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8 条记录 (耗时 0.015 秒)

    Medium-frequency transformer with dry core
    2.
    发明授权
    Medium-frequency transformer with dry core 有权

    公开(公告)号：US11557428B2

    公开(公告)日：2023-01-17

    申请号：US16537868

    申请日：2019-08-12

    申请人： HITACHI ENERGY SWITZERLAND AG

    发明人： Lise Donzel ,  Rudi Velthuis ,  Thomas Gradinger ,  Felix Greuter

    IPC分类号： H01F27/02 ,  H01F27/32 ,  H01F27/24 ,  H01F27/28

    摘要： A transformer is provided, which includes a tank having an enclosed volume with an insulating material, the tank including at least one channel extending through the tank, wherein the interior of the at least one channel is separated from the enclosed volume of the tank by a channel wall. A transformer core is provided outside of the enclosed volume, including at least one core leg extending through the tank via the at least one channel. At least one coil is located inside the enclosed volume, the coil being wound about the at least one channel, the tank has an inner wall or outer wall including a weakly-conductive layer, which includes fibers embedded in an impregnating material.

    Arrangement Comprising a Baseplate for a Power Semiconductor Module and a Cooler
    3.
    发明申请
    Arrangement Comprising a Baseplate for a Power Semiconductor Module and a Cooler 有权

    公开(公告)号：US20220262707A1

    公开(公告)日：2022-08-18

    申请号：US17629904

    申请日：2020-07-24

    申请人： Hitachi Energy Switzerland AG

    发明人： Thomas Gradinger ,  Milad Maleki ,  Daniele Torresin

    IPC分类号： H01L23/473

    摘要： An apparatus includes a baseplate and a cooler providing a cooling channel adapted for providing a coolant flow. An electronic circuit includes a power semiconductor device disposed at the first side of baseplate. A footprint of the power semiconductor device defines a device area on the first side. A cooling area at the second side of the baseplate opposite the device area is adapted for dissipating heat from the baseplate by bringing the cooling area into thermal contact with the coolant flow in the cooling channel. An auxiliary area is located on the second side of the baseplate adjacent to the cooling area. The auxiliary area includes a flow guide for reducing a flow rate of the coolant flow in the auxiliary area and the cooling channel is adapted to receive the cooling area and the flow guide.

    Power Semiconductor Module and Method of Forming the Same
    4.
    发明申请
    Power Semiconductor Module and Method of Forming the Same 有权

    公开(公告)号：US20220254654A1

    公开(公告)日：2022-08-11

    申请号：US17630091

    申请日：2020-07-23

    申请人： Hitachi Energy Switzerland AG

    发明人： Daniele Torresin ,  Thomas Gradinger ,  Juergen Schuderer

    IPC分类号： H01L21/48 ,  H01L23/473 ,  H01L23/367

    摘要： One embodiment provides a method of providing a power semiconductor module with a cooler. A power semiconductor module includes a substrate having a first substrate side for carrying at least one electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side is connected to a first baseplate side and the baseplate also includes a second baseplate side being located opposite to its first baseplate side and being adapted for coming in contact with the cooler. The cooler includes a first casing component and a second casing component. The baseplate side is equipped with a cooling area that is surrounded by a connecting area.

    Power semiconductor module and method of forming the same
    5.
    发明授权
    Power semiconductor module and method of forming the same 有权

    公开(公告)号：US11562911B2

    公开(公告)日：2023-01-24

    申请号：US17630091

    申请日：2020-07-23

    申请人： Hitachi Energy Switzerland AG

    发明人： Daniele Torresin ,  Thomas Gradinger ,  Juergen Schuderer

    IPC分类号： H01L21/48 ,  H01L23/367 ,  H01L23/473 ,  H01L23/10

    摘要： One embodiment provides a method of providing a power semiconductor module with a cooler. A power semiconductor module includes a substrate having a first substrate side for carrying at least one electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side is connected to a first baseplate side and the baseplate also includes a second baseplate side being located opposite to its first baseplate side and being adapted for coming in contact with the cooler. The cooler includes a first casing component and a second casing component. The baseplate side is equipped with a cooling area that is surrounded by a connecting area.

    Arrangement of a Power Semiconductor Module and a Cooler
    6.
    发明申请
    Arrangement of a Power Semiconductor Module and a Cooler 有权

    公开(公告)号：US20220254653A1

    公开(公告)日：2022-08-11

    申请号：US17630080

    申请日：2020-07-24

    申请人： Hitachi Energy Switzerland AG

    发明人： Daniele Torresin ,  Fabian Mohn ,  Bruno Agostini ,  Thomas Gradinger ,  Juergen Schuderer

    IPC分类号： H01L21/48 ,  H01L23/473 ,  H01L23/367

    摘要： In one embodiment a power semiconductor module includes a substrate having a first substrate side for carrying an electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side has a flat surface and is adapted for coming in contact with a cooler. A cooling area that is surrounded by a connecting area is located at the second substrate side. A first casing component of the cooler is connected to the second substrate side at the connecting area and a second casing component is connected to the first casing component such that a cooling channel for providing the cooling area with cooling fluid is provided between the first casing component and the second casing component. A cooling structure can be welded to the cooling area at the second substrate side.