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    DYE IMAGE ACQUISITION METHOD, DYE IMAGE ACQUISITION DEVICE, AND DYE IMAGE ACQUISITION PROGRAM
    2.
    发明公开
    DYE IMAGE ACQUISITION METHOD, DYE IMAGE ACQUISITION DEVICE, AND DYE IMAGE ACQUISITION PROGRAM 审中-公开

    公开(公告)号：US20240344985A1

    公开(公告)日：2024-10-17

    申请号：US18293518

    申请日：2022-07-25

    Applicant: HAMAMATSU PHOTONICS K.K.

    Inventor： Takafumi HIGUCHI ,  Kenichiro IKEMURA

    IPC: G01N21/64 ,  G06T7/00

    CPC classification number: G01N21/6456 ,  G01N21/6428 ,  G06T7/0002 ,  G01N2021/6439 ,  G06T2207/10064

    Abstract: A dye image acquisition system includes an image acquisition device that irradiates a sample with each of excitation light beams having C wavelength distributions and acquires the C fluorescence images each including N pixels; and an image processing device that clusters the N pixels into L (L is an integer of 2 or more and N−1 or less) pixel groups based on fluorescence intensities of respective pixels of the C fluorescence images, generates L cluster matrices in which the C fluorescence images are arranged, calculates statistical values of the fluorescence intensities of the pixel groups configuring the C fluorescence images, and performs unmixing on the C fluorescence images by using the statistical values of the C fluorescence images, and generates K (K is an integer of 2 or more and C or less) dye images indicating a distribution for each K dyes.

    METHOD FOR INSPECTING SEMICONDUCTOR AND SEMICONDUCTOR INSPECTING DEVICE
    6.
    发明申请
    METHOD FOR INSPECTING SEMICONDUCTOR AND SEMICONDUCTOR INSPECTING DEVICE 有权

    公开(公告)号：US20220301135A1

    公开(公告)日：2022-09-22

    申请号：US17608857

    申请日：2020-04-16

    Applicant: HAMAMATSU PHOTONICS K.K.

    Inventor： Tomochika TAKESHIMA ,  Takafumi HIGUCHI ,  Kazuhiro HOTTA

    IPC: G06T7/00 ,  G06T3/40 ,  G06T7/30

    Abstract: A semiconductor inspection method by an observation system includes a step of acquiring a first pattern image showing a pattern of a semiconductor device, a step of acquiring a second pattern image showing a pattern of the semiconductor device and having a different resolution from a resolution of the first pattern image, a step of learning a reconstruction process of the second pattern image using the first pattern image as training data by machine learning, and reconstructing the second pattern image into a reconstructed image having a different resolution from a resolution of the second pattern image by the reconstruction process based on a result of the learning, and a step of performing alignment based on a region calculated to have a high degree of certainty by the reconstruction process in the reconstructed image and the first pattern image.

    SEMICONDUCTOR INSPECTION DEVICE AND SEMICONDUCTOR INSPECTION METHOD
    7.
    发明申请
    SEMICONDUCTOR INSPECTION DEVICE AND SEMICONDUCTOR INSPECTION METHOD 有权

    公开(公告)号：US20220301197A1

    公开(公告)日：2022-09-22

    申请号：US17608833

    申请日：2020-04-16

    Applicant: HAMAMATSU PHOTONICS K.K.

    Inventor： Tomochika TAKESHIMA ,  Takafumi HIGUCHI ,  Kazuhiro HOTTA

    IPC: G06T7/30 ,  G06T11/00

    Abstract: An observation system includes a detector that detects light from a semiconductor device and outputs a detection signal, a 2D camera, an optical device that guides light to the detector and the 2D camera, an image processing unit that generates a first optical image of the semiconductor device based on the detection signal and receives an input of a first CAD image, an image analysis unit that learns a conversion process of the first CAD image by machine learning using the first optical image as training data, and converts the first CAD image into a second CAD image resembling the first optical image by the conversion process based on a result of the learning, and an alignment unit that performs alignment based on a second optical image and the second CAD image.

    SEMICONDUCTOR APPARATUS EXAMINATION METHOD AND SEMICONDUCTOR APPARATUS EXAMINATION APPARATUS
    8.
    发明申请
    SEMICONDUCTOR APPARATUS EXAMINATION METHOD AND SEMICONDUCTOR APPARATUS EXAMINATION APPARATUS 有权

    公开(公告)号：US20220221411A1

    公开(公告)日：2022-07-14

    申请号：US17604000

    申请日：2020-04-09

    Applicant: HAMAMATSU PHOTONICS K.K.

    Inventor： Tomochika TAKESHIMA ,  Takafumi HIGUCHI ,  Kazuhiro HOTTA

    IPC: G01N21/95 ,  G01N21/88

    Abstract: A semiconductor apparatus examination method includes a step of acquiring a first interference waveform based on signals from a plurality of drive elements according to light from a first light beam spot including the plurality of drive elements in a semiconductor apparatus, a step of acquiring a second interference waveform based on signals from the plurality of drive elements according to light from a second light beam spot having a region configured to partially overlap the first spot and including the plurality of drive elements, and a step of separating a waveform signal for each of the drive elements in the first and second spots based on the first and second interference waveforms.

    SEMICONDUCTOR DEVICE EXAMINATION METHOD AND SEMICONDUCTOR DEVICE EXAMINATION DEVICE
    9.
    发明申请
    SEMICONDUCTOR DEVICE EXAMINATION METHOD AND SEMICONDUCTOR DEVICE EXAMINATION DEVICE 有权

    公开(公告)号：US20220206063A1

    公开(公告)日：2022-06-30

    申请号：US17606829

    申请日：2020-04-09

    Applicant: HAMAMATSU PHOTONICS K.K.

    Inventor： Tomochika TAKESHIMA ,  Takafumi HIGUCHI ,  Kazuhiro HOTTA

    IPC: G01R31/303

    Abstract: A semiconductor device examination method includes a step of acquiring a first interference waveform based on signals from a plurality of drive elements according to light from a first light beam spot including the plurality of drive elements in a semiconductor device, a step of acquiring a second interference waveform based on signals from the plurality of drive elements according to light from a second light beam spot having a region configured to partially overlap the first spot and including the plurality of drive elements, and a step of separating a waveform signal for each of the drive elements in the first and second spots based on the first and second interference waveforms.

    PHOTON COUNTING DEVICE AND PHOTON COUNTING METHOD
    10.
    发明申请
    PHOTON COUNTING DEVICE AND PHOTON COUNTING METHOD 有权

    公开(公告)号：US20220066055A1

    公开(公告)日：2022-03-03

    申请号：US17501398

    申请日：2021-10-14

    Applicant: HAMAMATSU PHOTONICS K.K.

    Inventor： Tadashi MARUNO ,  Eiji TODA ,  Mao NAKAJIMA ,  Teruo TAKAHASHI ,  Takafumi HIGUCHI

    IPC: G01T1/24 ,  H04N5/3745 ,  H04N5/378 ,  H04N5/374 ,  H04N5/376 ,  H04N5/363 ,  G01T1/208

    Abstract: A photon counting device includes a plurality of pixels each including a photoelectric conversion element configured to convert input light to charge, and an amplifier configured to amplify the charge converted by the photoelectric conversion element and convert the charge to a voltage, an A/D converter configured to convert the voltage output from the amplifier of each of the plurality of pixels to a digital value and output the digital value, a correction unit configured to correct the digital value output from the A/D converter so that an influence of a variation in a gain and an offset value among the plurality of pixels is curbed, a calculation unit configured to output a summed value obtained by summing the corrected digital values corresponding to at least two pixels, and a conversion unit configured to convert the summed value output from the calculation unit to a number of photons.

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