公开(公告)号：US20160071687A1

公开(公告)日：2016-03-10

申请号：US14786446

申请日：2014-04-11

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Miki TSUCHIYA ,  Yasuhira NAGAKUBO ,  Satoshi TOMIMATSU

IPC: H01J37/20 ,  G01N1/42 ,  B25J7/00 ,  H01J37/28 ,  H01J37/30

CPC classification number: H01J37/20 ,  B25J7/00 ,  G01N1/42 ,  G01N2001/2873 ,  H01J37/28 ,  H01J37/30 ,  H01J37/302 ,  H01J37/304 ,  H01J37/3056 ,  H01J2237/002 ,  H01J2237/2001 ,  H01J2237/2007 ,  H01J2237/202 ,  H01J2237/208 ,  H01J2237/2801 ,  H01J2237/30461 ,  H01J2237/31745 ,  H01J2237/31749

Abstract: The present invention enables a sample to be observed in a clean state directly after preparation of a final observation surface when preparing a sample for observing a material that is sensitive to heat. The present invention is a method of preparing a sample using a charged particle beam device including a microprobe having a cooling mechanism, a first sample holder having a mechanism for retaining a sample in a cooled state, and a stage into which the microprobe and the first sample holder can be introduced, the method including cutting a bulk-shaped sample piece from the sample on the first sample holder retained in a cooled state; adhering the sample piece to a distal end of the microprobe that is cooled to a fixed temperature and transferring the sample piece to a second sample holder for thin film observation retained in a cooled state, which is different from the first sample holder, within a vacuum chamber of the charged particle beam device; separating the sample piece that has been transferred to the second sample holder from the microprobe and thin film processing the sample piece to a thickness that is less than the thickness during cutting; and observing the sample piece after the thin film processing.

Abstract translation: 本发明使得在制备用于观察对热敏感的材料的样品时，在制备最终观察表面之后，可以直接在清洁状态下观察样品。 本发明是一种使用带电粒子束装置制备样品的方法，所述带电粒子束装置包括具有冷却机构的微探针，具有用于将样品保持在冷却状态的机构的第一样品保持器和所述微探针和第一 可以引入样品保持器，该方法包括从保持在冷却状态的第一样品保持器上的样品切割块状样品; 将样品块粘附到被冷却到固定温度的微探针的远端，并将样品片转移到第二样品保持器以进行薄膜观察，在与真空中的第一样品保持器不同的冷却状态下保持 带电粒子束装置的腔室; 将从所述微探针转移到所述第二样品保持器的样品片和将所述样品片处理的薄膜分离成小于切割时的厚度的厚度; 并在薄膜处理后观察样品。