公开(公告)号：US20180329159A1

公开(公告)日：2018-11-15

申请号：US15546266

申请日：2015-01-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Sagi Varghese MATHAI ,  Wayne Victor SORIN ,  Michael Renne Ty TAN

IPC: G02B6/42 ,  G02B6/38

CPC classification number: G02B6/423 ,  G02B6/3897 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4215 ,  G02B6/4246 ,  G02B6/4259 ,  G02B6/4269 ,  G02B6/4274

Abstract: Optical modules are disclosed. An example optical module includes a substrate comprising a grating coupler, an optical connector removably coupled to the substrate adjacent the grating coupler to optically couple the optical connector and the grating coupler and an integrated circuit coupled to the substrate.

公开(公告)号：US20180233881A1

公开(公告)日：2018-08-16

申请号：US15750833

申请日：2015-08-10

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Sagi MATHAI ,  Michael Renne Ty TAN ,  Wayne Victor SORIN

IPC: H01S5/187 ,  H01S5/183 ,  H01S5/042

CPC classification number: H01S5/18377 ,  H01S5/0421 ,  H01S5/18305 ,  H01S5/18313 ,  H01S5/18341 ,  H01S5/18355 ,  H01S5/18369 ,  H01S5/18375 ,  H01S5/18394 ,  H01S5/187 ,  H01S5/343 ,  H01S2304/02 ,  H01S2304/04

Abstract: In example implementations of a vertical-cavity surface-emitting laser (VCSEL), the VCSEL includes a p-type distributed Bragg reflector (p-DBR) layer end a p-type ohmic (p-ohmic) contact layer adjacent to the p-DBR layer. The p DBR layer may include an oxide aperture and the p-ohmic contact layer may have an opening that is aligned with the oxide aperture. The opening may be filled with a dielectric material. A metal layer may be coupled to the p-ohmic contact layer and encapsulate the dielectric material.

公开(公告)号：US20210399522A1

公开(公告)日：2021-12-23

申请号：US16909991

申请日：2020-06-23

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Stanley CHEUNG ,  Michael Renne Ty TAN ,  Binhao WANG ,  Wayne Victor SORIN ,  Chao-Kun LIN

IPC: H01S5/14 ,  H01S5/0687 ,  H01S5/10 ,  H01S5/183

Abstract: Coupled-cavity vertical cavity surface emitting lasers (VCSELs) are provided by the present disclosure. The coupled-cavity VCSEL can comprise a VCSEL having a first mirror, a gain medium disposed above the first mirror, and a second mirror disposed above the gain medium, wherein a first cavity is formed by the first mirror and the second mirror. A second cavity is optically coupled to the VCSEL and configured to reflect light emitted from the VCSEL back into the first cavity of the VCSEL. In some embodiments, the second cavity can be an external cavity optically coupled to the VCSEL through a coupling component. In some embodiments, the second cavity can be integrated with the VCSEL to form a monolithic coupled-cavity VCSEL. A feedback circuit can control operation of the coupled-cavity VCSEL so the output comprises a target high frequency signal.

公开(公告)号：US20250036932A1

公开(公告)日：2025-01-30

申请号：US18359540

申请日：2023-07-26

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： YUAN YUAN ,  Xian XIAO ,  Yiwei PENG ,  Wayne Victor SORIN ,  Stanley CHEUNG ,  Zhihong HUANG

IPC: G06N3/067 ,  G02F1/21

Abstract: Systems and methods are provided for performing element-wise multi-vector multiplication. An example includes a waveguide to receive an input optical signal encoded with a first vector and output an output optical signal. One or more optical-to-electrical (O/E) converters are provided to receive one or more optical signals encoded with one or more vectors and generate one or more electrical signals based on the received one or more optical signals. One or more optical modulators are optically coupled to the waveguide and electrically coupled to the one or more O/E converters, the one or more optical modulators modulate an intensity of the input optical signal on the waveguide based on the one or more electrical signals. The output optical signal is encoded with a product of the first vector and the one or more vectors.

公开(公告)号：US20230283396A1

公开(公告)日：2023-09-07

申请号：US17687406

申请日：2022-03-04

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： SAGI VARGHESE MATHAI ,  Michael Renne ty TAN ,  Wayne Victor SORIN

IPC: H04J14/02

CPC classification number: H04J14/0227 ,  H04J14/0278

Abstract: Systems and methods are provided for achieving graceful bandwidth scaling (i.e. higher data transmission rates) for Coarse Wavelength Division Multiplexing (CWDM) and CWDM-4 technologies. Examples utilize a waveband architecture built around the CWDM wavelengths. This waveband architecture adds additional wavelength transmission channels (which may equate to faster data transmission rates) while maintaining backwards compatibility with existing CWDM/CWDM-4 technologies. Examples may include waveband devices (e.g. waveband light sources, waveband transmitters, waveband receivers, waveband transceivers, etc.) designed to operate with one or more CWDM wavebands while maintaining backwards compatibility with existing CWDM-4 technologies.

公开(公告)号：US20170315299A1

公开(公告)日：2017-11-02

申请号：US15522228

申请日：2014-10-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Sagi Varghese MATHAI ,  Michael Renne Ty TAN ,  Wayne Victor SORIN

IPC: G02B6/30 ,  G02B6/34 ,  G02B6/42 ,  H01L23/00 ,  G02B6/32

CPC classification number: G02B6/30 ,  G02B6/32 ,  G02B6/34 ,  G02B6/4208 ,  G02B6/423 ,  G02B6/4267 ,  G02B6/4269 ,  G02B6/428 ,  G02B6/4292 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2924/15311 ,  H01L2924/19

Abstract: A silicon photonic (SiPh) packaging assembly includes a SiPh interposer and a wafer. The SiPh interposer has one or more optical gratings disposed thereon to couple an optical signal traversing the wafer. The wafer is bonded to the interposer, with the wafer including one or more microlenses, each microlens aligned with a respective optical grating and designed to direct the optical signal traversing the wafer at a desired angle.