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公开(公告)号：US20160028125A1
公开(公告)日：2016-01-28
申请号：US14842908
申请日：2015-09-02
申请人： HARRIS CORPORATION
IPC分类号： H01M10/0585 , H01M2/20 , H01M10/0525
CPC分类号： H01M10/0585 , H01M2/1066 , H01M2/204 , H01M6/40 , H01M6/48 , H01M10/044 , H01M10/0525 , H01M10/0562 , H01M10/058 , H01M2004/025 , H01M2220/30 , Y10T29/49115
摘要： Methods for fabrication of electronic systems and systems therefrom are provided. An electronic system includes a first substrate (202) having a first surface (202a) and a second substrate (208) having a second surface (208a) facing the first surface. The system also includes a plurality of battery cell layers (106-112) disposed on a plurality of laterally spaced areas on the first and second surfaces (203, 209). In the system, portions of the battery cell layers on the first surface are in physical contact with portions of the battery cell layers on the second surface and the battery cell layers on the first surface and the second surface form a plurality of electrically interconnected battery cells (206, 212) on the first and the second surfaces that are laterally spaced apart and that define one or more batteries
摘要翻译： 提供了制造电子系统及其系统的方法。 电子系统包括具有第一表面（202a）的第一基底（202）和具有面向第一表面的第二表面（208a）的第二基底（208）。 该系统还包括设置在第一和第二表面（203,209）上的多个横向间隔开的区域上的多个电池单元层（106-112）。 在该系统中，第一表面上的电池单元层的部分与第二表面上的电池单元层的部分物理接触，第一表面和第二表面上的电池单元层形成多个电互连电池单元 （206,212）在第一和第二表面上横向间隔开并限定一个或多个电池
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公开(公告)号：US09478494B1
公开(公告)日：2016-10-25
申请号：US14709593
申请日：2015-05-12
申请人： HARRIS CORPORATION
IPC分类号： H01L23/528 , H01L21/768
CPC分类号： H01L23/528 , H01L21/76895 , H01L23/5225 , H01L23/66
摘要： Digital data system disposed on a substrate includes a digital data device and at least one digital data interconnect disposed on the substrate. The digital data interconnect is comprised of a plurality of material layers stacked to form a three-dimensional structure. The material layers form a conductive shield, a plurality of straps which are periodically spaced along an interior length of the shield, and a core which includes one or more conductors. The conductors extends along the length of the tubular form parallel to the opposing walls and are suspended on the straps, separated from the conductive shield by an air gap. First and second conductors of the core can facilitate a differential signaling mode.
摘要翻译： 设置在基板上的数字数据系统包括数字数据装置和设置在基板上的至少一个数字数据互连。 数字数据互连由堆叠形成三维结构的多个材料层组成。 材料层形成导电屏蔽，沿着屏蔽的内部长度周期性间隔开的多个带，以及包括一个或多个导体的芯。 导体沿平行于相对的壁的管状形式的长度延伸并且悬挂在带上，通过气隙与导电屏蔽分开。 核心的第一和第二导体可以促进差分信令模式。
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公开(公告)号：US09437911B1
公开(公告)日：2016-09-06
申请号：US14718765
申请日：2015-05-21
申请人： HARRIS CORPORATION
CPC分类号： H01P3/06 , G02B6/4267 , G02B6/4277 , G02F1/0356 , H01L2924/00 , H01P5/085 , H01P11/005
摘要： Systems (100) and methods (900) for providing a compliant micro-coaxial interconnect with an integrated circuit or other electronic device. The methods comprise: forming a well (108) in a first substrate (102) having a first Coefficient of Thermal Expansion (“CTE”); forming at least one three-dimensional micro-coaxial interconnect (100) on the first substrate so as to have a cantilevered end portion (110) disposed over the well; and using a first coupler (606) to electrically couple the cantilevered end portion to a second substrate (604) having a second CTE different from the first CTE. The cantilevered end portion has an angled joint (302) so that at least one of a pushing force and a pulling force applied thereby to the first coupler is minimized when mismatching movements of the first and second substrates occur.
摘要翻译： 用于向集成电路或其他电子设备提供兼容的微同轴互连的系统（100）和方法（900）。 所述方法包括：在具有第一热膨胀系数（“CTE”）的第一衬底（102）中形成阱（108）; 在所述第一基板上形成至少一个三维微同轴互连（100），以便具有设置在所述阱上的悬臂端部（110）; 并且使用第一耦合器（606）将悬臂端部电耦合到具有不同于第一CTE的第二CTE的第二衬底（604）。 悬臂端部具有成角度的接头（302），使得当第一和第二基板发生不匹配运动时，推动力和由此施加到第一联接器的拉力中的至少一个被最小化。
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公开(公告)号：US09306241B2
公开(公告)日：2016-04-05
申请号：US14842908
申请日：2015-09-02
申请人： HARRIS CORPORATION
IPC分类号： H01M10/0585 , H01M6/40 , H01M6/48 , H01M10/0525 , H01M10/04 , H01M2/20 , H01M10/058 , H01M2/10 , H01M10/0562 , H01M4/02
CPC分类号： H01M10/0585 , H01M2/1066 , H01M2/204 , H01M6/40 , H01M6/48 , H01M10/044 , H01M10/0525 , H01M10/0562 , H01M10/058 , H01M2004/025 , H01M2220/30 , Y10T29/49115
摘要： Methods for fabrication of electronic systems and systems therefrom are provided. An electronic system includes a first substrate (202) having a first surface (202a) and a second substrate (208) having a second surface (208a) facing the first surface. The system also includes a plurality of battery cell layers (106-112) disposed on a plurality of laterally spaced areas on the first and second surfaces (203, 209). In the system, portions of the battery cell layers on the first surface are in physical contact with portions of the battery cell layers on the second surface and the battery cell layers on the first surface and the second surface form a plurality of electrically interconnected battery cells (206, 212) on the first and the second surfaces that are laterally spaced apart and that define one or more batteries.
摘要翻译： 提供了制造电子系统及其系统的方法。 电子系统包括具有第一表面（202a）的第一基底（202）和具有面向第一表面的第二表面（208a）的第二基底（208）。 该系统还包括设置在第一和第二表面（203,209）上的多个横向间隔开的区域上的多个电池单元层（106-112）。 在该系统中，第一表面上的电池单元层的部分与第二表面上的电池单元层的部分物理接触，第一表面和第二表面上的电池单元层形成多个电互连电池单元 （206,212）在第一和第二表面上横向间隔开并限定一个或多个电池。
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公开(公告)号：US20160336263A1
公开(公告)日：2016-11-17
申请号：US14709593
申请日：2015-05-12
申请人： HARRIS CORPORATION
IPC分类号： H01L23/528 , H01L21/768
CPC分类号： H01L23/528 , H01L21/76895 , H01L23/5225 , H01L23/66
摘要： Digital data system disposed on a substrate includes a digital data device and at least one digital data interconnect disposed on the substrate. The digital data interconnect is comprised of a plurality of material layers stacked to form a three-dimensional structure. The material layers form a conductive shield, a plurality of straps which are periodically spaced along an interior length of the shield, and a core which includes one or more conductors. The conductors extends along the length of the tubular form parallel to the opposing walls and are suspended on the straps, separated from the conductive shield by an air gap. First and second conductors of the core can facilitate a differential signaling mode.
摘要翻译： 设置在基板上的数字数据系统包括数字数据装置和设置在基板上的至少一个数字数据互连。 数字数据互连由堆叠形成三维结构的多个材料层组成。 材料层形成导电屏蔽，沿着屏蔽的内部长度周期性间隔开的多个带，以及包括一个或多个导体的芯。 导体沿平行于相对的壁的管状形式的长度延伸并且悬挂在带上，通过气隙与导电屏蔽分开。 核心的第一和第二导体可以促进差分信令模式。
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