公开(公告)号：US20150076320A1

公开(公告)日：2015-03-19

申请号：US14387512

申请日：2013-03-25

Applicant: HOYA CORPORATION

Inventor： Takashi Fushie ,  Hajime Kikuchi ,  Fuyuki Tokanai

IPC: H01J43/04

CPC classification number: H01J43/04 ,  G01T1/185 ,  H01J43/246 ,  H01J47/02

Abstract: An electronic multiplier porous glass plate used for a detector that measures ionized electrons by utilizing an electron avalanche multiplication in a gas is presented. The plate has a plurality of through holes provided on a plate-like member so as to be arranged two-dimensionally, wherein the plate-like member is formed by a photosensitive crystallized glass obtained by crystallizing a photosensitive glass, to realize a thinner glass plate and finer through holes.

Abstract translation: 提出了一种用于通过利用气体中的电子雪崩倍增来测量电离电子的检测器的电子倍增器多孔玻璃板。 板具有设置在板状构件上的多个通孔，以便二维地布置，其中板状构件由通过使感光玻璃结晶获得的感光结晶玻璃形成，以实现更薄的玻璃板 和更细的通孔。

公开(公告)号：US09232652B2

公开(公告)日：2016-01-05

申请号：US13624448

申请日：2012-09-21

Applicant: HOYA CORPORATION

Inventor： Takashi Fushie ,  Hajime Kikuchi

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K1/03 ,  H05K3/38

CPC classification number: H05K1/115 ,  H05K1/0306 ,  H05K3/0017 ,  H05K3/002 ,  H05K3/0023 ,  H05K3/0029 ,  H05K3/381 ,  H05K3/423 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/2072 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T428/24273

Abstract: There is provided that a substrate comprising a glass substrate 2 constituted by a glass including a silicon oxide. The glass substrate has a through-hole 3 communicating with a front surface and a rear surface of the glass substrate, and filled with a metal material. The substrate is realized by forming an anchor part by selectively etching a silicon oxide on a sidewall surrounding an inside of said through-hole 3 before filling the metal material and by filling the inside of said through-hole 3 with the metal material after forming the anchor part.

Abstract translation: 提供了包括由包含氧化硅的玻璃构成的玻璃基板2的基板。 玻璃基板具有与玻璃基板的前表面和后表面连通并且填充有金属材料的通孔3。 通过在填充金属材料之前通过选择性地蚀刻围绕所述通孔3的内侧的侧壁上的氧化硅并且在形成所述金属材料之后用所述金属材料填充所述通孔3的内部来形成所述基板 主体部分。

公开(公告)号：US20150115992A1

公开(公告)日：2015-04-30

申请号：US14405964

申请日：2013-02-28

Applicant: HOYA CORPORATION

Inventor： Takashi Fushie ,  Hajime Kikuchi

IPC: C03C15/00 ,  G01R31/12 ,  H01J47/00 ,  H01J43/04

CPC classification number: C03C15/00 ,  G01R31/1227 ,  G01T1/2935 ,  H01J43/04 ,  H01J43/246 ,  H01J47/001 ,  Y10T428/24273

Abstract: There is provided a glass substrate for electronic amplification having through holes formed on a plate-like glass member and used for causing an electron avalanche in the through holes, wherein a shape of the glass substrate for electronic amplification and a material of the glass member are determined so that an insulation resistance in a plate thickness direction per plane of 100 cm2 is 107 to 1011Ω.

Abstract translation: 提供了一种用于电子放大的玻璃基板，其具有形成在板状玻璃构件上的通孔，用于在通孔中引起电子雪崩，其中用于电子放大的玻璃基板和玻璃构件的材料的形状为 使得每100平方厘米的平板厚度方向的绝缘电阻为107〜1011Ω。

公开(公告)号：US09245814B2

公开(公告)日：2016-01-26

申请号：US14209419

申请日：2014-03-13

Applicant: HOYA CORPORATION

Inventor： Takashi Fushie ,  Kunihiko Ueno ,  Hajime Kikuchi

IPC: H01L21/48 ,  H01L23/15 ,  G03F7/00 ,  H01L23/498 ,  H01L21/56

CPC classification number: H01L23/15 ,  G03F7/00 ,  H01L21/4871 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49833 ,  H01L2924/0002 ,  Y10T428/24942 ,  H01L2924/00

Abstract: A substrate assembly including a photosensitive etching glass substrate; and a first substrate and a second substrate for interposing both main surfaces of the photosensitive etching glass substrate between them. One of the main surfaces of the photosensitive etching glass substrate is thermally bonded to the first substrate, and the other main surface of the photosensitive etching glass substrate is bonded to the second substrate. When a thermal expansion coefficient of the photosensitive etching glass substrate is defined as C0, and a thermal expansion coefficient of the first substrate is defined as C1, and a thermal expansion coefficient of the second substrate is defined as C2, C1/C2 satisfies a relation of 0.7 or more and 1.3 or less, and at least one of a relation of C0/C1 satisfying less than 0.7 or larger than 1.3, and a relation of C0/C2 satisfying less than 0.7 or larger than 1.3 is satisfied.

Abstract translation: 一种基板组件，包括光敏蚀刻玻璃基板; 以及用于将感光蚀刻玻璃基板的两个主表面插入它们之间的第一基板和第二基板。 感光蚀刻用玻璃基板的主表面之一与第一基板热粘接，感光蚀刻用玻璃基板的另一主面与第二基板接合。 当感光蚀刻玻璃基板的热膨胀系数定义为C0，将第一基板的热膨胀系数定义为C1，将第二基板的热膨胀系数定义为C2时，C1 / C2满足关系 为0.7以上且1.3以下，并且满足小于0.7或大于1.3的C 0 / C的关系和满足小于0.7或大于1.3的C 0 / C 2的关系中的至少一个。