公开(公告)号：US20160315448A1

公开(公告)日：2016-10-27

申请号：US15107486

申请日：2014-01-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP

Inventor： Paul Kessler Rosenberg ,  Michael Renee Ty Tan ,  Sagi Varghese Mathai

IPC: H01S5/024 ,  H01S5/40 ,  H01S5/022 ,  H01L23/498 ,  H01L23/367

CPC classification number: H01S5/02476 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/49805 ,  H01L23/49827 ,  H01L2224/06181 ,  H01L2224/33181 ,  H01S5/02248 ,  H01S5/02469 ,  H01S5/4025

Abstract: A device can include an active optical device (AOD) to at least one of transmit and receive optical signals. The device can also include an interposer having the AOD mounted thereon. The interposer can be in thermal contact with a heat sink and the interposer is mounted on a substrate. The interposer can be formed of a thermally conductive and electrically insulating material. The interposer can include a via to electrically couple the AOD to another electrical device.

Abstract translation: 设备可以包括到发射和接收光信号中的至少一个的有源光学设备（AOD）。 该装置还可以包括其上安装有AOD的插入器。 插入器可以与散热器热接触，并且插入器安装在基板上。 插入件可以由导热和电绝缘材料形成。 插入器可以包括通孔以将AOD电耦合到另一电气设备。

公开(公告)号：US20150325527A1

公开(公告)日：2015-11-12

申请号：US14764005

申请日：2013-01-28

Applicant: Hewlett-Packard Development Company, LP.

Inventor： Paul Kessler Rosenberg ,  Michael Tan ,  Sagi Mathai

IPC: H01L23/544 ,  H01L21/82 ,  H01L25/00 ,  H01L21/3213

CPC classification number: H01L23/544 ,  G02B6/4231 ,  H01L21/32136 ,  H01L21/82 ,  H01L24/81 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/81139 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/10252 ,  H01L2924/10253

Abstract: A method includes growing a substrate material that includes an integrated circuit. The method includes forming an alignment post on the substrate material and forming a radiused top portion on the alignment post to enable alignment of a connector to the substrate material.

Abstract translation: 一种方法包括生长包括集成电路的衬底材料。 该方法包括在衬底材料上形成对准柱并在对准柱上形成圆弧顶部部分，以使连接器能够对准衬底材料。