公开(公告)号：US3873171A

公开(公告)日：1975-03-25

申请号：US36540473

申请日：1973-05-31

Applicant: HITACHI LTD

Inventor： MIYAMOTO AKIO ,  KOYAMA MASAHARU ,  ODAKA TOYOKAZU ,  OTSUKA KANJI ,  MURAKAMI GEN

IPC: G09F9/313 ,  H01J17/49 ,  H01J9/38

CPC classification number: H01J17/491

Abstract: A multiple-digit display device comprising an electrode substrate in which a plurality of sets of cathodes of a desired pattern constituting a plurality of display sections respectively and a plurality of sets of anodes associated with the plural sets of cathodes respectively are multilevel-printed on a dielectric substrate through dielectric layers, and a front plate provided on the electrode substrate so as to form a plurality of discharge spaces on the plural display sections, and a method of manufacturing the multiple-digit display device.

Abstract translation: 一种多位显示装置，包括电极基板，其中分别构成多个显示部分的期望图案的多组阴极和与多组阴极相关联的多组阳极分别多层印刷在 通过电介质层的电介质基板和设置在电极基板上的前板，以在多个显示部分上形成多个放电空间，以及制造多位显示装置的方法。

公开(公告)号：US5295297B1

公开(公告)日：1996-11-26

申请号：US91549692

申请日：1992-07-20

Applicant: HITACHI LTD

Inventor： KITAMURA WAHEI ,  MURAKAMI GEN ,  NISHI KUNIHIKO

IPC: B32B27/08 ,  B65D79/02 ,  B65D81/26 ,  H01L21/00 ,  H01L21/673 ,  H01L23/31 ,  H01L23/495 ,  H05K13/00 ,  H01R43/00

CPC classification number: B32B27/08 ,  B65D79/02 ,  B65D81/266 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49506 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48839 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/8592 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20753 ,  H05K13/0084 ,  Y10T29/49121 ,  Y10T29/49146 ,  Y10T29/49178 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：US6443298B2

公开(公告)日：2002-09-03

申请号：US84393701

申请日：2001-04-30

Applicant: HITACHI LTD

Inventor： KITAMURA WAHEI ,  MURAKAMI GEN ,  NISHI KUNIHIKO

IPC: B32B27/08 ,  B65D79/02 ,  B65D81/26 ,  H01L21/00 ,  H01L21/673 ,  H01L23/31 ,  H01L23/495 ,  H05K13/00 ,  B65D73/02

CPC classification number: B32B27/08 ,  B32B27/18 ,  B32B27/304 ,  B32B27/32 ,  B32B2307/7246 ,  B32B2311/24 ,  B32B2323/04 ,  B32B2327/06 ,  B32B2439/00 ,  B65D79/02 ,  B65D81/266 ,  H01L21/67121 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49506 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20753 ,  H05K13/0084 ,  Y10S174/08 ,  Y10S428/922 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: In surface packaging of thin resin packages such as surface mount resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are sealed, by heat-sealing, in a bag moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging. The devices are packaged in a moisture-proofing bag made of a laminate film, and a desiccant is sealed, by heat-sealing the bag, in the moisture-proofing bag together with the, e.g., surface mount semiconductor device having a plastic package encapsulating the semiconductor device. A caution is provided for the bag, that the devices should be presented from moisture absorption after opening the bag.

Abstract translation: 在诸如表面贴装树脂模制存储器IC等的薄树脂封装的表面封装中，由于树脂在包装之前吸收了水分，所以在焊料回流步骤中经常发生热冲击作用于封装的封装裂纹。 为了解决这个问题，这些装置在树脂模制装置的树脂干燥的组装步骤中通过热封在袋子中被密封地密封，并且在执行表面之前从袋子中取出 打包。 将装置包装在由层压膜制成的防潮袋中，并且通过将防潮袋热封在防潮袋中，并与例如具有塑料封装的表面贴装半导体装置密封干燥剂 半导体器件。 袋子要小心，打开袋子后，装置应该被吸湿。

公开(公告)号：US3873169A

公开(公告)日：1975-03-25

申请号：US36544073

申请日：1973-05-31

Applicant: HITACHI LTD

Inventor： MIYAMOTO AKIO ,  KOYAMA MASAHARU ,  ODAKA TOYOKAZU ,  OTSUKA KANJI ,  MURAKAMI GEN

IPC: H01J17/49 ,  H01J9/38

CPC classification number: H01J17/491

Abstract: A multiple-digit display device comprising a cathode substrate in which a plurality of sets of cathodes of a desired pattern constituting a plurality of display sections respectively and wires for the cathodes are multilevel-printed on a dielectric substrate through dielectric layers, and a front plate having a plurality of transparent anodes and provided on the cathode substrate so as to form a plurality of discharge spaces on the respective display sections, and a method of manufacturing the multiple-digit display device.

Abstract translation: 一种多位显示装置，包括阴极基板，其中分别构成多个显示部分的所需图案的多组阴极和阴极的电线通过电介质层多层印刷在电介质基板上，并且前板 具有多个透明阳极，并且设置在阴极基板上，以便在各个显示部分上形成多个放电空间，以及制造多位数显示装置的方法。