/495 , H01L23/50 , B29C33/08 , B29C45/02 , B29C70/70
CPC分类号： B29C45/463 , B29C45/14655 , H01L21/565 , H01L21/566 , H01L23/49541 , H01L23/49558 , B29C2045/14663 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/00015 , H01L2924/01019 , H01L2924/01046 , H01L2924/12043 , H01L2924/14
摘要： A method and apparatus for encapsulating an integrated circuit die and leadframe assembly using dambarless leadframes. Dambarless leadframe 191 is formed having leads 193 that are widened in the region near the package edge such that the interlead spacing between adjacent leads is less than a predetermined minimum distance. Lower and upper mold release films 67 and 65 are stretched over a plurality of die cavities formed in bottom and top mold chases 179 and 173. The release films can be further stretched into the die cavities by a vacuum. Leadframe strip assemblies containing the dambarless leadframes, each holding integrated circuit dies 189 are placed such that the integrated circuit dies are each centered over a bottom mold die cavity 63 and over the bottom mold release films 65. When the top and bottom mold chases are superimposed, the mold release films 67 and 65 are clamped together, and an interface is formed at the edges of the top and bottom mold cavities and between the leads of the dambarless leadframe. The mold compound is forced into the cavities by pressure. The interface between the top and bottom release films prevents the mold compound from forming mold flash between the leads of the dambarless leadframe. The dambarless leadframe includes a specific support tape 197 for the internal leads and a specialized open gate design.
摘要翻译： 一种用于使用无阻挡引线框封装集成电路管芯和引线框架组件的方法和装置。 无引线框架191形成为具有在封装边缘附近的区域中加宽的引线193，使得相邻引线之间的交错间隔小于预定的最小距离。 下部和上部脱模膜67和65在形成在底部和顶部模具179和173中的多个模腔上拉伸。剥离膜可以通过真空进一步拉伸到模具腔中。 包含无铅引线框架的引线框架组件，每个保持集成电路模具189被放置成使得集成电路模具都位于底模具模腔63之上并且在底部模具脱模膜65上方。当顶部和底部模具叠加时 脱模膜67和65被夹紧在一起，并且界面形成在顶部和底部模腔的边缘处以及在无铅引线框架的引线之间。 模具化合物通过压力被迫进入空腔。 顶部和底部剥离膜之间的界面防止模具化合物在无阻挡引线框架的引线之间形成模具闪光。 无铅引线框架包括用于内部引线的专用支撑带197和专门的开放门设计。
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公开(公告)号：US4712994A
公开(公告)日：1987-12-15
申请号：US919580
申请日：1986-10-15
CPC分类号： B29C45/02 , B29C45/2756 , B29C45/572 , B29C45/73 , B29K2101/10
摘要： A method and apparatus for cold runner transfer molding. Insulating and/or cooling means are provided so that the mold runnerblock is kept sufficiently cool to prevent curing of the plastic molding compound therein. By the addition of a plunger near the gate of the mold, a quasi-continuous molding operation may be effected. Local preheating of the molding material at the gate locale may be used to liquefy a feedstock which has travelled through the cold-runners in powdered form.
摘要翻译： 冷流道传递成型的方法和装置。 提供绝缘和/或冷却装置，使得模具流道块保持足够的冷却，以防止塑料模塑料在其中固化。 通过在模具的浇口附近添加柱塞，可以进行准连续的模制操作。 浇口处的模塑材料的局部预热可用于液化以粉末形式穿过冷流道的原料。
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8.发明授权Method for pressing a plastic, which cures by means of a reaction, into a mould cavity, a pressing auxiliary in pill form to be used in this method and a holder composed of such material 失效将通过反应固化的塑料压入模腔中的方法，用于该方法的丸剂形式的压制助剂和由这种材料构成的保持器
公开(公告)号：US5431854A
公开(公告)日：1995-07-11
申请号：US256681
申请日：1994-07-20
申请人： Ireneus J. T. M. Pas
发明人： Ireneus J. T. M. Pas
IPC分类号： B29C45/00 , B29B11/04 , B29B11/14 , B29C31/06 , B29C43/02 , B29C45/46 , B29C45/53 , B29C45/02
CPC分类号： B29C45/462 , B29C45/463 , Y10S425/228
摘要： Method for pressing a plastic (6), which cures by means of a reaction, from a displacement chamber (4) via at least one injection channel (3) and a gate (2) to a mould cavity (1), said method at least comprising the following steps: pressurising the plastic (6) with an amount of a pressing auxiliary (7) in the displacement chamber (4); pressing the plastic (6) into the mould cavity (1); and allowing the plastic to cure under pressure in the mould cavity, the pressing auxiliary (7) being plastically deformable under the conditions of pressing and the amount thereof being sufficient to be pressed to the vicinity of the gate (2) of the mould cavity (1). Preferably the pressing auxiliary (7) is a thermoplastic.
摘要翻译： PCT No.PCT / NL93 / 00024 Sec。 371日期：1994年7月20日 102（e）日期1994年7月20日PCT 1993年1月22日PCT公布。 公开号WO93 / 14920 PCT 日期：1993年8月5日。将通过反应固化的塑料（6）从位移室（4）经由至少一个注入通道（3）和浇口（2）压入模腔 （1），所述方法至少包括以下步骤：在所述移动室（4）中用一定量的按压辅助件（7）对塑料（6）加压; 将塑料（6）压入模腔（1）中; 并且允许塑料在模腔中在压力下固化，压制辅助件（7）在压制条件下可塑性变形，并且其量足以被压到模腔的门（2）附近（ 1）。 优选地，压制辅助件（7）是热塑性的。
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9.发明授权Method for packing a measured quantity of thermosetting resin and operating a mold for encapsulating a component 失效用于包装热固性树脂的测量数量和操作用于包封组分的模具的方法
公开(公告)号：US5098626A
公开(公告)日：1992-03-24
申请号：US439658
申请日：1989-11-22
申请人： Ireneus J. T. M. Pas
发明人： Ireneus J. T. M. Pas
IPC分类号： B65B9/06 , B29C31/04 , B29C45/14 , B29C45/46 , B29C70/72 , B65B9/02 , B65B9/12 , B65B23/00 , H01L21/02 , H01L21/56
CPC分类号： B65B23/00 , B29C31/041 , B29C45/14655 , B29C45/463 , B29C70/72 , B65B9/02 , H01L21/565 , H01L2924/0002
摘要： Method for packing a measured quantity of thermosetting resin, intended for encapsulating a component such as an integrated circuit by introducing this quantity into a flexible plastics covering which can be sealed airtight, and packing for a measured quantity of thermosetting resin intended for encapsulating a component.
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公开(公告)号：US4553420A
公开(公告)日：1985-11-19
申请号：US537681
申请日：1983-09-30
CPC分类号： H05K13/025 , B21D5/00 , Y10T29/49121
摘要： Apparatus is provided for bending one or two complete rows of leads on a dual-in-line semiconductor package at one time without damaging the leads. The leads of the dual-in-line package are initially in their manufactured position, extending horizontally from the sides of the package and generally parallel to the top and bottom surface thereof. A support anvil is placed under the portion of the lead which is sealed in the semiconductor package, and a punch or bending member is disposed immediately adjacent the outside edge of the handle for performing the actual bending. A sheet of relatively thin metal is formed into a U-shaped channel and the bending member inserted therein before lowering so that as the bending member is lowered, no portion thereof touches the surface of the leads being bent. The sheet of thin metal buffers the bending operation and is interposed between the bottom and side of the bending member and the face of the leads for preventing scratching or damage thereto. At the end of the downward movement of the bending member, the row of leads is substantially nearly vertical and the anvil, sheet of metal and punch may be removed for the next successive dual-in-line package. For two row operation, both the anvil and the punch include die portions for bending the leads and the steel sheets are wound and unwound for protecting the leads being bent. A method of bending is also provided using a punch partially covered with a thin sheet of steel.
摘要翻译： 提供了用于一次在双列直插半导体封装上弯曲一行或两排完整引线的装置，而不会损坏引线。 双列直插式包装的引线最初处于其制造位置，从包装的侧面水平延伸并且大致平行于其顶部和底部表面。 将支撑砧放置在密封在半导体封装中的引线的部分下方，并且冲头或弯曲构件紧邻手柄的外边缘设置以进行实际弯曲。 相对薄的金属片形成为U形通道，并且弯曲构件在下降之前插入其中，使得当弯曲构件下降时，其一部分不接触引线的表面弯曲。 薄金属板缓冲弯曲操作，并且介于弯曲构件的底部和侧面与引线的面之间，用于防止刮伤或损坏。 在弯曲构件的向下运动结束时，该排引线基本上几乎垂直，并且砧座，金属片和冲头片可以被移除以用于下一个连续的双列直插式封装。 对于两排操作，砧座和冲头都包括用于弯曲引线的模具部分，并且钢板被卷绕和退绕以保护被弯曲的引线。 使用部分被薄钢板覆盖的冲头也提供弯曲方法。
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