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    Proximity sensor having substrate including light sensing area and temperature sensing area
    2.
    发明授权
    Proximity sensor having substrate including light sensing area and temperature sensing area 有权

    公开(公告)号：US10749066B2

    公开(公告)日：2020-08-18

    申请号：US16183429

    申请日：2018-11-07

    申请人： HAESUNG DS CO., LTD.

    发明人： Jin Woo Lee ,  Jin Kee Hong ,  Byung Moon Lee ,  Jong Woo Kim

    IPC分类号： H01L31/167 ,  H01L31/18 ,  H01L31/0224 ,  H01L31/024

    摘要： A proximity sensor includes a circuit board; a light-emitting element and a light-receiving element on the circuit board; a light barrier; molding portions; and a transparent board disposed on the molding portions and configured to form an air gap with the light-receiving element. The light-receiving element includes: a substrate having a light sensing area and a temperature sensing area; a first input electrode and a first output electrode which are aligned in the light sensing area and apart from each other with a first delay gap therebetween; a sensing film covering at least some portions of the first input electrode and the first output electrode; and a second input electrode and a second output electrode which are aligned in the temperature sensing area and apart from each other with a second delay gap therebetween. The second delay gap is exposed to air.

    Temperature sensor patch and adhesive type thermometer including the same
    3.
    发明授权
    Temperature sensor patch and adhesive type thermometer including the same 有权

    公开(公告)号：US10739205B2

    公开(公告)日：2020-08-11

    申请号：US15651374

    申请日：2017-07-17

    申请人： Haesung DS CO., Ltd.

    发明人： Jae Hoon Jang ,  Ho Sang Yu ,  Jin Woo Lee

    IPC分类号： G01K1/00 ,  G01K1/14 ,  G01K13/00

    摘要： Provided is a temperature sensor patch including: a base material having a lower surface that is an adhesive surface; a temperature sensor layer arranged on the base material, and including a temperature sensor at a side thereof and a connection terminal connected to the temperature sensor at the other side thereof; a cover layer configured to cover the temperature sensor layer and including a first opening exposing the connection terminal; and a module holder disposed inside the first opening, wherein a portion of the temperature sensor layer, where the connection terminal is arranged, is disposed on the module holder.

    Sensor package with reduced height cavity walls and sensor package module including the same
    6.
    发明授权
    Sensor package with reduced height cavity walls and sensor package module including the same 有权

    公开(公告)号：US11209323B2

    公开(公告)日：2021-12-28

    申请号：US16183503

    申请日：2018-11-07

    申请人： HAESUNG DS CO., LTD.

    发明人： Jin Woo Lee

    IPC分类号： H01L23/48 ,  G01K11/26 ,  G01K1/08 ,  H01L41/187

    摘要： In some embodiments, a sensor package includes: a substrate including a sensing area; a terminal portion disposed on a side of the sensing area of the substrate and including at least one terminal connected to the outside; a first outer wall disposed on the substrate and including a main wall surrounding at least some outer portions of the sensing area; at least one wire patterned and disposed on the substrate and configured to connect the sensing area and the terminal portion to each other; and a cover disposed on the first outer wall to correspond to the sensing area. Part of the main wall is disposed between the sensing area and the terminal portion, and the main wall includes an opening through which the at least one wire passes. Other embodiments may be disclosed and/or claimed.

    Saw based optical sensor device and package including the same
    7.
    发明授权
    Saw based optical sensor device and package including the same 有权

    公开(公告)号：US11112352B2

    公开(公告)日：2021-09-07

    申请号：US16183545

    申请日：2018-11-07

    申请人： HAESUNG DS CO., LTD.

    发明人： Jin Woo Lee ,  Byung Moon Lee ,  Jin Kee Hong ,  Jong Woo Kim

    IPC分类号： G01N21/17 ,  H05K1/02 ,  G01L9/00 ,  G01K11/26 ,  H05K3/28 ,  H05K1/18

    摘要： Provided are an optical sensor device using surface acoustic waves and an optical sensor device package. The optical sensor device includes: a substrate including a first light sensing area and a temperature sensing area and including a piezo electric material; a first input electrode and a first output electrode which are disposed in the first light sensing area and are apart from each other with a first delay gap therebetween; a first sensing film overlapping the first delay gap and configured to cover at least some portions of the first input electrode and the first output electrode; and a second input electrode and a second output electrode which are disposed in the temperature sensing area and are apart from each other with a second delay gap therebetween. The second delay gap is exposed to air.

    Sensor package and sensor package module including the same
    10.
    发明授权
    Sensor package and sensor package module including the same 有权

    公开(公告)号：US12104964B2

    公开(公告)日：2024-10-01

    申请号：US17531570

    申请日：2021-11-19

    申请人： HAESUNG DS CO., LTD.

    发明人： Jin Woo Lee

    IPC分类号： H01L23/49 ,  G01K1/08 ,  G01K11/26 ,  H01L23/48 ,  H10N30/853

    CPC分类号： G01K11/265 ,  G01K1/08 ,  H01L23/48 ,  H10N30/8542

    摘要： Provided are a sensor package and a sensor package module. The sensor package includes: a substrate including a sensing area; a terminal portion disposed on a side of the sensing area of the substrate and including at least one terminal connected to the outside; a first outer wall disposed on the substrate and including a main wall surrounding at least some outer portions of the sensing area; at least one wire patterned and disposed on the substrate and configured to connect the sensing area and the terminal portion to each other; and a cover disposed on the first outer wall to correspond to the sensing area. Part of the main wall is disposed between the sensing area and the terminal portion, and the main wall includes an opening through which the at least one wire passes.