Abstract:
A method includes applying a voltage bump across a combined memory device comprising a volatile selector switch and a nonvolatile switch, in which the voltage bump changes a state of the volatile selector switch from a high resistance to a low resistance but does not change a state of the nonvolatile switch. A read voltage that is lower than the voltage bump across the combined memory device to read a state of the nonvolatile switch.
Abstract:
In one example, a system includes a multi-plane memory array with shared crossbars and memory elements accessed through the shared crossbars and support circuitry. The support circuitry includes a bias multiplexer to determine an orientation of a target memory element in the multi-plane memory array and output voltage biases with a polarity based on the orientation of the target memory element. Methods for generating and applying geometry dependent voltage biases are also provided.
Abstract:
In one example, a three dimensional resistive memory architecture includes adjacent memory tiles with each tile including a multilevel resistive crossbar. array and at least one decoder. The multilevel crossbar array includes layers of row crossbars, layers of column crossbars, and layers of resistive memory elements interposed between cross points of the row crossbars and the column crossbars, in which at least one layer of crossbars extends from a first tile through an adjacent tile and is used to address resistive memory elements in the adjacent tile. The at least one decoder underlies the multilevel resistive crossbar array and includes an address matrix comprising digital lines and analog lines, in which the digital lines select which crossbars are connected to the analog lines.
Abstract:
A memory controller includes a voltage control module that operates to isolate a target memristor of a memory crossbar array. The voltage control module applies a column voltage to a column line coupled to the target memristor, applies a first row voltage to all row lines not coupled to the target memristor and a second row voltage to a row line coupled to the target memristor, and senses a current through the target memristor to determine a state of the target memristor. The memory crossbar array includes a plurality of column lines, a plurality of row lines, a plurality of memristors, and a plurality of shorting switches. Each memristor is coupled between a unique combination of one column line and one row line. Each shorting switch has a high impedance resistor and a low impedance transistor, and each shorting switch is coupled to an end of a unique row line.
Abstract:
In one example, a three dimensional resistive memory architecture includes adjacent memory tiles with each tile including a multilevel resistive crossbar array and at least one decoder. The multilevel crossbar array includes layers of row crossbars, layers of column crossbars, and layers of resistive memory elements interposed between cross points of the row crossbars and the column crossbars, in which at least one layer of crossbars extends from a first tile through an adjacent tile and is used to address resistive memory elements in the adjacent tile. The at least one decoder underlies the multilevel resistive crossbar array and includes an address matrix comprising digital lines and analog lines, in which the digital lines select which crossbars are connected to the analog lines.
Abstract:
In one example, a system includes a multi-plane memory array with shared crossbars and memory elements accessed through the shared crossbars and support circuitry. The support circuitry includes a bias multiplexer to determine an orientation of a target memory element in the multi-plane memory array and output voltage biases with a polarity based on the orientation of the target memory element. Methods for generating and applying geometry dependent voltage biases are also provided.
Abstract:
A method includes applying a voltage bump across a combined memory device comprising a volatile selector switch and a nonvolatile switch, in which the voltage bump changes a state of the volatile selector switch from a high resistance to a low resistance but does not change a state of the nonvolatile switch. A read voltage that is lower than the voltage bump across the combined memory device to read a state of the nonvolatile switch.
Abstract:
A memory controller includes a voltage control module that operates to isolate a target memristor of a memory crossbar array. The voltage control module applies a column voltage to a column line coupled to the target memristor, applies a first row voltage to all row lines not coupled to the target memristor and a second row voltage to a row line coupled to the target memristor, and senses a current through the target memristor to determine a state of the target memristor. The memory crossbar array includes a plurality of column lines, a plurality of row lines, a plurality of memristors, and a plurality of shorting switches. Each memristor is coupled between a unique combination of one column line and one row line. Each shorting switch has a high impedance resistor and a low impedance transistor, and each shorting switch is coupled to an end of a unique row line.
Abstract:
A method of switching a memristive device applies a current ramp of a selected polarity to the memristive device. The resistance of the device during the current ramp is monitored. When the resistance of the memristive device reaches the target value, the current ramp is removed.